CN102513720B - High-performance tin-based solder alloy and preparation method thereof - Google Patents
High-performance tin-based solder alloy and preparation method thereof Download PDFInfo
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- CN102513720B CN102513720B CN201110437617.6A CN201110437617A CN102513720B CN 102513720 B CN102513720 B CN 102513720B CN 201110437617 A CN201110437617 A CN 201110437617A CN 102513720 B CN102513720 B CN 102513720B
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Abstract
The invention discloses high-performance tin-based solder alloy, which comprises a tin-based solder body, refractory hard dispersion strengthening phase particles and 0.01wt%-2wt% of doped elements, wherein the doped elements include one or multiple of Fe, Ni, Y, Ag, Ti, Zr, Hf and Sb. Due to the added doped elements, interface bonding property between the tin-based solder body and the refractory hard dispersion strengthening phase particles is improved, aggregation of the strengthening phase particles in remelting is reduced, and the mechanical property is improved accordingly. The invention further discloses a preparation method of the high-performance tin-based solder alloy, which combines the powder metallurgy preparation process with the ultrasonic-assistant casting process so that the strengthening phase particles are high in dispersion and uniform in distribution, solves the problem that the strengthening phase particles are difficult to be added when in use of the ultrasonic-assistant casting process individually, the mechanical property of the tin-based solder alloy is improved, and the performance of the solder can keep stable basically after the solder is remelted.
Description
Technical field
The present invention relates to a kind of tin-based solder alloy, especially a kind of high-performance granule reinforced tin base solder alloy.The invention still further relates to the preparation method of high-performance tin-based solder alloy.
Background technology
Along with electronic product is to the developing rapidly of volume microminiaturization and function integrated direction, make them to the reliability of existing encapsulating material, propose requirements at the higher level.Particle strengthens very promising a kind of electronic package material that solder is considered to improve solder performance at present, by add hard infusibility second-phase (as pottery and refractory metal particle) in solder matrix, can realize and under the less prerequisite that affects solder fusing point and toughness, increase substantially the intensity of solder and effective serviceability temperature interval.
For general particle strengthens alloy, the key of its performance boost is reduce as far as possible to strengthen the particle diameter of particle and allow them be uniformly distributed in metallic matrix.Yet for particle strengthens solder, owing to also needing the remelting through different temperatures and time when reality is used, so its to particulates reinforcements, the stability in molten solder has proposed higher requirement.Avoid particulates reinforcements in molten solder, to occur to reunite and separated be the key point of raising composite soldering welding spot reliability.When composite soldering remelting, the reunion of particulates reinforcements is relevant with the interfacial combined function of porosity in the particle diameter of wild phase, solder and wild phase and solder matrix, particle diameter is less, porosity is higher, interfacial combined function is poorer, and particulates reinforcements is more easily reunited in molten solder.The separation that particle strengthens is mainly subject to the impact of wild phase density and particle diameter, and concrete pass is: the separating rate of wild phase is directly proportional to the difference of wild phase and solder matrix density, is inversely proportional to the particle diameter square of wild phase.For the nano-particle reinforcement phase distributing for even dispersion, it is very slow that the separating rate of wild phase will become, and when common solder reflow welding, the separation of nano-particle reinforcement phase almost can be ignored.Yet, in solder, exist bubble or solder and wild phase binding ability poor, nanometer reinforcing phase will very easily be reunited, and accelerate the separation of wild phase.
Mechanical alloying method and powder metallurgy process are conventional particles reiforced metal-base composition preparation methods, adopt its enhancing particle of composite prepared by this kind of method can reach the good spread, yet composite soldering porosity prepared by the method is high, in the reflow process of solder, pore in molten solder will promote dimension to receive the reunion of particulates reinforcements, and reduces the strengthening effect of particulates reinforcements; In addition, the wild phase after reunion is separated by more easily occurring in the liquid solder of melting, thus the strengthening effect of the wild phase of further decaying.Moreover, because ceramic enhancement phase generally has lower interfacial combined function, for the tin-based solder alloy of low melting point, such as: the tinbase series alloys such as Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Pb, Sn-Bi and Sn-Zn, be difficult to improve the binding ability between brazing filler metal alloy and wild phase by the method for mechanical alloying, and this also will cause the reunion of wild phase.
