CN103551756A - Sn-Ag-Cu system lead-free soldering paste - Google Patents
Sn-Ag-Cu system lead-free soldering paste Download PDFInfo
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- CN103551756A CN103551756A CN201310559100.3A CN201310559100A CN103551756A CN 103551756 A CN103551756 A CN 103551756A CN 201310559100 A CN201310559100 A CN 201310559100A CN 103551756 A CN103551756 A CN 103551756A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a Sn-Ag-Cu system lead-free soldering paste, which is characterized by comprising 5-45% (mass) of maleated rosin soldering flux and solder alloy powder mixed with soldering flux, wherein the powder comprises Sn, Ag and 1-8% (mass) of Sb; the solder alloy powder comprises 1.0-4.0% (mass) of Ag, 0.4-1.0% (mass) of Cu, 1-8% (mass) of Sb and the balance of Sn. The solder alloy powder also comprises one of nickel, cobalt and iron, and the total content is lower than 0.5% (mass). The soldering flux comprises more than one kind of haloid acid of which the content is larger than 0-2% (mass), and the use level of organohalogen compound is 0-3% (mass). The Sn-Ag-Cu system lead-free soldering paste has the beneficial effects that the cleaning is avoided, the soldering paste cannot easily change as time goes on, and the soldering paste is suitable for being used for a longer period.
Description
Technical field
The present invention relates to a kind of solder(ing) paste for welding electronic equipment, particularly a kind of leadless soldering tin paste.
Background technology
As everyone knows, the welding method for electronic component comprises with flatiron welding, flow soldering, reflow soldering etc.With flatiron welding, be this kind of welding method wherein, solder flux cored silk is placed into welding portion, then with flatiron, solder stick is heated and makes its fusing.But while welding with flatiron welding, disposable certain part is welded, so it has the problem of productivity ratio, and be not suitable for producing in enormous quantities.And in flow soldering method, the face of weld of printed circuit board (PCB) contacts with fusion welding, so that weld.Its good productivity ratio is, whole printed circuit board (PCB) can weld by single operation.Yet, in flow soldering method, between electronic unit, there is narrow-pitch, can form a bridge, wherein scolder is crossed over these parts and is attached to this, and fusion welding directly contacts with electronic unit.When electronic unit has lower heat resistance, electronic component can suffer fire damage sometimes, and can cause function to worsen.In addition, if by attaching parts, as connector, be installed on the face of weld of printed circuit board (PCB), have such problem, fusion welding can penetrate in the hole of connector, will again can not use afterwards.Then, Reflow Soldering connection is a kind of like this method, in the method, by printing or some glue is applied to the solder(ing) paste that contains solder powder and solder flux the needed position of printed circuit board (PCB), and electronic unit install to the part that applies solder(ing) paste.Then solder(ing) paste is melted in as reflow ovens at heater, with by welding electronic elements to printed circuit board (PCB).In reflow soldering method, the welding of a plurality of positions that not only can carry out in an operation, even and between electronic unit, there is thin space, also need not carry out bridge joint, and scolder can not adhere to unnecessary position, thereby can there is the welding of good productivity ratio and reliability.In recent years, the miniaturization of electronic equipment, in continuous progress, is arranged on being dwindled by component size on printed circuit board (PCB).Therefore, too tiny and can not constantly increase by the printed circuit board (PCB) quantity of flow soldering, and the conventional flow soldering of using also gradates as reflow soldering.The solder(ing) paste using in past reflow soldering method, solder powder is wherein Pb-Sn solder powder always.The fusing point of this Pb-Sn alloy is 183 ℃, has eutectic composition (Pb-63Sn).Even if having on the electronic component that heat resistance is low, it also has some heat insulation effects.It also has good solderability, so its advantage is seldom to produce weld defect, for example weld part or dry not.When the electronics with the welding of solder(ing) paste and terne metal wear or break down, can be not its renewal or maintenance not be abandoned.When printed circuit board (PCB) is abandoned, should take the method for disposal of burying rather than burning.With the mode of burying process be because scolder be metallicity adhere on the Copper Foil of printed circuit board (PCB), therefore can not be by Copper Foil separated with scolder and reuse them.If the printed circuit board (PCB) of processing by the mode of burying contact acid rain, the lead in scolder can be dissolved out, and polluted underground water.If the mankind or livestock drink leaded underground water for a long time, they may suffer lead poisoning.Therefore, electronic equipment industry is badly in need of wanting this so-called plumbous so-called lead-free solder that do not contain.
