CN106346169B - Paste solder, preparation method and the application of diamond are brazed in air - Google Patents
Paste solder, preparation method and the application of diamond are brazed in air Download PDFInfo
- Publication number
- CN106346169B CN106346169B CN201610999923.1A CN201610999923A CN106346169B CN 106346169 B CN106346169 B CN 106346169B CN 201610999923 A CN201610999923 A CN 201610999923A CN 106346169 B CN106346169 B CN 106346169B
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- Prior art keywords
- diamond
- solder
- air
- paste solder
- brazed
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses paste solder, preparation method and applications that diamond is brazed in a kind of air.The paste solder of soldering diamond includes in the air：88wt%~92wt% solders, 1wt%~2wt% scaling powders, rest part include binder and water；The solder includes that mass ratio is 1:0.05~1:0.1 BNi 2 and titanium valve；The scaling powder includes that mass ratio is 1:0.1~1:1.8 aluminum fluoride and potassium fluoride.The paste solder of soldering diamond does not need vacuum or protective atmosphere in brazing process in the air of the present invention; it can complete to be brazed in air; therefore process flexibility is substantially increased; production cost is reduced, improves production efficiency, while solder usage amount is also easier to control; and it can substantially extend tool life; and preparation method is simple, condition is easily-controllable, is suitble to large-scale production.
Description
Technical field
The present invention is more particularly directed to paste solder, preparation method and applications that diamond is brazed in a kind of air.
Background technology
Diamond tool is particularly suitable for processing hard brittle material in particular nonmetallic materials, for example, stone material, Wall or floor tile, glass,
Ceramics etc.；It can be used for processing non-ferrous metal, alloy, timber, such as copper, aluminium, hard alloy, hardened steel, cast iron etc..At present
Diamond tool is widely used to the industry such as building, building materials, geology, metallurgy, machinery, electronics, ceramics, timber, automobile.
In practical application, the solder of soldering diamond needs to have following characteristics：One, solder has diamond and matrix
Good wellability and bond strength；Two, solder is preferably no aggressivity or micro- aggressivity to diamond；Three, the softening of solder
Point necessarily is greater than local temperature of the brazed diamond tool when cutting.The bond strength of diamond and matrix is mainly determined by solder
Fixed, solder will generate chemical bonding in diamond surface could form diamond effective holding, and this requires in solder ingredient
Must contain can generate the element (Ti, V, Cr etc.) of carbide with diamond at high temperature.
Currently, chromium or titanium of the solder used in most of manufacturers mostly containing 10 ℅ or so, still, the members such as Ti, Cr
When element heats in air, it is easy oxidation, is lost activity.The solution of the prior art be usually when being brazed diamond,
It is carried out under the conditions of vacuum or inert gas shielding, relative to being brazed in air, this considerably increases processing costs, reduce life
Produce efficiency.
Invention content
The main purpose of the present invention is to provide the paste solder of soldering diamond, preparation method in a kind of air and answer
With to overcome deficiency in the prior art.
For realization aforementioned invention purpose, the technical solution adopted by the present invention includes：
An embodiment of the present invention provides the paste solders that diamond is brazed in a kind of air comprising：88wt%~
92wt% solders, 1wt%~2wt% scaling powders, rest part include binder and water；
The solder includes that mass ratio is 1:0.05~1:0.1 BNi-2 and titanium valve；
The scaling powder includes that mass ratio is 1:0.1~1:1.8 aluminum fluoride and potassium fluoride.
Further, the mass ratio of BNi-2 and titanium valve is 1 in the solder:0.06~1:0.08.
Further, the mass ratio of aluminum fluoride and potassium fluoride is preferably 1 in the scaling powder:1.2~1:1.5.
Wherein, the scaling powder can effectively remove oxide skin, and prevent the further oxidation of the alloy powder as solder.
In some more preferred embodiment, the paste solder includes 8wt%~10wt% water and binder.
In some more preferred embodiment, the mass ratio of the binder and water is (1~2)：(98~99).
Further, the binder includes methylcellulose or ethyl cellulose, and without being limited thereto.
