TWI827551B - Adhesive film for semiconductor device manufacturing, semiconductor device and manufacturing method thereof - Google Patents

Abstract

The adhesive film of the present disclosure includes: a strip-shaped carrier film with a width of 100 mm or less; and a plurality of adhesive sheets arranged on the carrier film in a manner arranged along the longitudinal direction of the carrier film; and the adhesive sheet has a shape of rectangular or At least one side of the square is formed in a shape having at least one of a convex portion and a concave portion. The semiconductor device of the present disclosure includes: a semiconductor wafer; a substrate electrically connected to the semiconductor wafer; and an adhesive sheet disposed between the semiconductor wafer and the substrate to bond the semiconductor wafer and the substrate; and the shape of the semiconductor wafer is consistent with the shape of the adhesive sheet. The shapes are different.

Description

Adhesive film for semiconductor device manufacturing, semiconductor device and manufacturing method thereof

The present disclosure relates to an adhesive film used in a manufacturing process of a semiconductor device and a semiconductor device and a manufacturing method thereof.

Previously, semiconductor devices were manufactured through the following steps. First, the semiconductor wafer is attached to the die cutting adhesive sheet, and in this state, the semiconductor wafer is diced into semiconductor wafers. Thereafter, the picking step, the assembly step, the reflow step, the die bonding step, etc. are implemented. Patent Document 1 discloses an adhesive sheet (die-bonding wafer) that has both the function of fixing the semiconductor wafer in the die-cutting step and the function of bonding the semiconductor wafer to the substrate in the die-bonding step. [Prior Art Documents] [Patent Documents]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-288170

[Problem to be Solved by the Invention] However, in recent years, with the evolution of semiconductor devices for small components represented by smartphones, the manufacturing process of semiconductor devices has also undergone significant changes compared with the past. For example, the practical application of a process that does not perform the die cutting step and the die bonding step using the adhesive wafer (die die bonding wafer) described in Patent Document 1 or the process that does not implement the reflow step is advancing. Along with this, new aspects are also required for adhesive films used in the manufacturing process of semiconductor devices. In addition to the above-mentioned cases, the inventors of the present invention have been promoting the development of a method for attaching a shape corresponding to a defined specific area of a substrate in order to cope with the increase in functionality and thinness of small components equipped with semiconductor devices. A useful adhesive film for semiconductor wafers.

In previous semiconductor devices, the shape of the semiconductor wafer is usually the same as the shape of the adhesive sheet used to bond it to the substrate, such as a rectangle or a square. However, for example, when the area of the substrate to which the semiconductor wafer should be connected is limited, or when the semiconductor wafer and the substrate need to be electrically connected at a different position than before, a more complicated shape than the previous shape is used. The demand for adhesive tablets has increased.

An object of the present disclosure is to provide an adhesive film including a complex-shaped adhesive sheet that is useful for efficiently performing an adhesive step in a manufacturing process of a semiconductor device. In addition, an object of this disclosure is to provide a semiconductor device using a complex-shaped adhesive sheet and a manufacturing method thereof. [Means to solve the problem]

The adhesive film for semiconductor device manufacturing of the present disclosure includes: a strip-shaped carrier film with a width of 100 mm or less; and a plurality of adhesive sheets arranged on the carrier film so as to be arranged along the longitudinal direction of the carrier film; and the adhesive sheets It has a shape in which at least one of a convex part and a concave part is formed on at least one side of a rectangle or a square.

According to this adhesive film, a plurality of adhesive sheets arranged so as to be arranged on the carrier film can be picked up in order, and then each adhesive sheet can be arranged in a predetermined area of the substrate, and the substrate and the semiconductor wafer can be efficiently connected. next steps. For example, if the tape-shaped adhesive film is wound on a reel, the adhesive step can be performed more efficiently by a roll-to-roll system. As described above, the adhesive sheet has a complex shape such as a rectangular or square shape. The shape of the adhesive sheet may be appropriately set according to the shape of the region of the substrate to which the semiconductor wafer is to be bonded or the shape of the semiconductor wafer. For example, the adhesive sheet may have 6 or more corners, or may have 8 or more corners. In addition, an L-shape is mentioned as an example of the shape of the adhesive sheet which has 6 corners.

The size, number, etc. of the adhesive sheets arranged on the carrier film may be appropriately set according to the design of the semiconductor device to be manufactured. For example, the area of one adhesive sheet can be set in the range of 10 mm ² to 200 mm ² . Based on the area of the carrier film, the proportion of the surface of the carrier film that is covered by the plurality of adhesive sheets can be set to 10% to 60%. One or more rows containing the plurality of adhesive sheets may also be formed on the carrier film.

The plurality of adhesive sheets can be formed, for example, by die-cutting the adhesive layer formed so as to cover the surface of the carrier film. From the viewpoint of the processability of the adhesive film (the aspect of preventing the adhesive sheet from being inadvertently peeled off from the carrier film during die-cutting and thereafter), the adhesion force between the carrier film and the adhesive sheet is preferably 0.5 N/ m～18 N/m.

The adhesive film of the present disclosure may further include a protective member that covers the second surface of the adhesive sheet on the opposite side to the first surface on the carrier film side and has the same shape as the adhesive sheet. By covering the adhesive sheet with the protective member, dust and the like can be prevented from adhering to the adhesive sheet until use. The adhesive sheet and the protective member can be formed by die-cutting the adhesive layer formed to cover the surface of the carrier film and the protective film arranged to cover the adhesive layer.

The light transmittance of the protective member is preferably lower than the light transmittance of the carrier film. By adopting the above structure, the position of the adhesive sheet can be recognized using elements such as a camera, and the bonding step can be easily fully automated.

From the viewpoint of the workability of the bonding step between the semiconductor wafer and the substrate, the adhesive force between the adhesive sheet and the protective member is preferably 16 N/m or less. For example, when the adhesive sheet contains a thermosetting resin composition, it is preferable that the adhesive force between the adhesive sheet and the protective member is 16 N/ m or less. [Effects of the invention]

According to the present disclosure, it is possible to provide an adhesive film including a complex-shaped adhesive sheet that is useful for efficiently performing an adhesive step in a manufacturing process of a semiconductor device. In addition, according to the present disclosure, a semiconductor device using a complex-shaped adhesive sheet and a manufacturing method thereof can be provided.