Adopt the method for ultrasonic auxiliary light-alloy casting to have more research and report, ultrasonic by continuing in alloy graining process, ultrasonic cavitation and liquid stream stirring action can play good uniform formation, Grain refinement; In addition, while containing not molten second-phase in molten alloy, ultrasonicly not only can make second-phase dispersion be uniformly distributed, can also promote soaking between liquid matrix and molten second-phase, make not melt second-phase and when alloy melting, play the effect of nucleating agent, crystal grain thinning also strengthens alloy mechanical property.For tin-based solder alloy, because this alloy has larger density (about 6.5g/cm
3), and lower (the about 3.5g/cm of conventional particulates reinforcements density
3), therefore even if there is ultrasonic or mechanical assistance to stir in the process of solder melting, be also difficult to enough wild phases to join in solder matrix.Just because of this, not yet find that there is people at present and adopt ultrasonic auxiliary method to prepare granule reinforced tin base solder alloy, also fail to obtain the tin-based solder alloy that in the time of overcoming brazing filler metal alloy remelting, particulates reinforcements is reunited, mechanical property is improved significantly.
Summary of the invention
The problem existing for solving above-mentioned prior art, the invention provides a kind of high-performance tin-based solder alloy, mechanical property and decay resistance that this tin-based solder alloy tool is significantly improved.The present invention also provides the preparation method of high-performance tin-based solder alloy.
The technical solution adopted in the present invention is: a kind of high-performance tin-based solder alloy, comprise tin-based solder matrix and infusibility hard dispersion-strengtherning phase, described high-performance tin-based solder alloy also comprises that weight percentage is 0.01%～2% doped chemical, and described doped chemical is one or more in Fe, Ni, Y, Ag, Ti, Zr, Hf, Sb.
Preferably, the dispersion-strengtherning of described infusibility hard is SiC, TiO mutually
2, ZrO
2, Y
2o
3, MgO, Al
2o
3, TiB
2, CNTs(CNT, as follows) and Cu
6sn
5in one or more, its weight percentage is 0.02%～2%.
Preferably, described tin-based solder matrix is Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Pb, Sn-Bi or Sn-Zn alloy.
The method of preparation of the present invention high-performance tin-based solder as above alloy, the tin-based solder that wherein forms described tin-based solder matrix comprises tin-based solder powder or is no less than the tin-based solder powder of tin-based solder matrix weight 10% and the as cast condition tin-based solder of remaining weight, and described preparation method comprises the following step carrying out successively:
A1, described tin-based solder powder, infusibility hard dispersion-strengtherning phase powder and doped chemical powder and ethanol and/or brazing flux are mixed and made into pulpous state or paste mixture;
A2, prepared pulpous state or paste mixture are placed in to vacuum drying at 50 ℃～100 ℃, then under 400MPa～700MPa pressure, cold moudling obtains composite alloy piece;
A3, as cast condition tin-based solder, composite alloy piece are placed in to container are melted into melt completely, and make melt temperature higher than 10 ℃～200 ℃ of the liquidus temperatures of described tin-based solder;
A4, melt is applied to ultrasonic vibration 1～20 time, each ultrasonic vibration time is 5～300 seconds, when applying twice, is 5～60 seconds ultrasonic interval time when above, and then cast molding obtains high-performance tin-based solder alloy.
As further improvement, the mixing in described steps A 1 adopts ball-milling method, and milling atmosphere is Ar, and ratio of grinding media to material is 5: 1～20: 1, and rotating speed is 100rpm～300rmp, and Ball-milling Time is 1～10 hour; Or directly adopt craft or mechanical agitation to mix, mixing time is 5～60 minutes.
As further improvement, while applying ultrasonic vibration in described steps A 4, ultrasonic amplitude transformer is stretched into and in melt, directly put on melt, or ultrasonic amplitude transformer is applied to ultrasonic vibration in container side or bottom.
As further improvement, when the tin-based solder of the described tin-based solder matrix of formation comprises as cast condition tin-based solder, described steps A 3 comprises step by step following: first make the fusing completely in container of as cast condition tin-based solder, and then add composite alloy piece to make it to melt.
As further improvement, the average grain diameter of described infusibility hard dispersion-strengtherning phase powder is 30～2000nm, more preferably 60～1000nm; The average grain diameter of described tin-based solder powder is 1～500 μ m, more preferably 1～200 μ m.