Further, aforementioned BNi-2 is nickel-based solder, secondly main component also contains the molten member of drop based on Ni
Element (melting point depressant element) B and Si and other elements (refering to《Heat processing technique》, 2004,
6(1):47-50)。
Further, the grain size of aforementioned titanium valve is preferably 10 μm~100 μm, especially preferably 30 μm~50 μm.With this phase
The layer structure more uniform compact that the paste solder answered is formed has more preferably bond strength with base material.
The embodiment of the present invention additionally provides the paste solder and is brazed the purposes of diamond in air atmosphere or is making
Purposes in standby diamond tool.
The embodiment of the present invention additionally provides a kind of preparation method of the paste solder of soldering diamond in air comprising：
Binder and water are uniformly mixed to form glue-like lotion,
Solder and scaling powder are uniformly mixed to form the paste solder with the glue-like lotion, the solder includes matter
Amount is than being 1:0.05~1:0.1 BNi-2 and titanium valve, the scaling powder include that mass ratio is 1:0.1~1:1.8 aluminum fluoride and
Potassium fluoride；
Wherein, the paste solder includes 88wt%~92wt% solders and 1wt%~2wt% scaling powders.
Further, the mass ratio of BNi-2 and titanium valve is 1 in the solder:0.06~1:0.08.
Further, the mass ratio of aluminum fluoride and potassium fluoride is preferably 1 in the scaling powder:1.2~1:1.5.
In some more preferred embodiment, the quality of the glue-like lotion is the paste solder quality
8%~10%.
In some more preferred embodiment, the glue-like lotion includes 1wt%~2wt% binders.
Further, the binder includes methylcellulose or ethyl cellulose, and without being limited thereto.
Further, the grain size of aforementioned titanium valve is preferably 10 μm~100 μm, especially preferably 30 μm~50 μm.
In some more specific embodiment, the preparation method that the paste solder of diamond is brazed in the air can
To include：
Using the mixture of aluminum fluoride and potassium fluoride as scaling powder,
Using the mixture of BNi-2 powder and titanium valve as solder,
Using ethyl cellulose (powdered) in water high speed dispersion at glue as lotion, be stirred to form paste pricker
Material.
The embodiment of the present invention additionally provides a kind of preparation method of diamond tool comprising：By pricker in the air
The paste solder for welding diamond is coated on matrix, so that diamond is adsorbed on the paste solder later, then directly in sky
It is heated to 1000~1100 DEG C in gas and keeps the temperature 10~25s, diamond tool is made.
In some more specific embodiment, the preparation method may include：Gold will be brazed in the air
The paste solder of hard rock is applied on matrix, then so that diamond is adsorbed on solder with modes such as Electrostatic Absorptions again, is directly existed
In air with high-frequency heating to 1000~1100 DEG C and keep the temperature 10~25s obtain diamond tool.
Further, described matrix can be selected from the materials such as metal, ceramics, and without being limited thereto.
The embodiment of the present invention additionally provides the diamond tool prepared by preceding method.
Compared with prior art, the paste solder that diamond is brazed in air provided by the invention is not required in brazing process
Vacuum or protective atmosphere are wanted, can complete to be brazed in air, therefore substantially increase process flexibility, reduce and be produced into
This, improves production efficiency, while solder usage amount is also easier to control, and can substantially extend tool life, and it is made
Preparation Method is simple, and condition is easily-controllable, is suitble to large-scale production.
Specific implementation mode
In view of deficiency in the prior art, inventor is able to propose the present invention's through studying for a long period of time and largely putting into practice
Technical solution.The technical solution, its implementation process and principle etc. will further be solved in conjunction with several preferred embodiments as follows
Release explanation.
Embodiment 1
The paste solder that diamond is brazed in the air of the present embodiment includes following component：92wt% solders, 1.5wt% are helped
Solder flux, 0.1wt% ethyl celluloses and 6.4wt% water.
The solder is that mass ratio is 1:The mixing gold of 0.05 BNi-2 (purchased in market) and titanium valve (about 10 μm~25 μm of grain size)
Belong to powder.
The scaling powder is that mass ratio is 1:0.1 aluminum fluoride and the mixture of potassium fluoride.