Hereinafter, embodiments of the present disclosure will be described with appropriate reference to the drawings. In addition, the present invention is not limited to the following embodiments. In this specification, (meth)acrylic acid means acrylic acid or methacrylic acid.

<Adhesive film for semiconductor device manufacturing> Fig. 1 is a perspective view schematically showing the adhesive film of this embodiment. FIG. 2 is a cross-sectional view along line II-II shown in FIG. 1 . The adhesive film 10 shown in these figures includes: a strip-shaped carrier film 1 with a width of 100 mm or less; and is arranged on the carrier film so as to be arranged along the longitudinal direction of the carrier film 1 (the direction of the arrow X shown in Figure 1). a plurality of adhesive sheets 3p on 1; and a protective member 5p that covers the surface F2 of the adhesive sheet 3p and has the same shape as the adhesive sheet 3p. As shown in FIG. 2 , surface F2 (second surface) of the adhesive sheet 3 p is the surface on the opposite side to the surface F1 (first surface) on the carrier film 1 side of the adhesive sheet 3 p.

The bonding film 10 can be applied to various bonding steps in the manufacturing process of semiconductor devices (eg, bonding a semiconductor wafer and a substrate). According to the adhesive film 10, a plurality of adhesive sheets 3p arranged so as to be arranged on the carrier film 1 can be picked up sequentially, and each adhesive sheet 3p can then be arranged in a predetermined area of the substrate, and the substrate can be efficiently implemented. Subsequent step with semiconductor wafer. Furthermore, FIGS. 1 and 2 illustrate a case where one row 3A including a plurality of adhesive sheets 3 p is provided on the carrier film 1 , but two or more rows 3A may be provided on the carrier film 1 .

As shown in FIG. 1 , the adhesive sheet 3 p of this embodiment has a shape like a thick T (T-shape). As shown in Figure 3(a), this shape has eight corners C1 to C8. Furthermore, this shape may be called a shape in which a convex part is formed in the center of one side of the rectangle, or may be called a shape in which a concave part is formed in both ends of one side of the rectangle.

The shape of the adhesive tablet 3p is not limited to the shape shown in FIG. 3(a) , as long as it is a shape in which at least one of a convex part and a recessed part is formed on at least one side of a rectangle or a square. For example, as shown in FIG. 3(b) , it may be L-shaped and may have six corners C1 to C6. As shown in FIG. 3(c) , it may be a shape in which one recess is formed in a rectangle or a square, and may have eight corners C1 to C8. As shown in Figure 3(d), a recess may be formed at one corner of the rectangle or square (the lower left in Figure 3(d)) and a convex part may be formed on one side (the right side in Figure 3(d)). The shape of the part has 10 corners C1 to C10. As shown in FIG. 3(e) , it may be a shape in which a convex part is formed on one side of a rectangle or a square and a recessed part is formed on the other side, and it may have 12 corners C1 to C12. Furthermore, as shown in FIG. 3(f) , the shape of the concave portion or the convex portion may be triangular or arc-shaped.

The shape of the adhesive sheet may be appropriately set according to the shape of the region of the substrate to which the semiconductor wafer is to be bonded or the shape of the semiconductor wafer. In addition, the semiconductor wafer has a rectangular or square shape, for example, and a plurality of terminals are provided at its corners. When it is necessary to connect these terminals to wiring on the substrate, the connection can be determined so that the terminals and wiring are not covered by the adhesive sheet. Tablet shape. FIG. 4 is a plan view showing an example of the arrangement of the T-shaped adhesive sheet 3 p and the rectangular semiconductor wafer S. In the regions R1 and R2 shown in FIG. 4 , there is no adhesive between the substrate and the semiconductor wafer, and the substrate and the semiconductor wafer can be electrically connected in these regions R1 and R2 .

The adhesive sheet 3p in this embodiment is assumed to be sufficiently small in size. The area of one adhesive sheet 3p is, for example, 10 mm ² to 200 mm ² , or may be 20 mm ² to 160 mm ² or 25 mm ² to 100 mm. ² . Based on the area of the carrier film 1, the proportion of the surface of the carrier film 1 that is covered by the plurality of adhesive sheets 3p (the area ratio of the adhesive sheets) is, for example, 10% to 60%, or may be 10% to 3p. 35% or 15%~33%. This area ratio can be calculated by dividing the area A of one adhesive sheet 3p by the pitch (pitch P in FIG. 1 ) of the adhesive sheets 3p provided on the carrier film 1 and the width of the carrier film 1 ( The product of the width W) in Figure 1. That is, the area ratio R may be a value calculated using the following equation. Area ratio R (%) = A/(P×W)×100

Hereinafter, the structure of the adhesive film 10 is demonstrated. [Carrier Film] As described above, the carrier film 1 is strip-shaped and has a width of 100 mm or less. The width of the carrier film 1 may be appropriately set according to the size of the adhesive sheet 3p placed thereon and the number of rows 3A. For example, as shown in Figure 1, when the number of rows 3A is one, the width of the carrier film 1 is preferably 10 mm to 50 mm, and may also be 10 mm to 30 mm or 10 mm to 20 mm. When the width of the carrier film 1 is 10 mm or more, when the roll-to-roll method is used, it is easy to prevent the carrier film 1 from being twisted, resulting in a decrease in workability.

The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied during the manufacturing process of the adhesive film 10 and the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of visibility of the adhesive sheet 3p and/or the protective member 5p placed thereon. As the carrier film 1, polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyethylene acetate films, Homopolymers or copolymers such as poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, or mixtures thereof, such as polyolefin films, polyvinyl chloride films, polyethylene films, etc. Imide film and other plastic films. The carrier film 1 can be a single-layer structure or a multi-layer structure.