In addition, under preparation method's of the present invention design, a kind of preparation method who does not contain the high-performance tin-based solder alloy of doped chemical is also provided, described high-performance tin-based solder alloy comprises the infusibility hard dispersion-strengtherning phase that tin-based solder matrix and weight percentage are 0.02%～2%, described tin-based solder matrix is Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Pb, Sn-Bi or Sn-Zn alloy, and the dispersion-strengtherning of described infusibility hard is SiC, TiO mutually
2, ZrO
2, Y
2o
3, MgO, Al
2o
3, TiB
2, CNTs and Cu
6sn
5in one or more, the tin-based solder that forms described tin-based solder matrix comprises tin-based solder powder or is no less than the tin-based solder powder of tin-based solder matrix weight 10% and the as cast condition tin-based solder of remaining weight, and described preparation method comprises the following step carrying out successively:
B1, described tin-based solder powder and infusibility hard dispersion-strengtherning phase powder and ethanol and/or brazing flux are mixed and made into pulpous state or paste mixture;
B2, prepared pulpous state or paste mixture are placed in to vacuum drying at 50 ℃～100 ℃, then under 400MPa～700MPa pressure, cold moudling obtains composite alloy piece;
B3, as cast condition tin-based solder, composite alloy piece are placed in to container are melted into melt completely, and make melt temperature higher than 10 ℃～200 ℃ of the liquidus temperatures of described tin-based solder;
B4, melt is applied to ultrasonic vibration 1～20 time, each ultrasonic vibration time is 5～300 seconds, and be 5～60 seconds ultrasonic interval time, and then cast molding obtains high-performance tin-based solder alloy.
High-performance tin-based solder alloy of the present invention adds by doping phase, has improved the interfacial combined function between tin-based solder matrix and particulates reinforcements, reduce the reunion of particulates reinforcements when remelting, thereby mechanical property is improved; In addition the phase of adulterating add the decay resistance that has also improved tin-based solder alloy.
The preparation method of high-performance tin-based solder alloy of the present invention is uniformly distributed particulates reinforcements, doped chemical highly dispersed powder metallurgy preparation process and ultrasonic auxiliary fusion-casting process combination; The method that powder metallurgy combines with ultrasonication has also overcome the problem that the ultrasonic casting method of simple employing is difficult to add particulates reinforcements, has realized the preparation that contains larger mass percent particulates reinforcements composite soldering; Cavitation ultrasonic when solder melting can be adsorbed the air film at Nano-size Reinforced Particle interface thoroughly, thereby promotes the distribution of particulates reinforcements, and promotion interface soaks the carrying out with interfacial reaction; Avoided tin-based solder alloy particulates reinforcements in follow-up remelting is used again to occur to reunite and avoided the existence of field trash in solder, thereby improved mechanical property and the decay resistance of tin-based solder alloy, and its performance kept stable after solder reflow.
The specific embodiment
Below in conjunction with embodiment, the present invention is elaborated, by these embodiment, can further be well understood to the present invention.But they are not limitation of the invention.
Preferred high-performance tin-based solder alloy of the present invention, comprise the doped chemical that tin-based solder matrix and infusibility hard dispersion-strengtherning phase and weight percentage are 0.01%～2%, doped chemical is selected from one or more in Fe, Ni, Y, Ag, Ti, Zr, Hf, Sb; The dispersion-strengtherning of infusibility hard is selected from SiC, TiO mutually
2, ZrO
2, Y
2o
3, MgO, Al
2o
3, TiB
2, CNTs and Cu
6sn
5in one or more, its weight percentage is 0.02%～2%; Tin-based solder matrix is Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Pb, Sn-Bi or Sn-Zn alloy.The preferred content of doped chemical is 0.05～0.5%, and the preferred content of infusibility hard dispersion-strengtherning phase is 0.1～1%.