Summary of the invention
The object of the present invention is to provide a kind of Sn-Ag-Cu series lead-free soldering tin cream, in order to solve above-mentioned existing issue.
Technical scheme of the present invention is as follows: a kind of Sn-Ag-Cu series lead-free soldering tin cream, it is characterized in that: Sn-Ag-Cu series lead-free soldering tin cream includes 5 ~ 45%(quality) solder flux of maleic rosin and the solder alloy powder mixing with solder flux, wherein this powder packets is containing Sn, Ag and 1 ~ 8%(quality) Sb; Solder alloy powder contains 1.0 4.0%(quality) Ag, 0.4 1.0%(quality) Cu, 1 ~ 8%(quality) Sb and surplus Sn.
In solder alloy powder, also comprise nickel, a kind of in cobalt and iron, total content is lower than 0.5%(quality).
Solder flux can include more than one halogen acids, and its content is for being greater than 0% ~ 2%(quality), and the consumption of organohalogen compound is 0% ~ 3%(quality).
The invention has the beneficial effects as follows: can exempt to clean, and As time goes on, solder(ing) paste can not change easily, and there is long working life.
The specific embodiment
In conjunction with instantiation, the present invention is described in further detail.
Sn-Ag-Cu series lead-free soldering tin cream of the present invention, it is characterized in that: Sn-Ag-Cu series lead-free soldering tin cream includes 5 ~ 45%(quality) solder flux of maleic rosin and the solder alloy powder mixing with solder flux, wherein this powder packets is containing Sn, Ag and 1 ~ 8%(quality) Sb; Solder alloy powder contains 1.0 4.0%(quality) Ag, 0.4 1.0%(quality) Cu, 1 ~ 8%(quality) Sb and surplus Sn.In solder alloy powder, also comprise nickel, a kind of in cobalt and iron, total content is lower than 0.5%(quality).Solder flux can include more than one halogen acids, and its content is for being greater than 0% ~ 2%(quality), and the consumption of organohalogen compound is 0% ~ 3%(quality).
Along with electronic equipment becomes less, the position that is welded on printed circuit board (PCB) becomes thinner.But the installing space between substrate becomes less, and the cleaning of printed circuit board (PCB) becomes difficult.Therefore, conventionally with exempting to clean solder(ing) paste, rather than the water miscible solder(ing) paste cleaning that needs is installed top printed circuit board (PCB).
When carrying out installing without the printed circuit board (PCB) cleaning, solder(ing) paste will meet three requirements.
First, the flux residue after backflow must not be clamminess.If the flux residue on printed circuit board (PCB) is clamminess after refluxing, airborne dust or dirt can be attached in flux residue, cause sometimes insulation defect, as leaked.
Secondly, the color of the flux residue after refluxing on printed circuit board (PCB) should be lighter, not outstanding.Need to meet second requirement, the flux residue after refluxing has compared with weak color and should approach transparently, and its reason is, in the end, in a step, carry out visual examination to welding portion.If the color of flux residue is very dark, be easy to the observation that just makes a mistake, when user is when printed circuit board (PCB) is observed in maintenance, if the color is too dark for it, can be shown to the poor image effect of user.
The 3rd requirement is that flux residue should have the good adaptation with machine silicon rosin or acrylic compounds rosin.This is because at the printed circuit board (PCB) for electronic unit, can carry out conformal coating with silicon rosin or acrylic acid rosin.
Lead-free solder be take Sn as main component, and current used lead-free solder is bianry alloy, if Sn-3.SAg(fusing point is 221 ℃), Sn-0.7Cu(fusing point is 2270 ℃), Sn-9Zn(fusing point is 1990 ℃) and Sn-58Bi(fusing point be 1390 ℃), and those are suitably added with element in the 3rd, as Ag, Cu, Zn, Al, Bi, In, Sb, Ni, Cr, Co, Fe, Mn, P, Ge and Ga.In the present invention, " being " refers to that alloy itself or a kind of alloy, based on a kind of bianry alloy, are wherein at least added with a kind of additional elements.For example, Sn-Zn is associated the Sn-Zn alloy itself that gold refers to or is at least added with a kind of above-mentioned additional elements to the alloy of Sn-Zn.Sn-Ag is associated gold to be Sn-Ag alloy itself or to be at least added with a kind of to above-mentioned additional elements to the alloy of Sn-Ag.In these lead-free solders, a kind of Sn-Ag is solder composition, and particularly Sn-Ag-Cu is that solder composition is the most widely used at present, and adding 0.5 1.0% Cu to Sn-Ag is solder composition.Because from the reliability of the thermal circulation performance of the scolder of the fusion temperature of scolder, this solder composition is very convenient.The applicant discloses a kind of Sn-Ag-Cu series lead-free solder of being made by alloy, and its composition comprises and be greater than 3.0%, and in 5.0%(weight) Ag, 0.5-3.0%(weight) Cu, all the other are Sn.And the welding portion of its formation has excellent thermal fatigue property.A kind of Sn-Ag-Cu-Sb series lead-free solder also contains quality and mostly is 5% Sb most.Yet different from traditional Sn-Pb scolder, lead-free solder, as Sn-Ag-Cu series lead-free solder, does not comprise the lead with solder flux with hypoergia, so itself and solder flux have high response.Therefore solder(ing) paste that, this lead-free solder is made needs a kind of and solder powder to have the special solder flux for lead-free solder of hypoergia.