The thickness of the carrier film 1 may be appropriately selected within a range that does not impair workability, for example, 10 μm to 200 μm, 20 μm to 100 μm, or 25 μm to 80 μm. These thickness ranges are a range that has no practical problems and is also economically effective.

In order to improve the adhesive force of the adhesive sheet 3p relative to the carrier film 1, the surface of the carrier film 1 can be subjected to chemical or physical treatments such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment. Sexual surface treatment. As the carrier film 1, a film containing a fluororesin and having a low surface energy can also be used. Examples of such films include A-63 (die-cutting treatment agent: modified silicone type) manufactured by Teijin Film Solutions Co., Ltd. and Teijin Film Solutions Co., Ltd. A-31 (Die-cutting treatment agent: Pt-based silicone-based), etc.

In order to prevent the adhesive force of the adhesive sheet 3 p with respect to the carrier film 1 from becoming excessively high, a mold containing a silicone-based release agent, a fluorine-based release agent, a long-chain alkyl acrylate-based release agent, etc. may also be formed on the surface of the carrier film 1 Die-cut layer of cutting agent.

The adhesion force between the carrier film 1 and the adhesive sheet 3p is preferably 0.5 N/m to 18 N/m, more preferably 2 N/m to 10 N/m, and may also be 2 N/m to 6 N/m. m or 2 N/m～4 N/m. When the adhesive force is 0.5 N/m or more, it is easy to prevent the adhesive sheet 3p from being inadvertently peeled off from the carrier film 1 during the manufacturing process of the adhesive film 10. On the other hand, when the adhesive force is 18 N/m or less , when using the adhesive film 10, it is easy to stably pick up the adhesive sheet 3p and the protective member 5p covering it from the carrier film 1. In addition, the adhesive force of the adhesive sheet 3p with respect to the carrier film 1 refers to the 90° peel strength. Specifically, it refers to the peeling strength prepared by forming on the carrier film 1 a film containing the same composition as the adhesive sheet 3p. The peel strength of a sample of an adhesive layer with a width of 20 mm is measured when the adhesive layer is peeled off from the carrier film at an angle of 90° and a peeling speed of 50 mm/min.

[Adhesive sheet] The adhesive sheet 3p is formed with the protective member 5p by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3. formed together (see Figure 6). The thickness of the adhesive sheet 3p may be appropriately selected within a range that does not impair workability, for example, 3 μm to 50 μm, 5 μm to 40 μm, or 7 μm to 30 μm. When the thickness of the adhesive sheet 3p is 3 μm or more, it is easy to ensure sufficient adhesion. On the other hand, when the thickness of the adhesive sheet 3p is 50 μm or less, it is easy to suppress the self-adhesion of the adhesive composition constituting the adhesive sheet 3p. The protective member 5p leaked out.

The adhesive composition constituting the adhesive sheet 3p only needs to have properties (for example, adhesiveness and heat resistance to heat of about 150°C) that can be used without problems in the manufacturing process of semiconductor devices. Those used in the manufacturing process of semiconductor devices can be used. The adhesive sheet 3p preferably contains a thermoplastic resin, a thermosetting resin, a hardening accelerator and a filler, and may also contain a photoreactive monomer, a photopolymerization initiator, etc. if necessary. As the substrate becomes thinner, there is a tendency to use a substrate with low heat resistance, and there is a tendency to require a lower temperature in the manufacturing process of the semiconductor device. The adhesive sheet 3p is preferably capable of adhering to the object under temperature conditions of 160° C. or lower.

(Thermoplastic Resin) As the thermoplastic resin, a resin having thermoplasticity or a resin having thermoplasticity at least in an uncured state and forming a cross-linked structure after heating can be used. The thermoplastic resin is preferably a (meth)acrylic copolymer having a reactive group (hereinafter, sometimes also referred to as "containing (Meth)acrylic acid copolymer with reactive groups"). When containing a reactive group-containing (meth)acrylic copolymer as the thermoplastic resin, the adhesive sheet 3p may be in a form that does not contain a thermosetting resin. That is, an aspect including a reactive group-containing (meth)acrylic copolymer, a hardening accelerator, and a filler may be used.

Thermoplastic resin can be used individually by 1 type or in combination of 2 or more types.

Examples of the (meth)acrylic copolymer include (meth)acrylate copolymers such as acrylic resin and acrylic rubber, and acrylic rubber is preferred. The acrylic rubber is preferably formed by copolymerizing a monomer selected from (meth)acrylate and acrylonitrile, mainly containing acrylate.

Examples of (meth)acrylates include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, and 2-ethyl acrylate. Hexyl methacrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate Ester, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, etc.

As the (meth)acrylate copolymer, a copolymer containing butyl acrylate and acrylonitrile as copolymerization components, and a copolymer containing ethyl acrylate and acrylonitrile as copolymerization components are preferred.

The reactive group-containing (meth)acrylic acid copolymer is preferably a reactive group-containing (meth)acrylic acid copolymer containing a (meth)acrylic acid monomer having a reactive group as a copolymerization component. Such a reactive group-containing (meth)acrylic acid copolymer can be obtained by copolymerizing a monomer composition containing a (meth)acrylic acid monomer having a reactive group and the monomer.

As the reactive group, from the viewpoint of improving heat resistance, an epoxy group, a carboxyl group, an acrylic group, a methacrylic group, a hydroxyl group, and an episulfide group are preferred. Among them, in terms of crosslinkability, More preferred are epoxy group and carboxyl group.

In this embodiment, the reactive group-containing (meth)acrylic copolymer is preferably an epoxy group-containing (meth)acrylic copolymer containing a (meth)acrylic monomer having an epoxy group as a copolymer component. . In this case, examples of the (meth)acrylic monomer having an epoxy group include glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexylmethyl acrylate, and methyl acrylate. Glycidyl acrylate, 4-hydroxybutyl methacrylate glycidyl ether, 3,4-epoxycyclohexylmethyl methacrylate, etc. From the viewpoint of heat resistance, the (meth)acrylic monomer having a reactive group is preferably glycidyl acrylate or glycidyl methacrylate.

