CN107267808A - A kind of method of refinement Sn Bi alloy eutectic structures - Google Patents
A kind of method of refinement Sn Bi alloy eutectic structures Download PDFInfo
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- CN107267808A CN107267808A CN201710341614.XA CN201710341614A CN107267808A CN 107267808 A CN107267808 A CN 107267808A CN 201710341614 A CN201710341614 A CN 201710341614A CN 107267808 A CN107267808 A CN 107267808A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
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Abstract
The invention discloses a kind of method of refinement Sn Bi alloy eutectic structures, more particularly to a kind of succinct, low cost preparation method.It is characteristic of the invention that using rare earth alloy（Sn La or Sn La Ce）As alterant and fining agent, promote the forming core in alloy graining process except the surface activation of rare earth element, play metamorphic homogenization to brazing filler metal alloy outer；The compound that process of setting situ is separated out（LaBi2, CeBi2）Also can as Bi phases heterogeneous forming core core, improve Bi phases nucleation rate；The rare earth that original position is separated out is single-phase（La, Ce）Also it can effectively hinder growing up for crystal grain, it is suppressed that the roughening of crystal grain during military service, improve the timeliness military service intensity of plumb joint, extending connector service life.The preparation technology simple possible of the present invention, cost is relatively low, and significantly, the Sn Bi cast alloy with tiny eutectic structure, suitable industrialized mass production is easily made in thinning effect.
Description
First, technical field
The present invention relates to a kind of method of refinement Sn-Bi alloy eutectic structures, belong to technical field of metal material preparation.
2nd, background technology
With the reinforcement of people's environmental consciousness, electronic industry quickly develop and relevant laws and regulations promulgation, increasing people
Advocate the unleaded product using green non-pollution.Most representational leadless welding alloy is, using Sn as matrix, to add now
Plus other elements alloying is formed.Four kinds replace the Sn-Bi series lead-free solders of Sn-Pb solders to have fusing point low, and weldability is good, connect
The advantages of head intensity is high.But the plasticity and toughness of Sn-Bi lead-free brazings are poor, its answering in Electronic Packaging industry is greatly limited
With particularly low-temperature lead-free welds field.At present, the method for refinement Sn-Bi alloy eutectic structures mainly uses continuously extruded work
Skill causes alloy to recrystallize, so as to refine the eutectic structure of Sn-Bi alloys.At present, the technique is quite ripe, and extensively
The general preparation process for being applied to Sn-Bi series lead-free solders.Because alloy microstructure has pole after as-cast structure before extruding and extruding
Big relevance, tiny as-cast structure can obtain more tiny tissue after extruding, and Sn-Bi series lead-free solders are nearly eutectic
Composition, so preparing the Sn-Bi alloys with tiny as cast condition eutectic structure as one of current key issue.In addition, Sn-
Bi systems solder under arms during be easily roughened, cause the reliability of welding to be remarkably decreased, therefore how to improve Sn-Bi alloys
High-temperature stability is also one of key issue that Sn-Bi systems solder can be used widely.
At present, preparing the method for the Sn-Bi systems cast alloy of fine microstructures mainly has alloying（Cu、Zn、Sb、Fe、Al
Deng）, Rotational magnetic field method, mechanical mixing method, ultrasonic activation method and machinery and ultrasonic wave composite stirring method etc..The composition of alloy is
Determine alloy microstructure internal cause, be determine institutional framework key factor, and adjustment alloying component can and other method
Combination, so the key for preparing the Sn-Bi systems cast alloy of fine microstructures is the composition for optimizing Sn-Bi systems alloy.
3rd, the content of the invention
Because the institutional framework of Sn-Bi systems solder is mainly Sn-Bi eutectic structures, so refinement Sn-Bi eutectic structures and raising
Its ability for suppressing roughening is the main thought and method for improving Sn-Bi system's solder performances and widening its application.The present invention is disclosed
A kind of method of refinement Sn-Bi alloy eutectic structures, more particularly to it is a kind of efficiently, the preparation method of low cost, predominantly connect
Continuous extrusion process provides the preferable original material of institutional framework, improves the microstructure of end article, improves end article
Mechanical property, physical property etc., offered reference to obtain the preferable high-quality solder of combination property.It is characteristic of the invention that using
Containing rare earth alloy（Sn-La or Sn-La-Ce）As alterant and fining agent, except the surface activation of rare earth, alloy is promoted to coagulate
Gu during forming core, play that metamorphic homogenization is outer to brazing filler metal alloy, the compound that process of setting situ is separated out（LaBi2,
CeBi2）Can as Bi phases heterogeneous forming core core, improve Bi phases nucleation rate；And the rare earth of precipitation in situ is single-phase（La, Ce）Can
Effectively hinder growing up for crystal grain, it is suppressed that the roughening of crystal grain during military service, improve the timeliness military service intensity of plumb joint, extension connects
Head service life；Two kinds of compound actions significantly refine and homogenized the eutectic structure of Sn-Bi alloys.
