SG11202002554XA - Adhesive film for use in semiconductor device manufacture, semiconductor device, and manufacturing method of semiconductor device - Google Patents
Adhesive film for use in semiconductor device manufacture, semiconductor device, and manufacturing method of semiconductor deviceInfo
- Publication number
- SG11202002554XA SG11202002554XA SG11202002554XA SG11202002554XA SG11202002554XA SG 11202002554X A SG11202002554X A SG 11202002554XA SG 11202002554X A SG11202002554X A SG 11202002554XA SG 11202002554X A SG11202002554X A SG 11202002554XA SG 11202002554X A SG11202002554X A SG 11202002554XA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- manufacturing
- adhesive film
- manufacture
- device manufacture
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 3
- 238000004519 manufacturing process Methods 0.000 title 2
- 239000002313 adhesive film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
- B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/033723 WO2019058425A1 (ja) | 2017-09-19 | 2017-09-19 | 半導体装置製造用接着フィルム |
PCT/JP2018/034514 WO2019059189A1 (ja) | 2017-09-19 | 2018-09-18 | 半導体装置製造用接着フィルム、並びに、半導体装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202002554XA true SG11202002554XA (en) | 2020-04-29 |
Family
ID=65809776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202002554XA SG11202002554XA (en) | 2017-09-19 | 2018-09-18 | Adhesive film for use in semiconductor device manufacture, semiconductor device, and manufacturing method of semiconductor device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7338469B2 (ko) |
KR (1) | KR102528135B1 (ko) |
CN (1) | CN111133564B (ko) |
SG (1) | SG11202002554XA (ko) |
TW (1) | TWI827551B (ko) |
WO (2) | WO2019058425A1 (ko) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3402131B2 (ja) * | 1997-07-11 | 2003-04-28 | 日立電線株式会社 | 半導体パッケージ用基体への接着シートの貼付方法 |
JPH11274244A (ja) * | 1998-03-20 | 1999-10-08 | Sumitomo Metal Mining Co Ltd | 半導体パッケージ支持用金属補強板およびその製造方法 |
JP3542080B2 (ja) * | 2001-03-30 | 2004-07-14 | リンテック株式会社 | 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体 |
JP3933118B2 (ja) * | 2003-10-02 | 2007-06-20 | ソニー株式会社 | 半導体装置の製造方法および半導体装置の製造装置 |
JP4677758B2 (ja) * | 2004-10-14 | 2011-04-27 | 日立化成工業株式会社 | ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法 |
JP2006265411A (ja) | 2005-03-24 | 2006-10-05 | Sekisui Chem Co Ltd | シート状もしくはペースト状接着剤、電子部品装置の製造方法及び電子部品装置 |
JP2007009022A (ja) | 2005-06-29 | 2007-01-18 | Sekisui Chem Co Ltd | シート状接着剤、電子部品装置の製造方法及び電子部品装置 |
JP4762671B2 (ja) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | ダイシングテープ、および半導体ウェハダイシング方法 |
JP5157208B2 (ja) | 2006-03-20 | 2013-03-06 | 日立化成株式会社 | ダイボンドダイシングシート |
JP2010129632A (ja) * | 2008-11-26 | 2010-06-10 | Toppan Printing Co Ltd | 剥離シート付き接着シートおよび金属板貼合装置および金属板貼合方法 |
JP2010245191A (ja) * | 2009-04-02 | 2010-10-28 | Hitachi Chem Co Ltd | フィルム状接着剤 |
KR20120024723A (ko) * | 2009-06-30 | 2012-03-14 | 히다치 가세고교 가부시끼가이샤 | 감광성 접착제, 및 그것을 이용한 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼 및 반도체 장치 |
JP2011151362A (ja) * | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | ダイシングテープ一体型半導体裏面用フィルム |
JP2013157435A (ja) * | 2012-01-30 | 2013-08-15 | Toray Ind Inc | 実装用接着シート、これを用いた実装用接着シート付配線基板ならびに積層体および半導体装置の製造方法 |
JP6133542B2 (ja) * | 2012-02-29 | 2017-05-24 | 日立化成株式会社 | フィルム状接着剤、接着シート及び半導体装置 |
US20150107764A1 (en) * | 2012-07-03 | 2015-04-23 | Toray Industries, Inc. | Process for producing adhesive sheet having singulated adhesive layer, process for producing wiring substrate using the adhesive sheet, method of manufacturing semiconductor equipment, and equipment for producing adhesive sheet |
JP2014033177A (ja) | 2012-07-12 | 2014-02-20 | Denso Corp | 半導体装置の製造方法 |
JP2015090920A (ja) * | 2013-11-06 | 2015-05-11 | 東レ株式会社 | 接着剤層付き半導体ウェハおよびその製造方法ならびにそれを用いた半導体装置の製造方法 |
-
2017
- 2017-09-19 WO PCT/JP2017/033723 patent/WO2019058425A1/ja active Application Filing
-
2018
- 2018-09-18 JP JP2019543646A patent/JP7338469B2/ja active Active
- 2018-09-18 KR KR1020207010061A patent/KR102528135B1/ko active IP Right Grant
- 2018-09-18 SG SG11202002554XA patent/SG11202002554XA/en unknown
- 2018-09-18 CN CN201880060553.2A patent/CN111133564B/zh active Active
- 2018-09-18 WO PCT/JP2018/034514 patent/WO2019059189A1/ja active Application Filing
- 2018-09-19 TW TW107132902A patent/TWI827551B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2019058425A1 (ja) | 2019-03-28 |
KR20200055012A (ko) | 2020-05-20 |
JPWO2019059189A1 (ja) | 2020-11-26 |
TWI827551B (zh) | 2024-01-01 |
JP7338469B2 (ja) | 2023-09-05 |
WO2019059189A1 (ja) | 2019-03-28 |
CN111133564B (zh) | 2024-02-13 |
TW201921524A (zh) | 2019-06-01 |
KR102528135B1 (ko) | 2023-05-02 |
CN111133564A (zh) | 2020-05-08 |
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