The Sn-Pb scolder that lead-free solder is as traditional in Sn-Ag-Cu series lead-free solder is different from, because they do not comprise the lead with solder flux with hypoergia, so the reactivity of itself and flux component is very high.Therefore, the solder(ing) paste of lead-free solder needs a kind of special solder flux for lead-free solder, and itself and solder powder have hypoergia.Maleic rosin is the rosin in transparent color, and its excellent specific property is to have high softening-point, and the flux residue after refluxing is inviscid.But it has higher acid number, and if for the solder flux of lead-free solder, solder powder and rosin react, and solder(ing) paste changes in time, can increase at an easy rate its viscosity, and can shorten the working life of solder(ing) paste.
Therefore, object of the present invention is to find a kind of solder powder for solder(ing) paste.As time goes on, even if its uses and take the main rosin that maleic rosin is solder flux, the variation in this solder powder is also little.After backflow, also can produce the transparent non-sticky residue with high softening-point.It is found that, by the solder flux that contains the maleic rosin that at least quality is 5% is mixed with Sn-Ag-Cu series lead-free solder powder, can form solder(ing) paste.By adding tin that quality is 1-8% in Sn-Ag-Cu series lead-free solder powder, the reaction between solder powder and the solder flux that contains maleic rosin is suppressed, thereby realizes solder(ing) paste long pot life.
The solder(ing) paste using in reflow soldering and the solder powder of almost identical volume and mix mutually for the solder flux of solder(ing) paste, therefore using as rosin can be called as the solder(ing) paste of the solder flux of main component is rosin series solder(ing) paste.That uses water-soluble rosin can be called water-soluble scolder.Use water-soluble scolder, if after refluxing by residue cleaning, residue is easy to absorb moisture, and the active component in residue react with water, ionization, causes corroding, and causes the insulaion resistance decline of printed circuit board (PCB).In contrast, use rosin series solder flux, the rosin in residue can prevent from absorbing moisture after refluxing, and it does not react with the active component of residue.Therefore, even if rosin series solder(ing) paste does not also clean, it can not produce corrosion yet, or causes the insulaion resistance of printed circuit board (PCB) to decline.The character of rosin series solder(ing) paste residue is that major part is to be determined by rosin components, and this composition is solids ratios maximum in the solder flux of solder(ing) paste.
Rosin is a kind of pine tree juice or similar natural rosin taken from.It is mainly used for the gluing of papermaking, and the raw material of conduct paint and printing-ink.Natural rosin is a kind of organic acid mixture in rosin acid etc., but when it is used as to papermaking rubber coating, during the raw material of coating or ink, in order to suppress the adherence of rosin, can usually replace this organic acid that is included in as the two keys in rosin acid, so it does not have the adherence of natural rosin with hydrogen or other yuan.Such rosin is called a kind of artificial synthetic rosin.Synthetic rosin comprises newtrex, phenol modified rosin, maleinization rosin (maleic acid modified rosin) and Foral.The characteristic of maleinization rosin and Foral be their color be connect diaphanous.
Yet when using rosin as the part of welding solder flux, in order to prevent viscosity, if usually replace organic acid as the two keys in rosin acid with hydrogen or other yuan, the solderability of rosin itself is eliminated.In addition, if usually replace organic acid as two keys all in rosin acid with hydrogen or other yuan, resulting rosin can not be dissolved in alcoholic solvent or the solder flux glycol ether series solvent for solder(ing) paste again, and rosin sediment and scolder all can not form.Therefore, when using rosin as welding solder flux a part of, be necessary to avoid replacing all organic acids that are included in as the two keys in rosin acid, and will stay partly and remain unchanged.