The method that the present invention prepares Sn-Bi alloys, the atomic percent of alloy, which is constituted, is：54.1 ~ 56.9 at.% tin,
40.8 ~ 43.0 at.% bismuths, 0 ~ 5.0at.% rare earths（La or Ce）And inevitable impurity.
The step of present invention prepares Sn-Bi cast alloy is as follows：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and at least 10min is incubated at 200 DEG C ~ 400 DEG C, it is ensured that melt is equal
Even single liquid phase；
（2）Add rare earth addition（Sn-La or Sn-La-Ce）, it is incubated at least 20min at 400 DEG C ~ 750 DEG C, it is ensured that rare earth member
Element in the abundant melting and melt of element is uniformly distributed；
（3）Alloy melt is poured into mould, Sn-Bi cast alloy is made.
Sn-Bi Microstructures of As cast Alloys architectural feature and beneficial effect prepared by the present invention：
（1）La and Ce form metallic compound LaBi in situ with Bi respectively in process of setting2Phase and CeBi2Phase, and LaBi2With
CeBi2As the heterogeneous nucleating center of Bi phases, the Bi phases in eutectic structure are significantly refined, and then refined the eutectic in alloy
Tissue.With the increase of rare earth addition, the eutectic structures of Sn-Bi alloys is gradually converted into tiny by thick continuous lamellar
Discontinuous lamellar；
（2）In process of setting, the rare-earth phase that original position is separated out（La or Ce）Distribution of particles effectively hinders growing up for crystal grain in crystal boundary,
The roughening of crystal grain during being on active service is inhibited, the timeliness military service intensity of plumb joint, extending connector service life is improved；
（3）With rare earth element（La, La-Ce mischmetal）Compare, rare earth addition of the present invention（Sn-La or Sn-
La-Ce）Alloy has preferable inoxidizability, it is to avoid the oxidation in storage, transport, fusion process is wasted, and shortens alloy
The melting uniform required time, reduce the preparation cost of alloy；
（4）Mischmetal（Sn-La-Ce）With than single rare earth（Sn-La）More preferable thinning effect.
4th, illustrate
Composition, rare earth addition, thing phase composition, synusia spacing and the mechanical property of Fig. 1 comparative examples of the present invention and each embodiment sample
Energy；
The ESEM collection of illustrative plates of Fig. 2 comparative examples；
The ESEM collection of illustrative plates of the sample of Fig. 3 embodiments 1；
The ESEM collection of illustrative plates of the sample of Fig. 4 embodiments 2；
The ESEM collection of illustrative plates of the sample of Fig. 5 embodiments 3；
The ESEM collection of illustrative plates of the sample of Fig. 6 embodiments 4；
The ESEM collection of illustrative plates of the sample of Fig. 7 embodiments 5.
5th, embodiment
Comparative example
The atomic percent of alloy of the embodiment of the present invention is constituted：56.9 at.% tin, 43.0 at.% bismuths and inevitably it is miscellaneous
Matter..
Following steps are taken to be made：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and 30min is incubated at 200 DEG C, it is ensured that melt is uniform single liquid
Phase；
（2）Alloy melt is poured into mould, Sn-Bi cast alloy is made.
Composition, rare earth addition, thing phase composition, synusia spacing and the power of Fig. 1 comparative examples of the present invention and each embodiment sample
Learn performance.As shown in Figure 1, the synusia spacing of eutectic structure is 12.6 μm in the present embodiment alloy, and hardness is 382.8MPa, tension
Intensity is 69.5MPa, and elongation percentage is 25.2%.Fig. 2 is the ESEM collection of illustrative plates to this comparative example, it can be seen that in alloy
Bi phases be thick sheet.
Embodiment 1
The atomic percent composition of alloy of the embodiment of the present invention is 56.4 at.% tin, 42.5 at.% bismuths, 1.0 at.% lanthanums and not
Evitable impurity.
Following steps are taken to be made：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and 10min is incubated at 250 DEG C, it is ensured that melt is uniform single liquid
Phase；
（2）Sn-La rare earth additions are added, 20min are incubated at 400 DEG C, it is ensured that in the abundant melting of rare earth element and melt
Element is uniformly distributed；
（3）Alloy melt is poured into mould, Sn-Bi cast alloy is made.
