SG11202007497WA - Method and system for forming doped regions by diffusion in gallium nitride materials - Google Patents
Method and system for forming doped regions by diffusion in gallium nitride materialsInfo
- Publication number
- SG11202007497WA SG11202007497WA SG11202007497WA SG11202007497WA SG11202007497WA SG 11202007497W A SG11202007497W A SG 11202007497WA SG 11202007497W A SG11202007497W A SG 11202007497WA SG 11202007497W A SG11202007497W A SG 11202007497WA SG 11202007497W A SG11202007497W A SG 11202007497WA
- Authority
- SG
- Singapore
- Prior art keywords
- diffusion
- gallium nitride
- doped regions
- nitride materials
- forming doped
- Prior art date
Links
- 229910002601 GaN Inorganic materials 0.000 title 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title 1
- 238000009792 diffusion process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2258—Diffusion into or out of AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
- H01L21/02642—Mask materials other than SiO2 or SiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
- H01L21/2233—Diffusion into or out of AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/207—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds further characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66143—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66196—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices with an active layer made of a group 13/15 material
- H01L29/66204—Diodes
- H01L29/66212—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8613—Mesa PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862629588P | 2018-02-12 | 2018-02-12 | |
PCT/US2019/017358 WO2019157384A1 (fr) | 2018-02-12 | 2019-02-08 | Procédé et système de formation de régions dopées par diffusion dans des matériaux de nitrure de gallium |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202007497WA true SG11202007497WA (en) | 2020-09-29 |
Family
ID=67540217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202007497WA SG11202007497WA (en) | 2018-02-12 | 2019-02-08 | Method and system for forming doped regions by diffusion in gallium nitride materials |
Country Status (8)
Country | Link |
---|---|
US (1) | US10763110B2 (fr) |
EP (1) | EP3753044B1 (fr) |
JP (1) | JP7328234B2 (fr) |
KR (1) | KR102592686B1 (fr) |
CN (1) | CN111919281B (fr) |
SG (1) | SG11202007497WA (fr) |
TW (1) | TWI796432B (fr) |
WO (1) | WO2019157384A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112447834A (zh) * | 2019-08-30 | 2021-03-05 | 广东致能科技有限公司 | 半导体器件及其制造方法 |
CN114402422A (zh) * | 2019-09-30 | 2022-04-26 | 京瓷株式会社 | 半导体元件的制造方法及半导体装置 |
US11881404B2 (en) | 2020-02-11 | 2024-01-23 | QROMIS, Inc. | Method and system for diffusing magnesium in gallium nitride materials using sputtered magnesium sources |
DE102020215006A1 (de) | 2020-11-30 | 2022-06-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Vertikales Leistungshalbleiterbauelement und Verfahren zur Herstellung eines vertikalen Leistungshalbleiterbauelements |
JP7442428B2 (ja) | 2020-12-11 | 2024-03-04 | 株式会社デンソー | 半導体装置の製造方法 |
CN112820644B (zh) * | 2020-12-31 | 2023-08-15 | 扬州扬杰电子科技股份有限公司 | 一种高阻断电压的氮化镓pn二极管及制备方法 |
TWI817120B (zh) * | 2021-05-14 | 2023-10-01 | 國立臺灣大學 | 嵌入式蕭特基非對稱型超接面功率半導體 |
CN114497228A (zh) * | 2021-12-31 | 2022-05-13 | 山东大学 | 一种基于n型导电SiC衬底的GaN完全垂直型电子器件及其制备方法 |
CN116913958A (zh) * | 2023-03-31 | 2023-10-20 | 南京百识电子科技有限公司 | 一种氮化物半导体外延结构 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11224859A (ja) * | 1998-02-05 | 1999-08-17 | Sanyo Electric Co Ltd | 窒化ガリウム系化合物半導体のドーピング方法および半導体素子の製造方法 |
JP2950316B2 (ja) * | 1998-02-17 | 1999-09-20 | 松下電器産業株式会社 | 窒化ガリウム系化合物半導体発光素子及びその製造方法 |