The preparation method of the paste solder of soldering diamond includes in the air：
According to aforementioned proportioning preparation raw material；
Aluminum fluoride and potassium fluoride are uniformly mixed and are used as scaling powder, BNi-2 and titanium valve are uniformly mixed and are used as solder
By ethyl cellulose formation glue soluble in water；
Scaling powder and solder are added in the glue, is uniformly mixed with planetary mixer, obtains the air
The paste solder of middle soldering diamond.
The paste solder for being brazed diamond in the air is coated on steel body, so that diamond is inhaled with electrostatic later
Attached mode is attached on the paste solder, and then directly high frequency is electrically heated to 1100 DEG C and keeps the temperature 15s in air, is made
Diamond tool.
The diamond tool is suitble to processing of stone industry.
Embodiment 2
The paste solder that diamond is brazed in the air of the present embodiment includes following component：88wt% solders, 2wt% help weldering
Agent, 0.1wt% ethyl celluloses and 9.9wt% water.
The solder is that mass ratio is 1:The mixing gold of 0.06 BNi-2 (purchased in market) and titanium valve (about 30 μm~50 μm of grain size)
Belong to powder.
The scaling powder is that mass ratio is 1:1.5 aluminum fluoride and the mixture of potassium fluoride.
The preparation method of the paste solder of soldering diamond includes in the air：
According to aforementioned proportioning preparation raw material；
Aluminum fluoride and potassium fluoride are uniformly mixed and are used as scaling powder, BNi-2 and titanium valve are uniformly mixed and are used as solder
By ethyl cellulose formation glue soluble in water；
Scaling powder and solder are added in the glue, is uniformly mixed with planetary mixer, obtains the air
The paste solder of middle soldering diamond.
By in the air be brazed diamond paste solder be coated in zirconia ceramics matrix on, make later diamond with
The mode of Electrostatic Absorption is attached on the paste solder, and then directly high frequency is electrically heated to 1000 DEG C and keeps the temperature in air
Diamond tool is made in 20s.
The diamond tool is suitble to Ceramic manufacturing industry.
Embodiment 3
The paste solder that diamond is brazed in the air of the present embodiment includes following component：90wt% solders, 1wt% help weldering
Agent, 0.1wt% ethyl celluloses and 8.9wt% water.
The solder is that mass ratio is 1:The mixing gold of 0.08 BNi-2 (purchased in market) and titanium valve (about 30 μm~50 μm of grain size)
Belong to powder.
The scaling powder is that mass ratio is 1:1.2 aluminum fluoride and the mixture of potassium fluoride.
The preparation method of the paste solder of soldering diamond includes in the air：
According to aforementioned proportioning preparation raw material；
Aluminum fluoride and potassium fluoride are uniformly mixed and are used as scaling powder, BNi-2 and titanium valve are uniformly mixed and are used as solder
By ethyl cellulose formation glue soluble in water；
Scaling powder and solder are added in the glue, is uniformly mixed with planetary mixer, obtains the air
The paste solder of middle soldering diamond.
The paste solder for being brazed diamond in the air is coated on titanium alloy substrate, makes diamond with electrostatic later
The mode of absorption is attached on the paste solder, and then directly high frequency is electrically heated to 1050 DEG C and keeps the temperature 10s in air, is made
Obtain the suitable wood working industry of the diamond tool diamond tool.
Embodiment 4
The paste solder that diamond is brazed in the air of the present embodiment includes following component：91wt% solders, 1wt% help weldering
Agent, 0.08wt% ethyl celluloses and 7.92wt% water.
The solder is that mass ratio is 1:The mixed metal powder of 0.1 BNi-2 and titanium valve (about 100 μm~120 μm of grain size)
End.
The scaling powder is that mass ratio is 1:1.8 aluminum fluoride and the mixture of potassium fluoride.
The preparation method of the paste solder of soldering diamond includes in the air：
According to aforementioned proportioning preparation raw material；
Aluminum fluoride and potassium fluoride are uniformly mixed and are used as scaling powder, BNi-2 and titanium valve are uniformly mixed and are used as solder
By ethyl cellulose formation glue soluble in water；
Scaling powder and solder are added in the glue, is uniformly mixed with planetary mixer, obtains the air
The paste solder of middle soldering diamond.