Composition, rare earth addition, thing phase composition, synusia spacing and the power of Fig. 1 comparative examples of the present invention and each embodiment sample
Learn performance.As shown in Figure 1, the synusia spacing of eutectic structure is 4.5 μm in the present embodiment alloy, and hardness is 420.3MPa, tension
Intensity is 76.3MPa, and elongation percentage is 27.6%.Compared with comparative example alloy, synusia spacing reduces 64.3%, and hardness is improved
9.8%, tensile strength improves 9.8%, and elongation percentage improves 9.5%.Fig. 3 is the ESEM collection of illustrative plates of the present embodiment sample, it can be seen that
Eutectic structure in alloy is continuous lamellar structure.
Embodiment 2
The atomic percent composition of alloy of the embodiment of the present invention is 55.8 at.% tin, 42.1 at.% bismuths, 2.0 at.% lanthanums and not
Evitable impurity.
Following steps are taken to be made：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and 20min is incubated at 300 DEG C, it is ensured that melt is uniform single liquid
Phase；
（2）Sn-La rare earth additions are added, 20min are incubated at 550 DEG C, it is ensured that in the abundant melting of rare earth element and melt
Element is uniformly distributed；
（3）Alloy melt is poured into mould, Sn-Bi cast alloy is made.
Composition, rare earth addition, thing phase composition, synusia spacing and the power of Fig. 1 comparative examples of the present invention and each embodiment sample
Learn performance.As shown in Figure 1, the synusia spacing of eutectic structure is 3.2 μm in the present embodiment alloy, and hardness is 431.0MPa, tension
Intensity is 78.3MPa, and elongation percentage is 29.8%.Compared with comparative example alloy, synusia spacing reduces 74.6%, and hardness is improved
12.6%, tensile strength improves 12.7%, and elongation percentage improves 18.3%.Fig. 4 is the ESEM collection of illustrative plates of the present embodiment sample, can be with
It is still continuous lamellar structure to find out the eutectic structure in alloy.
Embodiment 3
The atomic percent composition of alloy of the embodiment of the present invention is 55.3 at.% tin, 41.6 at.% bismuths, 3.0 at.% lanthanums and not
Evitable impurity.
Following steps are taken to be made：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and 20min is incubated at 350 DEG C, it is ensured that melt is uniform single liquid
Phase；
（2）Sn-La rare earth additions are added, 30min are incubated at 650 DEG C, it is ensured that in the abundant melting of rare earth element and melt
Element is uniformly distributed；
（3）Alloy melt is poured into mould, Sn-Bi cast alloy is made.
Composition, rare earth addition, thing phase composition, synusia spacing and the power of Fig. 1 comparative examples of the present invention and each embodiment sample
Learn performance.As shown in Figure 1, the synusia spacing of eutectic structure is 2.1 μm in the present embodiment alloy, and hardness is 464.7MPa, tension
Intensity is 84.4MPa, and elongation percentage is 31.5%.Compared with comparative example alloy, synusia spacing reduces 83.3%, and hardness is improved
21.4%, tensile strength improves 21.4%, and elongation percentage improves 25.0%.Fig. 5 is the ESEM collection of illustrative plates of the present embodiment sample, can be with
It is discontinuous lamellar structure to find out the eutectic structure in alloy.
Embodiment 4
The atomic percent composition of alloy of the embodiment of the present invention is 55.3 at.% tin, 41.6 at.% bismuths, 1.5 at.% lanthanums, 1.5
At.% ceriums and inevitable impurity.
Following steps are taken to be made：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and 20min is incubated at 350 DEG C, it is ensured that melt is uniform single liquid
Phase；
（2）Sn-La-Ce rare earth additions are added, 30min are incubated at 650 DEG C, it is ensured that in the abundant melting of rare earth element and melt
Element be uniformly distributed；
（3）Alloy melt is poured into mould, Sn-Bi cast alloy is made.
Composition, rare earth addition, thing phase composition, synusia spacing and the power of Fig. 1 comparative examples of the present invention and each embodiment sample
Learn performance.As shown in Figure 1, the synusia spacing of eutectic structure is 1.6 μm in the present embodiment alloy, and hardness is 490.2MPa, tension
Intensity is 89.0MPa, and elongation percentage is 33.2%.Compared with comparative example alloy, synusia spacing reduces 87.3%, and hardness is improved
28.1%, tensile strength improves 28.1%, and elongation percentage improves 31.7%.Fig. 6 is the ESEM collection of illustrative plates of the present embodiment sample, can be with
It is discontinuous lamellar structure to find out the eutectic structure in alloy.