JP2002026456A (ja) * | 2000-06-30 | 2002-01-25 | Toshiba Corp | 半導体装置、半導体レーザ及びその製造方法並びにエッチング方法 |
US7439609B2 (en) | 2004-03-29 | 2008-10-21 | Cree, Inc. | Doping of gallium nitride by solid source diffusion and resulting gallium nitride structures |
JP2006279023A (ja) * | 2005-03-03 | 2006-10-12 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2008171867A (ja) * | 2007-01-09 | 2008-07-24 | Toyota Central R&D Labs Inc | p型のIII族窒化物半導体の形成方法 |
US8343824B2 (en) * | 2008-04-29 | 2013-01-01 | International Rectifier Corporation | Gallium nitride material processing and related device structures |
JP5713546B2 (ja) * | 2008-09-08 | 2015-05-07 | 三菱電機株式会社 | 半導体装置 |
JP2011114017A (ja) * | 2009-11-24 | 2011-06-09 | Mitsubishi Electric Corp | 窒化物半導体装置の製造方法 |
KR101897481B1 (ko) * | 2010-11-04 | 2018-09-12 | 루미리즈 홀딩 비.브이. | 결정학적으로 이완된 구조에 기초한 고체 상태 발광 디바이스 |
JP2012227456A (ja) * | 2011-04-22 | 2012-11-15 | Panasonic Corp | 半導体装置 |
US8846482B2 (en) * | 2011-09-22 | 2014-09-30 | Avogy, Inc. | Method and system for diffusion and implantation in gallium nitride based devices |
US8741707B2 (en) * | 2011-12-22 | 2014-06-03 | Avogy, Inc. | Method and system for fabricating edge termination structures in GaN materials |
US8891266B2 (en) * | 2012-03-13 | 2014-11-18 | International Business Machines Corporation | Monolithic high voltage multiplier having high voltage semiconductor diodes and high-k capacitors |
JP2013232564A (ja) * | 2012-04-27 | 2013-11-14 | National Institute Of Advanced Industrial & Technology | 半導体装置および半導体装置の製造方法 |
JP6047995B2 (ja) * | 2012-08-22 | 2016-12-21 | 住友電気工業株式会社 | Iii族窒化物半導体を作製する方法、半導体素子を作製する方法、iii族窒化物半導体装置、熱処理を行う方法 |
JP6146042B2 (ja) * | 2013-02-18 | 2017-06-14 | 住友電気工業株式会社 | Iii族窒化物複合基板およびその製造方法、積層iii族窒化物複合基板、ならびにiii族窒化物半導体デバイスおよびその製造方法 |
JP2014110393A (ja) * | 2012-12-04 | 2014-06-12 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
WO2016075927A1 (fr) * | 2014-11-11 | 2016-05-19 | 出光興産株式会社 | Nouveau laminé |
US20180010469A1 (en) | 2015-02-18 | 2018-01-11 | Siemens Aktiengesellschaft | Turbine component thermal barrier coating with crack isolating, cascading, multifurcated engineered groove features |
WO2016147541A1 (fr) * | 2015-03-17 | 2016-09-22 | パナソニック株式会社 | Dispositif à semi-conducteur au nitrure |
WO2016181441A1 (fr) | 2015-05-08 | 2016-11-17 | 富士通株式会社 | Dispositif à semi-conducteur et procédé de fabrication de dispositif à semi-conducteur |
US20170092747A1 (en) * | 2015-09-30 | 2017-03-30 | Sumitomo Electric Industries, Ltd. | Hemt having heavily doped n-type regions and process of forming the same |
DE102016015713B4 (de) * | 2015-12-14 | 2020-12-10 | Globalfoundries Inc. | Verfahren zum Bilden einer Halbleitervorrichtungsstruktur |
US9741581B2 (en) * | 2016-01-11 | 2017-08-22 | Globalfoundries Inc. | Using tensile mask to minimize buckling in substrate |
KR102312040B1 (ko) * | 2016-01-19 | 2021-10-14 | 한국전자통신연구원 | 반도체 소자의 선택적 도핑 방법 |
JP6683044B2 (ja) * | 2016-07-12 | 2020-04-15 | 富士電機株式会社 | 半導体装置の製造方法 |
KR20190107592A (ko) * | 2018-03-12 | 2019-09-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 다색 자기-정렬 콘택 선택적 에칭 |
-
2019
- 2019-02-08 SG SG11202007497WA patent/SG11202007497WA/en unknown
- 2019-02-08 JP JP2020542951A patent/JP7328234B2/ja active Active
- 2019-02-08 CN CN201980022393.7A patent/CN111919281B/zh active Active
- 2019-02-08 EP EP19751380.7A patent/EP3753044B1/fr active Active
- 2019-02-08 WO PCT/US2019/017358 patent/WO2019157384A1/fr unknown
- 2019-02-08 KR KR1020207025984A patent/KR102592686B1/ko active IP Right Grant
- 2019-02-08 US US16/271,704 patent/US10763110B2/en active Active