The Tg of the thermoplastic resin is preferably -50°C to 50°C. If the Tg of the thermoplastic resin is 50° C. or less, the flexibility of the adhesive sheet 3p can be easily ensured. In addition, when it is attached to an adherend, it is easy to follow and has moderate adhesion even if there are irregularities. On the other hand, if the Tg of the thermoplastic resin is -50° C. or higher, it is easy to suppress the flexibility of the adhesive sheet 3p from becoming too high, and it is possible to achieve excellent handleability, adhesiveness, and peelability.

The Tg of a thermoplastic resin is the midpoint glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is the midpoint glass transition calculated by measuring the heat change under the conditions of a temperature increase rate of 10°C/min and a measurement temperature of -80°C to 80°C, and calculating it based on the method of JIS K 7121:1987. temperature.

The weight average molecular weight of the thermoplastic resin is preferably not less than 100,000 and not more than 2,000,000. If the weight average molecular weight is 100,000 or more, heat resistance can be easily ensured when used for temporary fixation. On the other hand, if the weight average molecular weight is 2 million or less, when used for temporary fixation, it is easy to suppress a decrease in flow and adhesion. From this viewpoint, the weight average molecular weight of the thermoplastic resin is more preferably 500,000 or more and 2,000,000 or less, and further more preferably 1,000,000 or more and 2,000,000 or less. In addition, the weight average molecular weight is a polystyrene-converted value obtained by gel permeation chromatography (GPC) using a standard polystyrene calibration curve.

When the (meth)acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymer component, the total content of these components is preferably 0.1 based on the total amount of the copolymer components. The content is % by mass to 20% by mass, preferably 0.5% by mass to 15% by mass, and further preferably 1.0% by mass to 10% by mass. When the content is within the above range, it is easy to achieve all of the flexibility, adhesiveness and peelability of the adhesive sheet 3p at a higher level.

As the above-mentioned (meth)acrylic acid copolymer having a reactive group, one obtained by polymerization methods such as pearl polymerization and solution polymerization can also be used. Alternatively, commercially available products such as HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Co., Ltd.) can also be used.

(Thermosetting resin) As the thermosetting resin, if it is a resin that hardens by heat, it can be used without particular limitation. Examples of the thermosetting resin include epoxy resin, acrylic resin, silicone resin, phenol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, urea resin, and the like. These can be used individually by 1 type or in combination of 2 or more types.

The epoxy resin is not particularly limited as long as it has a heat-resistant effect for curing. As the epoxy resin, bifunctional epoxy resins such as bisphenol A type epoxy; novolak type epoxy resins such as phenol novolak type epoxy resin and cresol novolak type epoxy resin can be used. In addition, as the epoxy resin, conventionally known ones such as polyfunctional epoxy resin, glycidyl amine type epoxy resin, heterocyclic ring-containing epoxy resin, alicyclic epoxy resin, etc. can be used.

As bisphenol A-type epoxy resin, there are: Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, Epikote 1009 (all manufactured by Mitsubishi Chemical Co., Ltd.); DER-330, DER-301, DER-361 (all manufactured by Dow Chemical Co., Ltd.); YD8125, YDF8170 (all manufactured by Nippon Steel and Sumitomo Metal Chemical Co., Ltd. manufactured by the company), etc. Examples of phenol novolak type epoxy resins include: Epikote 152, Epikote 154 (both manufactured by Mitsubishi Chemical Co., Ltd.); EPPN-201 (Nippon Chemical Co., Ltd. (manufactured by Dow Chemical Company); DEN-438 (manufactured by Dow Chemical Company), etc.

Examples of o-cresol novolac type epoxy resin include: YDCN-700-10 (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.); EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, and EOCN-1025 , EOCN-1027 (all manufactured by Nippon Chemical Co., Ltd.); YDCN701, YDCN702, YDCN703, YDCN704 (all manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.), etc.

Examples of multifunctional epoxy resins include: Epon 1031S (manufactured by Mitsubishi Chemical Co., Ltd.); Araldite 0163 (manufactured by BASF Japan); Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-421, EX-411, EX-321 (all manufactured by Nagase ChemteX Co., Ltd.) wait.

Examples of amine-type epoxy resins include: Epikote 604 (manufactured by Mitsubishi Chemical Co., Ltd.); YH-434 (manufactured by Nippon Steel and Sumitomo Metal Chemical Co., Ltd.); TETRAD-X , TETRAD-C (both manufactured by Mitsubishi Gas Chemical Co., Ltd.); ELM-120 (manufactured by Sumitomo Chemical Co., Ltd.), etc.

Examples of heterocyclic-containing epoxy resins include: Araldite PT810 (manufactured by BASF Japan); ERL4234, ERL4299, ERL4221, and ERL4206 (all manufactured by Union Carbide) wait. These epoxy resins can be used individually by 1 type or in combination of 2 or more types.

As the epoxy resin hardener that is a part of the thermosetting resin component, a commonly used known resin can be used. Specifically, examples include: amines; polyamides; acid anhydrides; polysulfides; boron trifluoride; those having two or more phenolic hydroxyl groups in one molecule such as bisphenol A, bisphenol F, and bisphenol S. Bisphenols; phenol novolac resin, bisphenol A novolac resin, cresol novolac resin and other phenolic resins. As the epoxy resin hardener, in particular, from the viewpoint of excellent resistance to electric corrosion when absorbing moisture, phenol resins such as phenol novolak resin, bisphenol A novolak resin, and cresol novolak resin are preferred. Furthermore, epoxy hardener can be used simultaneously with epoxy resin or alone.

Among the phenolic resin hardeners, it is preferable to use Phenolite LF4871, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170 (both manufactured by DIC Co., Ltd., trade name); H-1 (manufactured by Meiwa Chemical Co., Ltd., trade name); Epi- Cure) MP402FPY, Epi-Cure YL6065, Epi-Cure YLH129B65, Milex XL, Milex XLC, Milex XLC-LL, Milex ( Milex) RN, Milex (Milex) RS, Milex (Milex) VR (all manufactured by Mitsubishi Chemical Co., Ltd., trade names) and other structural materials.

