TWI827551B - 半導體裝置製造用接著膜以及半導體裝置及其製造方法 - Google Patents

半導體裝置製造用接著膜以及半導體裝置及其製造方法 Download PDF

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Publication number
TWI827551B
TWI827551B TW107132902A TW107132902A TWI827551B TW I827551 B TWI827551 B TW I827551B TW 107132902 A TW107132902 A TW 107132902A TW 107132902 A TW107132902 A TW 107132902A TW I827551 B TWI827551 B TW I827551B
Authority
TW
Taiwan
Prior art keywords
adhesive
film
adhesive sheet
semiconductor device
carrier film
Prior art date
Application number
TW107132902A
Other languages
English (en)
Chinese (zh)
Other versions
TW201921524A (zh
Inventor
大久保恵介
藤尾俊介
夏川昌典
Original Assignee
日商力森諾科股份有限公司
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Publication of TW201921524A publication Critical patent/TW201921524A/zh
Application granted granted Critical
Publication of TWI827551B publication Critical patent/TWI827551B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
TW107132902A 2017-09-19 2018-09-19 半導體裝置製造用接著膜以及半導體裝置及其製造方法 TWI827551B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??PCT/JP2017/033723 2017-09-19
PCT/JP2017/033723 WO2019058425A1 (ja) 2017-09-19 2017-09-19 半導体装置製造用接着フィルム
WOPCT/JP2017/033723 2017-09-19

Publications (2)

Publication Number Publication Date
TW201921524A TW201921524A (zh) 2019-06-01
TWI827551B true TWI827551B (zh) 2024-01-01

Family

ID=65809776

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107132902A TWI827551B (zh) 2017-09-19 2018-09-19 半導體裝置製造用接著膜以及半導體裝置及其製造方法

Country Status (6)

Country Link
JP (1) JP7338469B2 (ko)
KR (1) KR102528135B1 (ko)
CN (1) CN111133564B (ko)
SG (1) SG11202002554XA (ko)
TW (1) TWI827551B (ko)
WO (2) WO2019058425A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265411A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd シート状もしくはペースト状接着剤、電子部品装置の製造方法及び電子部品装置
JP2014033177A (ja) * 2012-07-12 2014-02-20 Denso Corp 半導体装置の製造方法
US20150107764A1 (en) * 2012-07-03 2015-04-23 Toray Industries, Inc. Process for producing adhesive sheet having singulated adhesive layer, process for producing wiring substrate using the adhesive sheet, method of manufacturing semiconductor equipment, and equipment for producing adhesive sheet

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3402131B2 (ja) * 1997-07-11 2003-04-28 日立電線株式会社 半導体パッケージ用基体への接着シートの貼付方法
JPH11274244A (ja) * 1998-03-20 1999-10-08 Sumitomo Metal Mining Co Ltd 半導体パッケージ支持用金属補強板およびその製造方法
JP3542080B2 (ja) * 2001-03-30 2004-07-14 リンテック株式会社 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
JP3933118B2 (ja) * 2003-10-02 2007-06-20 ソニー株式会社 半導体装置の製造方法および半導体装置の製造装置
JP4677758B2 (ja) * 2004-10-14 2011-04-27 日立化成工業株式会社 ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法
JP2007009022A (ja) * 2005-06-29 2007-01-18 Sekisui Chem Co Ltd シート状接着剤、電子部品装置の製造方法及び電子部品装置
JP4762671B2 (ja) * 2005-10-26 2011-08-31 古河電気工業株式会社 ダイシングテープ、および半導体ウェハダイシング方法
JP5157208B2 (ja) 2006-03-20 2013-03-06 日立化成株式会社 ダイボンドダイシングシート
JP2010129632A (ja) * 2008-11-26 2010-06-10 Toppan Printing Co Ltd 剥離シート付き接着シートおよび金属板貼合装置および金属板貼合方法
JP2010245191A (ja) * 2009-04-02 2010-10-28 Hitachi Chem Co Ltd フィルム状接着剤
KR20120024723A (ko) * 2009-06-30 2012-03-14 히다치 가세고교 가부시끼가이샤 감광성 접착제, 및 그것을 이용한 필름상 접착제, 접착 시트, 접착제 패턴, 접착제층 부착 반도체 웨이퍼 및 반도체 장치
JP2011151362A (ja) * 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
JP2013157435A (ja) * 2012-01-30 2013-08-15 Toray Ind Inc 実装用接着シート、これを用いた実装用接着シート付配線基板ならびに積層体および半導体装置の製造方法
JP6133542B2 (ja) * 2012-02-29 2017-05-24 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
JP2015090920A (ja) * 2013-11-06 2015-05-11 東レ株式会社 接着剤層付き半導体ウェハおよびその製造方法ならびにそれを用いた半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006265411A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd シート状もしくはペースト状接着剤、電子部品装置の製造方法及び電子部品装置
US20150107764A1 (en) * 2012-07-03 2015-04-23 Toray Industries, Inc. Process for producing adhesive sheet having singulated adhesive layer, process for producing wiring substrate using the adhesive sheet, method of manufacturing semiconductor equipment, and equipment for producing adhesive sheet
JP2014033177A (ja) * 2012-07-12 2014-02-20 Denso Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
KR102528135B1 (ko) 2023-05-02
WO2019059189A1 (ja) 2019-03-28
CN111133564A (zh) 2020-05-08
SG11202002554XA (en) 2020-04-29
JPWO2019059189A1 (ja) 2020-11-26
TW201921524A (zh) 2019-06-01
WO2019058425A1 (ja) 2019-03-28
KR20200055012A (ko) 2020-05-20
CN111133564B (zh) 2024-02-13
JP7338469B2 (ja) 2023-09-05

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