Embodiment 5
The atomic percent composition of alloy of the embodiment of the present invention is 54.1 at.% tin, 40.8 at.% bismuths, 5.0 at.% lanthanums and not
Evitable impurity.
Following steps are taken to be made：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and 20min is incubated at 400 DEG C, it is ensured that melt is uniform single liquid
Phase；
（2）Sn-La rare earth additions are added, 30min are incubated at 750 DEG C, it is ensured that in the abundant melting of rare earth element and melt
Element is uniformly distributed；
（3）Alloy melt is poured into mould, Sn-Bi cast alloy is made.
Composition, rare earth addition, thing phase composition, synusia spacing and the power of Fig. 1 comparative examples of the present invention and each embodiment sample
Learn performance.As shown in Figure 1, the hardness of the present embodiment alloy is 512.6MPa, and tensile strength is 93.1MPa, and elongation percentage is
26.4%.Compared with comparative example alloy, hardness improves 33.9%, and tensile strength improves 34.0%, and elongation percentage improves 4.8%.Fig. 7 is this
The ESEM collection of illustrative plates of embodiment sample, it can be seen that alloy is by thick nascent Bi phases and lamellar Sn-Bi eutectic structure groups
Into institutional framework is substantially uneven.
Composition, rare earth addition, thing phase composition, synusia spacing and the mechanical property of comparative example of the present invention and each embodiment sample
Fig. 1 can be summarized in.As shown in Figure 1：
（1）When rare earth addition is less than 3.0 at%, with the increase of addition, the synusia spacing of eutectic structure is gradually reduced
And tend towards stability, gradually it is changed into discontinuous eutectic structure, the hardness of alloy, tensile strength, elongation percentage from continuous eutectic structure
Gradually rise；
（2）When rare earth addition is 3.0 ~ 5.0 at%, with the increase of addition, the nascent Bi phases in alloy gradually increase,
The size of nascent Bi phases gradually increases, and the hardness and tensile strength of alloy gradually increase, and the elongation percentage of alloy is gradually reduced；
（3）By comparative example 3 and embodiment 4, mischmetal intermediate alloy is added（Sn-La-Ce）Thinning effect
Relatively addition single rare earth intermediate alloy（Sn-La）Effect it is notable.
In a word, Rare Earth Lanthanum is added（La）And cerium（Ce）The eutectic structure in Sn-Bi alloys can be significantly refined, is continuous squeeze
Technique is pressed to provide the preferable original material of institutional framework.The preparation technology simple possible of the present invention, cost is relatively low, and thinning effect shows
Write, the Sn-Bi cast alloy with tiny eutectic structure, suitable industrialized mass production is easily made.In addition, the Sn-Bi prepared
The rare-earth phase in situ separated out in cast alloy（La phases or Ce phases）Particle, can effectively hinder growing up for crystal grain, it is suppressed that be on active service
During crystal grain roughening, improve the timeliness military service intensity of plumb joint, extending connector service life is used as lead-free solder
High-quality raw material, with wide development and application prospect.
Certainly, described above is also not limited to the example above, the technical characteristic of the invention without description can by or
Realized, will not be repeated here using prior art；Above example and accompanying drawing are merely to illustrate technical scheme not
It is limitation of the present invention, preferred embodiment the present invention is described in detail for reference, the ordinary skill people of this area
Member is it should be appreciated that change, remodeling, the addition that those skilled in the art are made in the essential scope of the present invention
Or replace without departure from spirit of the invention, it should also belong to the claims of the present invention.
Claims (4)
1. a kind of method of refinement Sn-Bi alloy eutectic structures, it is characterized in that being made up of the material of following atom ratio：54.1~
56.9 at.% tin, 40.8 ~ 43.0 at.% bismuths, 0 ~ 5.0at.% rare earths（La or Ce）And inevitable impurity；It is characterized in that
Preparation process is as follows：
（1）By metallic tin（Sn）And bismuth（Bi）It is completely melt, and at least 10min is incubated at 200 DEG C ~ 400 DEG C, it is ensured that melt is equal
Even single liquid phase；
（2）Add rare earth addition（Sn-La or Sn-La-Ce）, it is incubated at least 20min at 400 DEG C ~ 750 DEG C, it is ensured that rare earth member
Element in the abundant melting and melt of element is uniformly distributed；
（3）Alloy melt is poured into mould, the Sn-Bi cast alloy with tiny eutectic structure is made.