The content of the thermosetting resin in the adhesive sheet 3p is preferably from 10 parts by mass to 500 parts by mass, more preferably from 30 parts by mass to 450 parts by mass, and further preferably from 50 parts by mass to 100 parts by mass of the thermoplastic resin. 400 parts by mass. When the content of the thermosetting resin is within the above range, it is easy to achieve excellent adhesiveness after thermosetting of the adhesive sheet 3p.

(Harding accelerator) Examples of the hardening accelerator include: imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, and 2-ethyl-4 -Methylimidazole-tetraphenylborate, 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate, etc. These can be used individually by 1 type or in combination of 2 or more types.

When the adhesive sheet 3p contains a (meth)acrylic copolymer having an epoxy group, it is preferable to contain a curing accelerator that accelerates curing of the epoxy groups contained in the acrylic copolymer. Examples of hardening accelerators that accelerate the hardening of epoxy groups include phenol-based hardeners, acid anhydride-based hardeners, amine-based hardeners, imidazole-based hardeners, imidazoline-based hardeners, triazine-based hardeners, and phosphine-based hardeners. agent. Among these, from the viewpoints of rapid curing properties, heat resistance, and peelability, an imidazole-based curing agent can be expected to shorten the step time and improve the workability. These compounds can be used individually by 1 type or in combination of 2 or more types.

The content of the hardening accelerator in the adhesive sheet 3p is preferably 0.01 to 50 parts by mass, more preferably 0.02 to 20 parts by mass, and still more preferably 0.025 to 10 parts by mass relative to 100 parts by mass of the thermoplastic resin. parts by mass. When the content of the curing accelerator is within the above range, the curing properties of the adhesive sheet 3p can be improved while the decrease in storage stability tends to be sufficiently suppressed.

(Inorganic filler) The adhesive tablet 3p preferably contains an inorganic filler. Examples of inorganic fillers include metal fillers such as silver powder, gold powder, and copper powder; silica, alumina, boron nitride, titania, glass, iron oxide, and ceramics. ) and other non-metallic inorganic fillers. Inorganic fillers can be selected based on desired functionality.

The inorganic filler preferably has an organic group on its surface. By modifying the surface of the inorganic filler with an organic group, it is easy to achieve both the dispersibility in the organic solvent when preparing the varnish used to form the adhesive sheet 3p and the high elastic modulus and excellent peelability of the adhesive sheet 3p.

The inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) and an inorganic filler, and stirring at a temperature of 30° C. or higher. The surface modification of the inorganic filler with organic groups can be confirmed by ultraviolet (UV) measurement, infrared ray (Infrared Radiation, IR) measurement, X-ray photoelectron spectroscopy (XPS) measurement, etc.

[Chemical 1]

In formula (B-1), As for the organic group in the group, s represents 0 or an integer from 1 to 10, and R ¹¹ , R ¹² and R ¹³ each independently represent an alkyl group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, isopropyl, isobutyl, etc. . From the viewpoint of easy availability, the alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group and a pentyl group. From the viewpoint of heat resistance, X is preferably an amino group, a glycidoxy group, a mercapto group and an isocyanate group, and more preferably a glycidyloxy group and a mercapto group. From the viewpoint of suppressing film fluidity at high heat and improving heat resistance, s in formula (B-1) is preferably 0 to 5, and more preferably 0 to 4.

Examples of the silane coupling agent include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, and vinyltrimethoxysilane. , vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N -(2-Aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidoxysilane Propyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatopropyltriethyl Oxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethyl Butylene)-3-(triethoxysilyl)-1-propylamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylene propyltriane Oxysilane, polyethoxydimethylsiloxane, etc. Among these, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, and 3-mercaptopropyltrimethyl Oxysilane is more preferably trimethoxyphenylsilane, 3-glycidoxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane. A silane coupling agent can be used individually by 1 type or in combination of 2 or more types.

From the viewpoint of achieving a balance between heat resistance and storage stability, the content of the coupling agent is preferably 0.01 to 50 parts by mass, and more preferably 0.05 to 20 parts by mass relative to 100 parts by mass of the inorganic filler. , from the viewpoint of improving heat resistance, it is more preferably 0.5 parts by mass to 10 parts by mass.

The content of the inorganic filler in the adhesive sheet 3p is preferably 600 parts by mass or less, more preferably 500 parts by mass or less, and still more preferably 400 parts by mass or less based on 100 parts by mass of the thermoplastic resin. The lower limit of the content of the inorganic filler is not particularly limited, but it is preferably 5 parts by mass or more, and more preferably 8 parts by mass or more based on 100 parts by mass of the thermoplastic resin. By setting the content of the inorganic filler within the above range, shrinkage associated with thermal hardening can be suppressed, and the high elastic modulus and excellent peelability of the adhesive sheet 3p can be easily coexisted.

(Organic filler) The adhesive sheet 3p may contain an organic filler. Examples of organic fillers include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, polyimide fine particles, and the like. The content of the organic filler is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and still more preferably 100 parts by mass or less based on 100 parts by mass of the thermoplastic resin. The lower limit of the content of the organic filler is not particularly limited, but is preferably 5 parts by mass or more based on 100 parts by mass of the thermoplastic resin.

(Organic solvent) The adhesive tablet 3p can be diluted with an organic solvent if necessary. The organic solvent is not particularly limited and can be determined based on the boiling point, taking into consideration the volatility during film formation, etc. Specifically, from the viewpoint of difficulty in hardening the film during film formation, methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, and methylethyl alcohol are preferred. Solvents with relatively low boiling points such as ketone, acetone, methyl isobutyl ketone, toluene, and xylene. In addition, for the purpose of improving film-forming properties, it is preferable to use a solvent with a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone. These solvents can be used individually by 1 type or in combination of 2 or more types.