Can prepare through the following steps high-performance tin-based solder alloy, the tin-based solder that wherein forms tin-based solder matrix can be all tin-based solder powder, or not only use tin-based solder powder but also use as cast condition tin-based solder, but the consumption of tin-based solder powder is no less than 10% of tin-based solder matrix weight.The following step carries out successively:
(1), tin-based solder powder, infusibility hard dispersion-strengtherning phase powder and doped chemical powder and ethanol and/or brazing flux are mixed and made into pulpous state or paste mixture; Wherein the average grain diameter of infusibility hard dispersion-strengtherning phase powder is preferably 30～2000nm, more preferably 60～1000nm; The average grain diameter of tin-based solder powder is preferably 1～500 μ m, 1～200 μ m more preferably, and the particle diameter of doped chemical powder does not have special requirement; Brazing flux does not have special requirement, adopts general product, and the consumption of ethanol and brazing flux is also not particularly limited, and cubing is mixed powder 1/10 ~ 1/5 for good; The method of mixing does not have special requirement yet, for example, adopt ball-milling method, and milling atmosphere is Ar, and ratio of grinding media to material is 5: 1～20: 1, and rotating speed is 100rpm～300rmp, and Ball-milling Time is 1～10 hour; Or directly adopt craft or mechanical agitation to mix, mixing time is 5～60 minutes.
(2), prepared pulpous state or paste mixture are placed in to vacuum drying at 50 ℃～100 ℃, remove volatile matter, then under 400MPa～700MPa pressure, cold moudling obtains composite alloy piece;
(3), as cast condition tin-based solder, composite alloy piece be placed in to container be melted into melt completely, and make melt temperature higher than 10 ℃～200 ℃ of the liquidus temperatures of tin-based solder; When tin-based solder comprises as cast condition tin-based solder, preferred method is first to make the fusing completely in container of as cast condition tin-based solder, and then add composite alloy piece to make it to melt to obtain melt, can prevent composite alloy piece over oxidation in melting process of cold moudling; Container used can be selected titanium alloy tin pot.
(4), ultrasonic amplitude transformer is stretched in melt, the degree of depth that immerses melt is preferably 5～50mm, after preheating 3～10s, start ultrasonic vibration, after ultrasonic vibration certain hour, stop vibration and extract ultrasonic amplitude transformer in molten solder, after pause certain hour, again ultrasonic amplitude transformer is stretched in molten solder, after preheating, restart ultrasonic vibration, melt is applied to ultrasonic vibration 1～20 time, each ultrasonic vibration time is 5～300 seconds, and be 5～60 seconds ultrasonic interval time; Preferred parameter is: supersonic frequency 15～70KHz,, ultrasonic power value and the ratio that is applied melt volume of input is 5～200W/cm
3, 10～150 microns of ultrasonic amplitudes; Ultrasonic amplitude transformer can not stretch in melt yet, but acts on container side or bottom, by container is applied to ultrasonic vibration, then by container by ultrasonic indirect transfer to melt.After ultrasonication finishes, melt cast molding is obtained to high-performance tin-based solder alloy.
In the process of step (3) and (4), all in vacuum or inert gas, as under argon gas atmosphere, implement, to avoiding the oxidation of alloy, be favourable.
Preparation method's step is not used doped chemical in (1), and other conditions and step are constant, can make the high-performance tin-based solder alloy that does not contain doped chemical.
embodiment 1
This example material used is: particle diameter is about the Sn-3.0Ag-0.5Cu(SAC305 of 2 μ m) tin-based solder powder, pure titanium metal powder and the particle diameter SiC powder that is 60nm.Tin pot material is pure titanium, is of a size of: 38mm * 35mm, in practical operation, once molten tin amount is 200g.Ultrasonic amplitude transformer material is titanium alloy (Ti-6Al-4V), and ultrasonic power is 1000W, and the ultrasonic vibration time is 120 seconds, and supersonic frequency is 20KHz, and the degree of depth that ultrasonic amplitude transformer immerses in molten solder is 5mm.
Get SAC305 solder powder 199.4g, SiC powder 0.4g and pure titanium metal powder 0.2g, above-mentioned powder is poured into and in ball grinder, carried out ball milling.Ratio of grinding media to material is 5:1, and ball grinder and Material quality of grinding balls are zirconia, and ball-milling medium is the mixed liquor of brazing flux and alcohol, and milling protection atmosphere is Ar, and Ball-milling Time is 1h, and rotational speed of ball-mill is 200rpm.After the good paste mixture of ball milling is taken out, in vacuum drying chamber, dry, by cold pressing forming process, powder is pressed into the composite alloy piece that average quality is 40g subsequently.
The above-mentioned composite alloy piece that is 200g by gross mass is put into pure tin tin pot, by tin stove, will quickly heat up to 300 ℃ and keep constant temperature, makes composite alloy piece be fused into melt completely; Ultrasonic amplitude transformer is stretched in melt, and preheating was opened ultrasonic vibration after 5 seconds.Until ultrasonic vibration, after 250 seconds, finish ultrasonic vibration and ultrasonic amplitude transformer extracted, take out simultaneously pure tin pot by melt cast in punching block, so far complete the preparation of tin-based solder alloy.Said process all completes under Ar protective atmosphere.