In synthetic rosin, Foral has a transparent outward appearance, and does not have viscosity, so it meets this two requirements of exempting to clean solder(ing) paste, after refluxing, the color of flux residue is very light light, connects diaphanous color, and the flux residue after refluxing is that tool is not sticking.Yet, with hydrogen, replaces and be included in organic acid as the two keys in rosin acid, thereby Foral is at alcoholic solvent, in glycol ether series solvent or similar solvent dissolubility variation.Therefore, if a large amount of Forals are added in the solder flux of solder(ing) paste, it will be precipitated out from solder(ing) paste, and be easy to change along with passage of time.Therefore, to need quality be 20% of solder(ing) paste solder flux to the addition of Foral.Even in this case, adding also of Foral can improve outward appearance, but solderability meeting variation, therefore, this content is preferably at most 5%(quality).
In contrast, maleic rosin is a kind of by rosin and the maleic anhydride artificial synthetic rosin that reacts to each other.Maleic anhydride key towards acid as the two keys in rosin acid, so be not that all two keys are replaced with to maleic anhydride, and organic acid as in rosin acid pair be bonded to rear reservation.Therefore, it has high acid value and good solderability.In addition, with respect to the softening point of approximately 80 ℃ of artificial synthetic rosin, the softening point of maleic rosin reaches the high value of 130 ℃, and the residue after therefore refluxing is that tool is not sticking.
Yet problem is, as the acid number of the newtrex of typical solder(ing) paste solder flux rosin composition be about 160(milligram KOH/gram), the acid number of two maleic rosins is very high, for 230(milligram KOH/gram) left and right.Therefore, maleic rosin has such shortcoming, is easy to react with solder powder.In transparent rosin, Foral have low acid number be 10(milligram KOH/gram), the reactivity of itself and solder powder is very low, but it has the problem that solderability is low.In this manner, when using maleinization rosin as lead-free solder solder flux, even if it has transparent appearance and inviscid, its acid number height can cause the defect that can not add in a large number maleinization rosin.So it meets two requirements, the flux residue color after refluxing approaches transparent and inviscid.
The present invention is based on the reactivity with the solder powder of solder(ing) paste solder flux, by selecting the composition of solder alloy, suppressed the reaction between solder powder and solder flux.By adding quality, be that the Sb of 2-10% is that scolder or Sn-Ag-Cu are in scolder to Sn-Ag, the abietate of Sn is that solder powder or Sn-Ag-Cu form in the reaction between solder powder at Sn-Ag, and the reaction between solder powder and the solder flux that contains maleic rosin is suppressed.This is considered to due to SbO
2or Ag
3snSb has relatively low reactivity, thereby the reaction between solder powder and maleic rosin is that solder powder or Sn-Ag-Cu become on solder powder surface slowly at Sn-Ag, although SbO
2or Ag
3snSb etc. also can be formed on solder powder surface.In conventional leadless soldering tin paste, even if attempt to use maleic rosin as the rosin for leadless soldering tin paste, because it has higher acid number, so the reaction of solder powder and rosin, and cause the variation of solder(ing) paste.Viscosity can be easy to increase, and also can shorten the working life of solder(ing) paste.
Therefore say that the solder(ing) paste of the application of the invention can be obtained the flux residue with advantageous property.The color of the flux residue on printed circuit board (PCB) after Reflow Soldering is transparent, and unobvious, and the flux residue after Reflow Soldering is also inviscid.In addition, it has excellent effect, and As time goes on, solder(ing) paste can not change easily, and has long working life.
Below to enumerate most preferred embodiment of the present invention:
According to the present invention, if the Sb content of Sn-Ag-Sb alloy powder or Sn-Ag-Cu-Sb series alloy powder is for being less than 1%(quality), maleic rosin can not produce inhibitory action affects reaction.And if Sb content is to be greater than 8%(quality) time, solder wettability, it,, as an advantage of Sn-Ag scolder or Sn-Ag-Cu serial alloy welding material, will weaken.Therefore, according to the present invention, add the Sb of Sn-Ag solder powder or Sn-Ag-C u solder powder to measure preferred 1-8%(quality), 2-5%(quality more preferably).