[Protective Member] The protective member 5 p is formed together with the adhesive sheet 3 p by simultaneously die-cutting the adhesive layer 3 formed to cover the surface of the carrier film 1 and the protective film 5 arranged to cover the adhesive layer 3 Former (see Figure 6). The protective member 5p of this embodiment is formed simultaneously with the adhesive sheet 3p by die cutting, and therefore has substantially the same shape as the adhesive sheet 3p. The protective film 5 may be any one that can be press-processed in the manufacturing process of the adhesive film 10 and the protective member 5p can be easily peeled off from the adhesive sheet 3p in the manufacturing process of the semiconductor device.

The adhesive force between the adhesive sheet 3p and the protective member 5p is preferably 16 N/m or less, more preferably 10 N/m or less, and may be 5 N/m or less or 4.5 N/m or less. In particular, when the adhesive sheet 3p contains a thermosetting resin composition, it is preferable that the adhesive force of the protective member 5p with respect to the adhesive sheet 3p is: the stated range. By having the adhesion force of 16 N/m or less, the adhesive sheet 3 p in a state covered with the protective member 5 p can be temporarily pressure-bonded to an adherend (such as a substrate) under conditions such as 100° C. and 3 seconds. Afterwards, the protective member 5p can be easily peeled off from the adhesive sheet 3p using an adhesive tape or the like. In addition, the adhesive force of the protective member 5p with respect to the adhesive sheet 3p refers to the 90° peel strength. Specifically, it refers to the peeling strength prepared from a 20 mm wide adhesive containing the same composition as the adhesive sheet 3p. Peel strength measured when the protective film is peeled off from the adhesive layer at an angle of 90° and a peeling speed of 300 mm/min for a sample with a protective film of the same width placed on the layer.

As the protective film 5, polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyethylene acetate film, etc. can be used. Homopolymers or copolymers such as poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, or mixtures thereof, such as polyolefin films, polyvinyl chloride films, polyethylene films, etc. Imide film and other plastic films. The protective film 5 may have a single-layer structure or a multi-layer structure. By covering the adhesive layer 3 with the protective film 5 , excessive tension on the adhesive layer 3 can be suppressed, and foreign matter can be prevented from being mixed into the adhesive layer 3 during die cutting.

The thickness of the protective film 5 can be appropriately selected within a range that does not impair workability, for example, 10 μm to 200 μm, 20 μm to 100 μm, or 25 μm to 80 μm. These thickness ranges are a range that has no practical problems and is also economically effective.

The light transmittance of the protective member 5 p is preferably lower than the light transmittance of the carrier film 1 . By adopting the above structure, the position, orientation, etc. of the adhesive sheet 3p can be recognized using elements such as a camera, and the bonding step in the manufacturing process of the semiconductor device can be easily automated. For example, as the protective member 5p, it is preferable to use one colored so that the transmittance of light with a wavelength of 500 nm is less than 10% (more preferably less than 7%).

<The manufacturing method of the adhesive film> Next, the manufacturing method of the adhesive film 10 is demonstrated. The manufacturing method of this embodiment includes the following steps. (A) The step of preparing the laminated body 20 having a strip-shaped carrier film 1 with a width of 100 mm or less, an adhesive layer 3 formed to cover the surface of the carrier film 1, and an adhesive layer 3 covering the surface of the carrier film 1. The protective film is configured in 5 ways. (B) A step of die-cutting the adhesive layer 3 and the protective film 5 in the laminated body 20 to obtain a plurality of adhesive sheets 3 p arranged on the carrier film 1 so as to be arranged along the longitudinal direction of the carrier film 1 .

FIG. 5 is a cross-sectional view schematically showing the laminated body 20 prepared in step (A). The laminated body 20 can be produced as follows. First, a coating liquid in which the raw resin composition of the adhesive layer 3 is dissolved in a solvent such as an organic solvent and varnished is prepared. After applying this coating liquid on the carrier film 1, the solvent is removed, thereby forming the adhesive layer 3. Examples of coating methods include knife coating, roller coating, spray coating, gravure coating, rod coating, curtain coating, and the like. Then, the protective film 5 is bonded to the surface of the adhesive layer 3 under conditions of normal temperature to 60°C. Thereby, the laminated body 20 can be obtained. Furthermore, a laminated film may be produced by forming the adhesive layer 3 on a carrier film with a wide width and then laminating the protective film 5 so as to cover it, and then cut (slit) the laminated film into With a width of 100 mm or less, the laminate 20 is obtained.

FIG. 6 is a perspective view showing a state in which a plurality of adhesive sheets 3 p and a protective member 5 p covering them are formed on the carrier film 1 by die cutting in step (B). As shown in FIG. 6 , the laminated body 20 passes between a rotary body 51 having a plurality of blades 51 c for die-cutting on the outer circumference and a roller 52 paired with the rotary body 51 , whereby the laminated body 20 is continuously formed on the carrier film 1 . The shape of the blade 51c corresponds to the adhesive sheet 3p and the protective member 5p. At this time, the surface of the laminated body 20 on the protective film 5 side faces the rotating body 51 , and the surface on the carrier film 1 side faces the roller 52 . By adjusting the distance between the rotation axis 51a of the rotary body 51 and the rotation axis 52a of the roller 52 or changing the height of the blade 51c, the depth of the cut formed on the laminated body 20 by the blade 51c can be adjusted.

As shown in FIG. 6 , the laminated body 20 passing between the rotary body 51 and the roller 52 is separated into the adhesive film 10 and the unnecessary portion 30, and is wound on respective reels (not shown). The unnecessary portion 30 includes the adhesive layer 3 and the protective film 5 from which the adhesive sheet 3p and the protective member 5p are dug out.