SEM characterization result shows, tiny, the size homogeneous of microscopic structure particle in this tin-based solder alloy, be evenly distributed, and after uniform temperature remelting this tissue kept stable.Solder fusing point and micro-hardness testing result show: the fusing point of this novel brazing filler metal alloy is 217.2 ℃, suitable with common SAC305 fusing point (218 ℃); The average hardness of novel brazing filler metal alloy is 23.27HV, compares normal solder hardness (16.32HV), and this novel brazing filler metal alloy hardness has improved 42.59%.
embodiment 2
This example material used is: Sn-0.3Ag-0.7Cu casting alloy bar, Hf powder, particle diameter are about the Sn-0.3Ag-0.7Cu brazing filler metal alloy powder of 10 μ m and the ZrO that particle diameter is about 1 μ m
2powder.Tin pot material is pure titanium, is of a size of: 38mm * 35mm, in practical operation, once molten tin amount is 200g.Ultrasonic amplitude transformer material is titanium alloy (Ti-6Al-4V), and ultrasonic power is 1200W, and supersonic frequency is 20KHz, and the degree of depth that ultrasonic amplitude transformer immerses in molten solder is 5mm.
Get 97.8 grams, Sn-0.3Ag-0.7Cu solder powder, ZrO
20.2 gram, powder 2g and Hf powder (oil immersion Hf powder, weighs after vacuum drying), will carry out ball milling in above-mentioned importing ball grinder.Ratio of grinding media to material is 10:1, and ball grinder and Material quality of grinding balls are zirconia, and ball-milling medium is the mixed liquor of brazing flux and alcohol, and milling protection atmosphere is Ar, and Ball-milling Time is 2h, and rotational speed of ball-mill is 200rpm.After the good solder powder of ball milling is taken out, in vacuum drying chamber, dry, by cold pressing forming process, powder is pressed into the composite alloy piece that 5 average qualities are 20g subsequently.
The Sn-0.3Ag-0.7Cu casting alloy bar that is 100g by quality is put into pure tin tin pot, by tin stove, solder is heated to 280 ℃ and keep constant temperature, and now solder is in molten condition; The 100g composite alloy piece that adopts powder metallurgy process to make is inserted in molten solder, ultrasonic amplitude transformer is stretched in molten solder simultaneously, preheating was opened ultrasonic vibration after 5 seconds, the ultrasonic vibration time is 200 seconds, after finishing, vibration extracts ultrasonic amplitude transformer by molten solder standing 10 seconds, again ultrasonic amplitude transformer stretched in solder subsequently and open ultrasonic vibration, following step is consistent with ultrasonication for the first time, so has altogether reciprocal 3 times.After ultrasonication for the third time finishes, ultrasonic amplitude transformer is extracted, taken out pure tin pot simultaneously molten solder is cast in punching block, so far complete the preparation of high-performance tin-based solder alloy.Said process all completes under Ar protective atmosphere.
This tin-based solder alloy is carried out to micro-hardness testing, and result shows: the average hardness of novel solder is 25.67HV, compares normal solder hardness (14.61HV), and this novel solder hardness has improved 75.7%.
embodiment 3
This example material used is: Sn-0.3Ag-0.7Cu casting alloy bar, Ti powder, particle diameter be about the Sn-0.3Ag-0.7Cu solder powder of 10 μ m and average caliber for and length be respectively multi-walled carbon nano-tubes (CNTs) powder of 10nm and 10 μ m.Tin pot material is pure titanium, is of a size of: 38mm * 35mm, in practical operation, once molten tin amount is 200g.Ultrasonic amplitude transformer material is titanium alloy (Ti-6Al-4V), and ultrasonic power is 1200W, and supersonic frequency is 20KHz, and the degree of depth that ultrasonic amplitude transformer immerses in molten solder is 5mm.