According to the present invention, Sn-Ag-Sb alloy powder or Sn-Ag-Cu are associated between Ag in gold-Sb alloy powder and Cu content and the reactivity of maleic rosin does not have direct relation.Therefore,, according to the present invention, from technical standpoint, there is no need to limit the content of Ag and Cu in Sn-Ag-Sn alloy powder or Sn-Ag-Cu-Sn series alloy powder.Can select Ag is 1.0 4.0%(quality), Cu is 0.4 1.0% (quality), thereby a kind of scolder with superior tensile strength and creep-resistant property is provided.More preferably, Ag is 3.0 4.0%(quality), Cu is 0.5-0.7%(quality).In addition, if at least add a kind of transition metal as nickel, cobalt, iron etc., its total amount is at most 0.5%(quality), and can observe improved braze alloy composition intensity.
According to the present invention, in the solder flux of solder(ing) paste, maleic rosin content is at least the 5%(quality of solder flux), be at most 45%(quality).If in the solder flux of solder(ing) paste, the content of maleic rosin is less than 5%(quality), use conventional Sn-Ag alloy powder or Sn-Ag-Cu series alloy powder, As time goes on can there is not what yet and change in solder(ing) paste, and need to not add antimony Sb especially.If maleic rosin surpasses 45%(quality in the solder flux of solder(ing) paste), even if use in Sn-Ag-Sb alloy powder or Sn-Ag-Cu-Sn series alloy powder, passing in time can not suppress to change.Therefore, according to the present invention, preferably in the solder flux of solder(ing) paste, the content of maleic rosin is 5%(quality at least), 45%(quality at the most).5%(quality at least more preferably), be at most 20%(quality).
By adding Sn to traditional Sn-Ag alloy powder or Sn-Ag-Cu series alloy powder, in the solder flux of solder(ing) paste, contain maleic rosin, thereby the present invention has realized this solder(ing) paste along with passage of time with long pot life and little variation.Under the effect of maleic rosin, its reactivity is low.
Therefore, preferably limit that component content having with solder powder high response, except maleic rosin.It is halogenation hydrogen salt that these in solder flux have with solder powder high response composition, as diphenylguanidine hydrobromic acid.According to the present invention, in solder flux, halogenation hydrogen salt preferred content is the 2%(quality that is less than solder flux).If the content of hydrohalogenation salt is less than 2%(quality in solder flux), even if add Sb, the reaction between alloy powder and solder flux also can continue to carry out, thereby effect of the present invention does not just realize.In the present invention, can be added into and mostly be 3%(quality) organohalogen compound, as HBCD, as coactivator.
Example 1 is according to the present invention and comparative example, in the example of this solder flux, is to use maleic rosin, and newtrex, prepared by Foral and phenol-modified rosin.The method of manufacturing solder flux is to add rosin in solvent, heats, so that rosin fusing.Then stop heating, and be cooled to approximately 100 ℃.When the temperature of liquid reaches approximately 100 ° of C, add thixotropic agent fusing, then add again activator, and stirring makes its dissolving.After all material all dissolves, by water-cooled or etc. the type of cooling solder flux is solidified.
Example 2 is that Sn-Ag is the solder flux ratio mixing of preparation in solder powder and example 1, to prepare solder(ing) paste.The solder flux content of each solder(ing) paste is a reference value 10.5%(quality), and can adjust the content of solder flux, until viscosity is 200 handkerchief left and right per second.Each solder(ing) paste is at room temperature placed one day, then measures its viscosity.In addition, each solder(ing) paste is preserved 60 days in one arranges the storeroom of steady temperature of 25 ℃, then measures its viscosity.The variation that can As time goes on occur each solder(ing) paste compares, and definite working life.
example 3 is that wetability and the color 2 of the solder(ing) paste residue to producing in example 2 compares.The temperature of measuring scolder bath is 250+3 ℃.The color of solder(ing) paste residue is to be determined by printed solder paste.Printing is used be thickness be the metal mask of 0.2 millimeter and diameter be 6.5 millimeters hole at the tough copper coin that is measured as 5.0 millimeters * 10.0 millimeters * 0.5 millimeter, after then refluxing, at the temperature of 250+3 ℃, use scolder to bathe.The color of flux residue can compare after cooling.