<How to use the adhesive film> Next, how to use the adhesive film 10 will be described. FIG. 7 is a cross-sectional view schematically showing the state of picking up the adhesive sheet 3 p and the protective member 5 p covering it from the carrier film 1 . In a state where a certain tension is applied to the adhesive film 10 , the adhesive film 10 is moved in the direction of the arrow shown in FIG. 7 while the surface of the adhesive film 10 on the carrier film 1 side is in contact with the wedge-shaped member 60 . As a result, as shown in this figure, the front sides of the adhesive sheet 3p and the protective member 5p are in a state of being lifted from the carrier film 1. In this state, for example, the adhesive sheet 3p and the protective member 5p are picked up using the pickup device 65 with an attractive force. For example, by using a pickup device including a camera that visually recognizes the protective member 5p as the pickup device 65, information such as the presence and orientation of the adhesive sheet 3p and the protective member 5p can be grasped. Based on this information, subsequent steps can be appropriately implemented.

Next, the adhesive sheet 3p covered with the protective member 5p is arranged at a predetermined position and orientation on the substrate (not shown). In this state, the adhesive sheet 3p is temporarily pressed against the substrate. Temporary crimping only needs to be performed for 0.1 to 10 seconds under conditions such as a temperature of 60°C to 150°C and a pressing force of 0.05MPa to 1MPa. By temporary pressure bonding, the adhesive sheet 3p is in close contact with the substrate to an extent that it is weak but does not peel off from the substrate. In this state, the protective member 5p is peeled off from the adhesive sheet 3p using an adhesive tape or the like. After a semiconductor wafer having a different shape from the adhesive sheet 3p is placed on the surface of the adhesive sheet 3p exposed by peeling off the protective member 5p, the semiconductor wafer is press-bonded to the substrate. Crimping only needs to be performed for 0.1 to 10 seconds under conditions such as a temperature of 60°C to 150°C and a pressing force of 0.05MPa to 1MPa. Furthermore, as the substrate becomes thinner, the heating temperature is preferably lower, the pressure bonding temperature is preferably 160°C or lower, and the subsequent thermal hardening temperature is also preferably 160°C or lower.

<Semiconductor device>

FIG. 8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive sheet 3 p. The semiconductor device 100 shown in the figure includes: a semiconductor wafer S; a substrate 50 electrically connected to the semiconductor wafer S; and an adhesive sheet 3 p disposed between the semiconductor wafer S and the substrate 50 and bonding the semiconductor wafer S and the substrate 50 . . The shape of the semiconductor wafer S is, for example, rectangular or square, whereas the shape of the adhesive sheet 3p is T-shaped, and the shape of the semiconductor wafer S is different from the shape of the adhesive sheet 3p. By adopting the above structure, as shown in FIG. 8 , in the regions R1 and R2 , the substrate 50 and the semiconductor chip S can be electrically connected through the conductive materials A1 and A2.

The manufacturing method of the semiconductor device 100 includes the steps of preparing a laminate (not shown) in which the substrate 50, the adhesive sheet 3p and the semiconductor wafer S are sequentially laminated; and heating the laminate to separate the adhesive sheets. The step of bonding the substrate 50 and the semiconductor wafer S. The temperature when the substrate 50 and the semiconductor wafer S are bonded is preferably low, for example, 160° C. or lower.

The embodiments of the present disclosure have been described in detail above, but the present disclosure is not limited to the embodiments. For example, in the above-described embodiment, the colored protective film 5 is used so that the presence, orientation, etc. of the protective member 5p can be grasped using a camera. Alternatively, a predetermined position of the protective member 5p may be marked. mark. In addition, if the adhesive sheet 3p is colored, the protective member 5p does not need to be provided. In addition, when the orientation of the adhesive sheet 3p does not become a problem, there is no need to recognize the orientation. [Example]

Hereinafter, this disclosure is demonstrated based on an Example. This disclosure is not limited to the following Examples.

<Example 1> (Preparation of Adhesive Varnish) The following materials were mixed and vacuum degassed to obtain an adhesive varnish. × Thermoplastic resin: HTR-860P-3 (trade name, manufactured by Nagase ChemteX Co., Ltd., glycidyl group-containing acrylic rubber, molecular weight 1 million, Tg-7°C) 100 parts by mass × thermosetting resin : YDCN-700-10 (trade name, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., o-cresol novolak type epoxy resin, epoxy equivalent: 210) 30 parts by mass × Thermosetting resin: LF-4871 (trade name , manufactured by DIC Co., Ltd., bisphenol A type epoxy resin, epoxy equivalent 118) 95 parts by mass × thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., Bisphenol F type epoxy resin, epoxy equivalent 157) 100 parts by mass × hardening accelerator: 2PZ-CN (trade name, manufactured by Shikoku Chemical Industry Co., Ltd., imidazole compound) 0.3 parts by mass × surface treatment filler: SC- 2050-HLG (trade name, manufactured by Admatechs Co., Ltd.) 330 parts by mass × Silane coupling agent: A-189 (trade name, manufactured by NUC Co., Ltd., γ-mercaptopropyltrimethoxysilane) 0.9 Parts by mass × Silane coupling agent: A-1160 (trade name, manufactured by NUC Co., Ltd., γ-ureidopropyltriethoxysilane) 2 parts by mass

(Preparation of adhesive film) The adhesive varnish was applied to a surface die-cut polyethylene terephthalate film with a thickness of 50 μm (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin tetoron film (A-63) on. After the drying step, a film with an adhesive layer having a thickness of 25 μm formed on one side of the polyethylene terephthalate film (carrier film) was obtained. This film was bonded to a colored 50 μm-thick polyethylene film (TDM-1, manufactured by Tamapoly Co., Ltd.) to obtain a laminated film. By cutting the laminated film into a width of 15 mm, a strip-shaped laminated body is obtained.

The laminate obtained in the above manner was die-cut using an apparatus having the structure shown in FIG. 6 , thereby obtaining the adhesive film of this example. Next, the shape of the tablet was set to a rectangular shape of approximately 7 mm in length and 6 mm in width, with some corners missing (area: 29 mm ² ). The pitch P is set to approximately 9 mm. The area ratio R of the adhesive tablet was 23%.

<Example 2> An adhesive film was produced in the same manner as in Example 1, except that the size and pitch of the adhesive sheets were changed.