Get 0.4 gram, 198.6 grams of Sn-0.3Ag-0.7Cu solder powders, 1 gram, CNTs powder and Ti powder, above-mentioned powder is poured into and in ball grinder, carried out ball milling.Ratio of grinding media to material is 10:1, and ball grinder and Material quality of grinding balls are zirconia, and ball-milling medium is the mixed liquor of brazing flux and alcohol, and milling protection atmosphere is Ar, and Ball-milling Time is 2h, and rotational speed of ball-mill is 200rpm.After the good solder powder of ball milling is taken out, in vacuum drying chamber, dry, by cold pressing forming process, powder is pressed into the composite alloy piece that average quality is 40g subsequently.
The above-mentioned composite alloy piece that is 200g by gross mass is put into pure tin tin pot, quickly heats up to 260 ℃ and keep constant temperature, and now composite alloy piece is in molten condition; Ultrasonic amplitude transformer is stretched in melt, preheating was opened ultrasonic vibration after 5 seconds, the ultrasonic vibration time is 30 seconds, after finishing, vibration extracts ultrasonic amplitude transformer by melt standing 5 seconds, again ultrasonic amplitude transformer stretched in melt subsequently and open ultrasonic vibration, following step is consistent with ultrasonication for the first time, so has altogether reciprocal 8 times.After the 8th ultrasonication finishes, ultrasonic amplitude transformer is extracted, taken out pure tin pot simultaneously molten solder alloy is cast in punching block, so far complete the preparation of high-performance tin-based solder alloy.Said process all completes under Ar protective atmosphere.
This tin-based solder alloy is carried out to micro-hardness testing, and result shows: the average hardness of novel solder is 23.82HV, compares normal solder hardness (14.61HV), and this novel solder hardness has improved 63.0%.
embodiment 4
This example material used is: SAC305 casting alloy bar, particle diameter are about the SAC305 tin-based solder powder of 2 μ m and the SiC powder that particle diameter is 700nm.Tin pot material is pure titanium, is of a size of: 38mm * 35mm, in practical operation, once molten tin amount is 200g.Ultrasonic amplitude transformer material is titanium alloy (Ti-6Al-4V), and ultrasonic power is 1200W, and supersonic frequency is 20KHz, and the degree of depth that ultrasonic amplitude transformer immerses in molten solder is 5mm.
Get SAC305 solder powder 39g and SiC powder 1g, both are poured in beaker, and carry out manual stirring by stainless steel spoon, in the process stirring, constantly add alcohol, to guarantee mixing solder all the time in thick.Stir and continue after 30 minutes, the beaker that fills solder, as for drying in vacuum drying chamber, is pressed into the composite soldering piece that quality is 40g by cold pressing forming process by the mixed-powder after drying subsequently.
The SAC305 casting alloy bar that is 160g by quality is put into pure tin tin pot, by tin stove, solder is heated to 300 ℃ and keep constant temperature, and now solder is in molten condition; The 40g composite soldering piece that adopts powder metallurgy process to make is inserted in molten solder, and ultrasonic amplitude transformer is stretched in molten solder, preheating was opened ultrasonic vibration after 5 seconds, the ultrasonic vibration time is 60 seconds, after finishing, vibration extracts ultrasonic amplitude transformer by molten solder standing 20 seconds, again ultrasonic amplitude transformer stretched in solder subsequently and open ultrasonic vibration, following step is consistent with ultrasonication for the first time, so has altogether reciprocal 3 times.After ultrasonication for the third time finishes, ultrasonic amplitude transformer is extracted to solder, take out pure tin pot simultaneously molten solder is cast in punching block, so far complete the preparation that particle strengthens composite soldering.Said process all completes under Ar protective atmosphere.
SEM characterization result shows, tiny, the size homogeneous of microscopic structure particle in this compound solder alloy, be evenly distributed, and after uniform temperature remelting this tissue kept stable.Solder fusing point and micro-hardness testing result show: the fusing point of this novel solder is 216.8 ℃, suitable with common SAC305 fusing point (218 ℃); The average hardness of novel solder is 24.67HV, compares normal solder hardness (16.32HV), and this novel solder hardness has improved 51.16%.