Sum up above-mentioned, the solder powder of alloy have at least add 1%(quality) Sb to Sn-Ag alloy or Sn-Ag-Cu, be associated in gold, thereby can suppress viscosity when using maleic rosin, change.Yet, when Sb content is less than 1%(quality) time, it can not suppress the variation of viscosity, and surpasses 8%(quality when the interpolation of Sb) time, the wetability of solder(ing) paste will be suppressed.In addition, according to the present invention, if maleic rosin surpasses 45%(quality in solder(ing) paste) time, even if add antimony, the viscosity of solder(ing) paste changes can not be suppressed.According to the present invention, in solder(ing) paste, appropriate maleic rosin is at least 5%(quality), 45%(quality at the most).
certainly, according to the present invention, this solder(ing) paste is not limited to Sn-Ag alloy or Sn-Ag-Cu is associated gold, it not only can be applied to Sn-Ag alloy or Sn-Ag-Cu and be associated golden leadless soldering tin paste, also can apply to and add the Sn-Ag alloy of Bi or In or Sn-Ag-Cu to be associated in gold, there is stronger industrial applicibility.
Claims (3)
1. a Sn-Ag-Cu series lead-free soldering tin cream, is characterized in that:
Sn-Ag-Cu series lead-free soldering tin cream includes 5 ~ 45%(quality) solder flux of maleic rosin and the solder alloy powder mixing with solder flux, wherein this powder packets is containing Sn, Ag and 1 ~ 8%(quality) Sb;
Solder alloy powder contains 1.0 4.0%(quality) Ag, 0.4 1.0%(quality) Cu, 1 ~ 8%(quality) Sb and surplus Sn.
2. Sn-Ag-Cu series lead-free soldering tin cream according to claim 1, is characterized in that: in solder alloy powder, also comprise nickel, and a kind of in cobalt and iron, total content is lower than 0.5%(quality).
3. Sn-Ag-Cu series lead-free soldering tin cream according to claim 1, is characterized in that: solder flux can include more than one halogen acids, and its content is for being greater than 0% ~ 2%(quality), and the consumption of organohalogen compound is 0% ~ 3%(quality).
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| CN201310559100.3A CN103551756A (en) | 2013-11-12 | 2013-11-12 | Sn-Ag-Cu system lead-free soldering paste |
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| CN201310559100.3A CN103551756A (en) | 2013-11-12 | 2013-11-12 | Sn-Ag-Cu system lead-free soldering paste |
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Cited By (5)
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| CN105142856A (en) * | 2013-04-02 | 2015-12-09 | 千住金属工业株式会社 | Lead-free solder alloy and in-vehicle electronic circuit |
| CN106132612A (en) * | 2014-10-17 | 2016-11-16 | 富士电机株式会社 | Leadless soft soldering method and solder article |
| CN107427968A (en) * | 2015-09-17 | 2017-12-01 | 富士电机株式会社 | Semiconductor device solderable material |
| CN111902238A (en) * | 2018-03-30 | 2020-11-06 | 千住金属工业株式会社 | Solder paste |
| CN113163620A (en) * | 2021-03-25 | 2021-07-23 | 深圳市科美通科技有限公司 | SMT surface mounting technology for PCBA mainboard processing |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105142856A (en) * | 2013-04-02 | 2015-12-09 | 千住金属工业株式会社 | Lead-free solder alloy and in-vehicle electronic circuit |
| CN106132612A (en) * | 2014-10-17 | 2016-11-16 | 富士电机株式会社 | Leadless soft soldering method and solder article |
| US10002845B2 (en) | 2014-10-17 | 2018-06-19 | Fuji Electric Co., Ltd. | Lead-free soldering method and soldered article |
| CN107427968A (en) * | 2015-09-17 | 2017-12-01 | 富士电机株式会社 | Semiconductor device solderable material |
| US20180033761A1 (en) * | 2015-09-17 | 2018-02-01 | Fuji Electric Co., Ltd. | Solder material for semiconductor device |
| US10727194B2 (en) | 2015-09-17 | 2020-07-28 | Fuji Electric Co., Ltd. | Solder material for semiconductor device |
| US11145615B2 (en) | 2015-09-17 | 2021-10-12 | Fuji Electric Co., Ltd. | Solder material for semiconductor device |
| CN111902238A (en) * | 2018-03-30 | 2020-11-06 | 千住金属工业株式会社 | Solder paste |
| US11633815B2 (en) | 2018-03-30 | 2023-04-25 | Senju Metal Industry Co., Ltd. | Solder paste |
| CN113163620A (en) * | 2021-03-25 | 2021-07-23 | 深圳市科美通科技有限公司 | SMT surface mounting technology for PCBA mainboard processing |
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Application publication date: 20140205 |