- 2019-02-12 TW TW108104562A patent/TWI796432B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP3753044A1 (fr) | 2020-12-23 |
US20190252186A1 (en) | 2019-08-15 |
CN111919281B (zh) | 2024-04-02 |
CN111919281A (zh) | 2020-11-10 |
KR102592686B1 (ko) | 2023-10-20 |
TWI796432B (zh) | 2023-03-21 |
JP7328234B2 (ja) | 2023-08-16 |
EP3753044A4 (fr) | 2021-12-08 |
WO2019157384A1 (fr) | 2019-08-15 |
JP2021513228A (ja) | 2021-05-20 |
TW201941430A (zh) | 2019-10-16 |
KR20200120679A (ko) | 2020-10-21 |
EP3753044B1 (fr) | 2023-05-03 |
US10763110B2 (en) | 2020-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11202007497WA (en) | Method and system for forming doped regions by diffusion in gallium nitride materials | |
EP3741146A4 (fr) | Système et procédé de prise en charge d'urllc dans des communications v2x avancées | |
EP3454215A4 (fr) | Procédé pour appeler une procédure à distance dans un dispositif de réseau,et dispositif de réseau | |
EP3525539A4 (fr) | Procédé et dispositif de transmission de taux d'occupation de canal de liaison latérale dans un système de communication sans fil | |
EP3470166A4 (fr) | Procédé et dispositif de découpe de saphir | |
EP3270550A4 (fr) | Procédé et dispositif correspondant pour démarrer un service par l'intermédiaire d'une voix dans un logiciel de communication | |
EP3603303A4 (fr) | Procédé et dispositif d'ordonnacement de demande dans des systèmes iot nb | |
EP3554008A4 (fr) | Procédé, dispositif de réseau et système de réseau pour traiter un message dcn | |
EP3840442A4 (fr) | Procédé et dispositif utilisés dans l'authentification d'une tranche de réseau | |
EP3103899A4 (fr) | Procédé de production d'un cristal de nitrure du groupe iii, cristal de nitrure du groupe iii, dispositif semi-conducteur, et dispositif de production de cristal de nitrure du groupe iii | |
EP3462691A4 (fr) | Procédé, dispositif, et système de détermination de tranche de réseau | |
SG11201706079YA (en) | Self-aligning source, drain and gate process for iii-v nitride mishemts | |
EP3883285A4 (fr) | Procédé et dispositif d'utilisation de tranche de réseau | |
EP3219833A4 (fr) | Dispositif de fabrication de monocristal de nitrure d'élément du groupe iii, procédé de fabrication de monocristal de nitrure d'élément du groupe iii utilisant celui-ci et monocristal de nitrure d'aluminium | |
SG11202104157QA (en) | Precursor composition for forming metal film, metal film forming method using same, and semiconductor device comprising same metal film | |
EP3294038A4 (fr) | Procédé, dispositif et système de relais intrabande lte | |
EP3264446A4 (fr) | Composition de diffusion d'impuretés de type p, procédé de fabrication d'élément semi-conducteur à l'aide de cette composition, cellule solaire, et procédé de fabrication de cette cellule solaire | |
EP3712305A4 (fr) | Film semi-conducteur d'oxyde de type p et son procédé de fabrication | |
EP3525147A4 (fr) | Procédé et dispositif de partage de message dans une région | |
NZ725495A (en) | Doped rare earth nitride materials and devices comprising same | |
EP3506679A4 (fr) | Procédé, terminal et dispositif côté réseau destinés à une nouvelle sélection de cellule dans un système différent | |
EP3522627A4 (fr) | Procédé et dispositif de fourniture de service de données dans un système de communication sans fil | |
EP3677004A4 (fr) | Procédé et dispositif permettant de s'abonner à un service de réseau social | |
EP3890275A4 (fr) | Procédé et dispositif de transmission répétée de message dans un système m2m | |
EP3745785A4 (fr) | Procédé et dispositif pour faire fonctionner un terminal dans un système 5g |