Claims (7)
1. the preparation method of a high-performance tin-based solder alloy, high-performance tin-based solder alloy comprises tin-based solder matrix and infusibility hard dispersion-strengtherning phase, it is characterized in that: described high-performance tin-based solder alloy also comprises that weight percentage is 0.01%～2% doped chemical, and described doped chemical is one or more in Fe, Ni, Y, Ag, Ti, Zr, Hf, Sb; The tin-based solder of described tin-based solder matrix is comprised of tin-based solder powder and casting kamash alloy bar, and wherein said tin-based solder powder is no less than tin-based solder matrix weight 10%, and described preparation method comprises the following step carrying out successively:
A1, described tin-based solder powder, infusibility hard dispersion-strengtherning phase powder and doped chemical powder and ethanol and/or brazing flux are mixed and made into pulpous state or paste mixture;
A2, prepared pulpous state or paste mixture are placed in to vacuum drying at 50 ℃～100 ℃, then under 400MPa～700MPa pressure, cold moudling obtains composite alloy piece;
A3, casting kamash alloy bar, composite alloy piece are placed in to container are melted into melt completely, and make melt temperature higher than 10 ℃～200 ℃ of the liquidus temperatures of described tin-based solder;
A4, melt is applied to ultrasonic vibration 1～20 time, each ultrasonic vibration time is 5～300 seconds, when applying twice, is 5～60 seconds ultrasonic interval time when above, and then cast molding obtains high-performance tin-based solder alloy.
2. the preparation method of high-performance tin-based solder alloy according to claim 1, is characterized in that: the dispersion-strengtherning of described infusibility hard is SiC, TiO mutually
2, ZrO
2, Y
2o
3, MgO, Al
2o
3, TiB
2, CNTs and Cu
6sn
5in one or more, its weight percentage is 0.02%～2%.
3. the preparation method of high-performance tin-based solder alloy according to claim 1 and 2, is characterized in that: described tin-based solder matrix is Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Pb, Sn-Bi or Sn-Zn alloy.
4. the preparation method of high-performance tin-based solder alloy according to claim 3, it is characterized in that: the mixing in described steps A 1 adopts ball-milling method, and milling atmosphere is Ar, and ratio of grinding media to material is 5: 1～20: 1, rotating speed is 100rpm～300rmp, and Ball-milling Time is 1～10 hour; Or directly adopt craft or mechanical agitation to mix, mixing time is 5～60 minutes.
5. the preparation method of high-performance tin-based solder alloy according to claim 4, it is characterized in that: while applying ultrasonic vibration in described steps A 4, ultrasonic amplitude transformer is stretched into and in melt, directly put on melt, or ultrasonic amplitude transformer is applied to ultrasonic vibration in container side or bottom.
6. according to the preparation method of the high-performance tin-based solder alloy described in claim 4 or 5, it is characterized in that: the average grain diameter of described infusibility hard dispersion-strengtherning phase powder is 30～2000nm, and the average grain diameter of described tin-based solder powder is 1～500 μ m.
7. the preparation method of a high-performance tin-based solder alloy, described high-performance tin-based solder alloy comprises the infusibility hard dispersion-strengtherning phase that tin-based solder matrix and weight percentage are 0.02%～2%, described tin-based solder matrix is Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Pb, Sn-Bi or Sn-Zn alloy, and the dispersion-strengtherning of described infusibility hard is SiC, TiO mutually
2, ZrO
2, Y
2o
3, MgO, Al
2o
3, TiB
2, CNTs and Cu
6sn
5in one or more, it is characterized in that: the tin-based solder of described tin-based solder matrix is comprised of tin-based solder powder and casting kamash alloy bar, wherein said tin-based solder powder is no less than tin-based solder matrix weight 10%, and described preparation method comprises the following step carrying out successively:
B1, described tin-based solder powder and infusibility hard dispersion-strengtherning phase powder and ethanol and/or brazing flux are mixed and made into pulpous state or paste mixture;
B2, prepared pulpous state or paste mixture are placed in to vacuum drying at 50 ℃～100 ℃, then under 400MPa～700MPa pressure, cold moudling obtains composite alloy piece;
B3, casting kamash alloy bar, composite alloy piece are placed in to container are melted into melt completely, and make melt temperature higher than 10 ℃～200 ℃ of the liquidus temperatures of described tin-based solder;
B4, melt is applied to ultrasonic vibration 1～20 time, each ultrasonic vibration time is 5～300 seconds, and be 5～60 seconds ultrasonic interval time, and then cast molding obtains high-performance tin-based solder alloy.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3369520A4 (en) * | 2016-08-19 | 2018-10-31 | Senju Metal Industry Co., Ltd | Solder alloy for preventing fe erosion, resin flux cored solder, wire solder, resin flux cored wire solder, flux coated solder, solder joint and soldering method |
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