By in the air be brazed diamond paste solder be coated in silicon nitride ceramics matrix on, make later diamond with
The mode of Electrostatic Absorption is attached on the paste solder, and then directly high frequency is electrically heated to 1080 DEG C and keeps the temperature in air
Diamond tool is made in 18s.
The diamond tool is suitble to metal-working industry.
Reference examples 1：With reference to embodiment 1, commercially available BNi-2 solders is taken to be scattered in the glue that water and ethyl cellulose are formed,
It is uniformly mixed to form paste solder with planetary mixer.The paste solder is coated on steel body, makes Buddha's warrior attendant later
Stone is attached in a manner of Electrostatic Absorption on the paste solder, and then directly high frequency is electrically heated to 1100 DEG C and protects in air
Diamond tool is made in warm 15s.
Reference examples 2：With reference to embodiment 1, commercially available BNi-2 solders is taken to be scattered in the glue that water and methylcellulose are formed,
It is uniformly mixed to form paste solder with planetary mixer.The paste solder is coated on steel body, makes Buddha's warrior attendant later
Stone is attached in a manner of Electrostatic Absorption on the paste solder, is then electrically heated to 1000 DEG C in nitrogen atmosphere medium-high frequency and is protected
Diamond tool is made in warm 20s.
With high magnification microscope to the section of 2 obtained diamond tool of embodiment 1- embodiments 4 and reference examples 1- reference examples
Pattern is observed, it is found that diamond is firmly bonded in solder in embodiment 1- embodiments 4, diamond and solder
Between without sharp interface, solder structure is fine and close, basic flawless, bubble etc., and is penetrating into matrix with the junction part of matrix,
And there are sharp interface between diamond and the solder of surrounding in reference examples 1, solder structure is loose, in reference examples 2 diamond with
Combination situation between solder has improvement compared with documents 1, but exists compared with multiple cracks, the junction of solder and matrix in solder
There is also sharp interfaces.Metallographic structure point is carried out to embodiment 1- embodiments 4,2 obtained diamond tool of reference examples 1- reference examples
Analysis, also it can be seen that, the solder layer of embodiment 2,3 is more finer and close than embodiment 1,4, wherein going back Dispersed precipitate minimum carbide
Particle.
Embodiment 1- embodiments 4,2 obtained diamond tool of reference examples 1- reference examples are fixed on grinding machine again, with rotation
The alundum wheel of movement carries out Dry Grinding, grinding speed 35.0m/s, grinding depth 30 to diamond tool surface
μm, table feed speed is 15mm/s.Simultaneously using 3 D video microscope and scanning electron microscope to diamond tool
The breakage of upper diamond is observed.It can be seen that the diamond on the diamond tool of embodiment 1, embodiment 4
Grain only seldom fritter is broken, without falling off, embodiment 2, embodiment 3 diamond tool on diamond particles keep substantially
Complete crystalline form, without falling off, there are more serious dropping situations, controls for the diamond particles on the diamond tool of reference examples 1
Diamond particles on the diamond tool of example 2 have the situation of partial exfoliation and bulk breakage.
It should be appreciated that the technical concepts and features of above-described embodiment only to illustrate the invention, its object is to allow be familiar with this
The personage of item technology cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all
According to equivalent change or modification made by spirit of the invention, should be covered by the protection scope of the present invention.
Claims (11)
1. being brazed the paste solder of diamond in a kind of air, it is characterised in that including：88wt%~92wt% solders, 1wt%
~2wt% scaling powders, rest part include binder and water；
The solder includes that mass ratio is 1:0.05~1:0.1 BNi-2 and titanium valve；
The scaling powder includes that mass ratio is 1:0.1~1:1.8 aluminum fluoride and potassium fluoride.
2. being brazed the paste solder of diamond in air according to claim 1, it is characterised in that：The paste solder packet
Water and binder are included, the wherein content of water is 8wt%~10wt%.
3. being brazed the paste solder of diamond in air according to claim 1 or 2, it is characterised in that：The binder
Mass ratio with water is (1~2)：(98~99).
4. being brazed the paste solder of diamond in air according to claim 1 or 2, it is characterised in that：The binder
Including methylcellulose or ethyl cellulose.