2. preparation method according to claim 1, it is characterized in that step（2）In, rare earth addition used（Sn-La or
Sn-La-Ce）For Sn-La intermediate alloys that La atomic percentages are 2.0 ~ 6.0 at.%, La and Ce atomic percentages be 2.0 ~
3.0 at.% Sn-La-Ce intermediate alloys.
3. preparation method according to claim 1, it is characterized in that step（2）In, the holding temperature of melt is 400 ~ 750
℃。
4. a kind of method of refinement Sn-Bi alloy eutectic structures, it is characterised in that use rare earth addition（Sn-La, Sn-La-
Ce）As alterant and fining agent, it is related to following 3 kinds of refinement mechanisms：
（1）The surface active and homogenization of trace rare-earth, promote the forming core in alloy graining process；
（2）The compound that process of setting situ is separated out（LaBi2, CeBi2）Can as Bi phases heterogeneous forming core core, improve Bi
The nucleation rate of phase；
（3）The rare earth that original position is separated out is single-phase（La phases or Ce phases）Growing up for crystal grain can effectively be hindered.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109518019A (en) * | 2018-10-12 | 2019-03-26 | 北京康普锡威科技有限公司 | A kind of method of modified SnBi system hypoeutectic alloy and obtained alloy |
| CN110205517A (en) * | 2019-06-26 | 2019-09-06 | 广东省焊接技术研究所（广东省中乌研究院） | A method of refinement Sn-Bi system solder alloy eutectic structure |
| CN114807676A (en) * | 2022-05-20 | 2022-07-29 | 赣州晨光稀土新材料有限公司 | Sn-Bi alloy material and preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101081464A (en) * | 2007-07-13 | 2007-12-05 | 北京工业大学 | SnBi and SnBiAg series low-temperature leadless solder containing trace quantity of rare-earth |
| CN101138811A (en) * | 2006-09-05 | 2008-03-12 | 深圳市弘星威焊锡制品有限公司 | Low-temperature lead-free solder |
| CN101348875A (en) * | 2008-06-04 | 2009-01-21 | 厦门市及时雨焊料有限公司 | Tin, bismuth and copper type low temperature lead-free solder alloy |
| CN102513720A (en) * | 2011-12-23 | 2012-06-27 | 哈尔滨工业大学深圳研究生院 | High-performance tin-based solder alloy and preparation method thereof |
| JP2014524354A (en) * | 2011-08-02 | 2014-09-22 | アルファ・メタルズ・インコーポレイテッド | High impact toughness solder alloy |
-
2017
- 2017-05-16 CN CN201710341614.XA patent/CN107267808A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101138811A (en) * | 2006-09-05 | 2008-03-12 | 深圳市弘星威焊锡制品有限公司 | Low-temperature lead-free solder |
| CN101081464A (en) * | 2007-07-13 | 2007-12-05 | 北京工业大学 | SnBi and SnBiAg series low-temperature leadless solder containing trace quantity of rare-earth |
| CN101348875A (en) * | 2008-06-04 | 2009-01-21 | 厦门市及时雨焊料有限公司 | Tin, bismuth and copper type low temperature lead-free solder alloy |
| JP2014524354A (en) * | 2011-08-02 | 2014-09-22 | アルファ・メタルズ・インコーポレイテッド | High impact toughness solder alloy |
| CN102513720A (en) * | 2011-12-23 | 2012-06-27 | 哈尔滨工业大学深圳研究生院 | High-performance tin-based solder alloy and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109518019A (en) * | 2018-10-12 | 2019-03-26 | 北京康普锡威科技有限公司 | A kind of method of modified SnBi system hypoeutectic alloy and obtained alloy |
| CN109518019B (en) * | 2018-10-12 | 2020-06-19 | 北京康普锡威科技有限公司 | Method for modifying SnBi series hypoeutectic alloy and alloy obtained by method |
| CN110205517A (en) * | 2019-06-26 | 2019-09-06 | 广东省焊接技术研究所（广东省中乌研究院） | A method of refinement Sn-Bi system solder alloy eutectic structure |
| CN114807676A (en) * | 2022-05-20 | 2022-07-29 | 赣州晨光稀土新材料有限公司 | Sn-Bi alloy material and preparation method and application thereof |
| CN114807676B (en) * | 2022-05-20 | 2023-08-29 | 赣州晨光稀土新材料有限公司 | Sn-Bi alloy material and preparation method and application thereof |
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Application publication date: 20171020 |