5. the paste solder described in any one of claim 1-4 is brazed the purposes of diamond or is being prepared in air atmosphere
Purposes in diamond tool.
6. being brazed the preparation method of the paste solder of diamond in a kind of air, it is characterised in that including：
Binder and water are uniformly mixed to form glue-like lotion,
Solder and scaling powder are uniformly mixed to form the paste solder with the glue-like lotion, the solder includes mass ratio
It is 1:0.05~1:0.1 BNi-2 and titanium valve, the scaling powder include that mass ratio is 1:0.1~1:1.8 aluminum fluoride and fluorination
Potassium；
Wherein, the paste solder includes 88wt%~92wt% solders and 1wt%~2wt% scaling powders.
7. preparation method according to claim 6, it is characterised in that：The quality of the glue-like lotion is the paste pricker
Expect the 8%~10% of quality.
8. preparation method according to claim 6, it is characterised in that：The glue-like lotion is viscous comprising 1wt%~2wt%
Tie agent.
9. the preparation method according to claim 6 or 8, it is characterised in that：The binder includes methylcellulose or second
Base cellulose.
10. a kind of preparation method of diamond tool, it is characterised in that including：By the cream described in any one of claim 1-4
Shape solder is coated on matrix, so that diamond is adsorbed on the paste solder later, is then directly heated in air
1000~1100 DEG C and 10~25s of heat preservation, diamond tool is made.
11. the diamond tool prepared by claim 10 the method.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610999923.1A CN106346169B (en) | 2016-11-14 | 2016-11-14 | Paste solder, preparation method and the application of diamond are brazed in air |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610999923.1A CN106346169B (en) | 2016-11-14 | 2016-11-14 | Paste solder, preparation method and the application of diamond are brazed in air |
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| CN106346169B true CN106346169B (en) | 2018-08-21 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190039189A1 (en) * | 2017-08-03 | 2019-02-07 | Honeywell International Inc. | Free flowing potassium aluminum fluoride flux agent |
| CN108544385B (en) * | 2018-03-05 | 2020-06-26 | 华侨大学 | Diamond grinding head with tungsten carbide as substrate and brazing method thereof |
| CN113319464B (en) * | 2020-09-01 | 2023-02-21 | 郑州机械研究所有限公司 | Annular nickel-based self-brazing solder and preparation method and application thereof |
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|---|---|---|---|---|
| PL217000B1 (en) * | 2010-12-17 | 2014-06-30 | Univ West Pomeranian Szczecin Tech | Method for soldering carbide steels to chrome-nickel steel within large areas |
| RU2552810C1 (en) * | 2013-12-30 | 2015-06-10 | Федеральное государственное бюджетное учреждение науки Институт физико-технических проблем Севера им. В.П. Ларионова Сибирского отделения Российской академии наук | Alloy for diamond monocrystal connection with metals |
| CN105619272A (en) * | 2016-01-11 | 2016-06-01 | 苏州科技学院 | Method for manufacturing single-layer diamond grinding wheel in laser brazing manner |
| CN106041768A (en) * | 2016-05-27 | 2016-10-26 | 华侨大学 | Method for preparing superhard abrasive particle tool through ultrasonic-assisted active connection |
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2016
- 2016-11-14 CN CN201610999923.1A patent/CN106346169B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL217000B1 (en) * | 2010-12-17 | 2014-06-30 | Univ West Pomeranian Szczecin Tech | Method for soldering carbide steels to chrome-nickel steel within large areas |
| RU2552810C1 (en) * | 2013-12-30 | 2015-06-10 | Федеральное государственное бюджетное учреждение науки Институт физико-технических проблем Севера им. В.П. Ларионова Сибирского отделения Российской академии наук | Alloy for diamond monocrystal connection with metals |
| CN105619272A (en) * | 2016-01-11 | 2016-06-01 | 苏州科技学院 | Method for manufacturing single-layer diamond grinding wheel in laser brazing manner |
| CN106041768A (en) * | 2016-05-27 | 2016-10-26 | 华侨大学 | Method for preparing superhard abrasive particle tool through ultrasonic-assisted active connection |
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