<Example 3> An adhesive film was produced in the same manner as in Example 2, except that a surface-treated carrier film different from the carrier film used in Example 2 was used and the shape of the adhesive sheet was changed. As a carrier film, a surface die-cut polyethylene terephthalate film with a thickness of 50 μm (manufactured by Teijin Film Solutions Co., Ltd., trade name: teijin tetoron film) was used A-53).

<Example 4> An adhesive film was produced in the same manner as in Example 2, except that a protective film different from that used in Example 2 was used. As a protective film, an uncolored polyethylene film (manufactured by Tamapoly Co., Ltd., trade name: NF-13, thickness: 20 μm) was used.

<Example 5> An adhesive film was produced in the same manner as in Example 2, except that a protective film different from that used in Example 2 was used. As a protective film, an uncolored polyethylene film (manufactured by Tamapoly Co., Ltd., trade name: GF-3, thickness: 30 μm) was used.

<Example 6> An adhesive film was produced in the same manner as in Example 2, except that a carrier film different from that used in Example 2 was used. As the carrier film, a polyethylene terephthalate film without surface die-cutting treatment (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin Tetoron Film G2) was used. , thickness: 50 μm).

<Example 7> An adhesive film was produced in the same manner as in Example 2, except that a carrier film different from that used in Example 2 was used. As the carrier film, a polyethylene terephthalate film without surface die-cutting treatment (manufactured by Teijin Film Solutions Co., Ltd., trade name: Teijin Tetoron Film G2) was used. , thickness: 38 μm).

<Example 8> An adhesive film was produced in the same manner as in Example 2, except that the size of the adhesive sheet was changed.

<Example 9> An adhesive film was produced in the same manner as in Example 2, except that the size of the adhesive sheet was changed.

The following items were evaluated for the adhesive films of the Examples. The results are shown in Table 1 and Table 2. (1) Area ratio R of the adhesive sheet. The area A (mm ² ), pitch P (mm), and width W (mm) of the carrier film shown in Table 1 are substituted into the following formula to calculate the adhesive sheet. Tablet area ratio R (%). Area ratio R (%) = A/(P×W)×100

(2) Light transmittance The transmittance of light at a wavelength of 500 nm was measured using V-570 (trade name) manufactured by JASCO Co., Ltd. in the area where the adhesive sheet and the protective member covering it were provided on the carrier film.

(3) Carrier film adhesion (90° peel strength) Cut the undie-cut laminated film (carrier film/adhesive layer/protective film) into a width of 20 mm. Use double-sided tape to attach the carrier film side to the aluminum plate, and then peel off the protective film. Thereafter, while maintaining the angle of the adhesive layer with respect to the carrier film at 90°, the adhesive layer is pulled upward to peel off the adhesive layer from the carrier film. The pulling speed was set to 50 mm/min, and the measurement ambient temperature was set to 23°C ± 2°C. Determine the force required to pull. The measured value (mN) and the width of the sample (20 mm) are substituted into the following formula to calculate the adhesive force between the carrier film and the adhesive layer. Adhesion force (N/m) = measured value (mN)/20 (mm)

(4) Protective film adhesion (90° peel strength) Cut the undie-cut laminated film (carrier film/adhesive layer/protective film) into a width of 20 mm. After peeling off the carrier film, use double-sided tape to attach the adhesive layer side to the aluminum plate. Then, while maintaining the angle of the protective film relative to the adhesive layer at 90°, pull the protective film upward to This causes the adhesive layer to peel off from the protective film. The pulling speed was set to 300 mm/min, and the measurement ambient temperature was set to 23°C ± 2°C. Determine the force required to pull. The measured value (mN) and the width of the sample (20 mm) are substituted into the following formula to calculate the adhesive force between the protective film and the adhesive layer. Adhesion force (N/m) = measured value (mN)/20 (mm)

[Table 1]

[Table 2] [Industrial availability]

According to the present disclosure, it is possible to provide an adhesive film including a complex-shaped adhesive sheet that is useful for efficiently performing an adhesive step in a manufacturing process of a semiconductor device. In addition, according to the present disclosure, a semiconductor device using a complex-shaped adhesive sheet and a manufacturing method thereof can be provided.

1‧‧‧Carrier film 3‧‧‧Adhesive layer 3A‧‧‧row 3p‧‧‧Adhesive sheet 5‧‧‧Protective film 5p‧‧‧Protective member 10‧‧‧Adhesive film 20‧‧‧Laminate 30 ‧‧‧Unnecessary part 50‧‧‧Base plate 51‧‧‧Rotating body 51a, 52a‧‧‧Rotating shaft 51c‧‧‧Blade 52‧‧‧Roller 60‧‧‧Wedge member 65‧‧‧Picking device 100‧ ‧‧Semiconductor devices A1, A2‧‧‧Conductive materials C1~C12‧‧‧Corner of the adhesive sheet F1‧‧‧Surface of the adhesive sheet (first side) F2‧‧‧Surface of the adhesive sheet (second side) )P‧‧‧Pitch R1, R2‧‧‧Area S‧‧‧Semiconductor wafer W‧‧‧Width X‧‧‧Arrow II-II‧‧‧Hatch line

FIG. 1 is a perspective view schematically showing an embodiment of the adhesive film of the present disclosure. FIG. 2 is a cross-sectional view along line II-II shown in FIG. 1 . 3(a) to 3(f) are plan views showing changes in the shape of the adhesive sheet. 4 is a plan view showing an example of the arrangement of a T-shaped adhesive sheet and a semiconductor wafer. FIG. 5 is a cross-sectional view schematically showing a laminate in which a carrier film, an adhesive layer, and a protective film are laminated in this order. 6 is a perspective view showing a state in which a plurality of adhesive sheets are formed on a carrier film by die cutting. 7 is a cross-sectional view schematically showing a state of picking up an adhesive sheet and a protective member covering it from a carrier film. 8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive sheet of the present disclosure.

1‧‧‧Carrier film

Row 3A‧‧‧

3p‧‧‧Adhesive tablets

5p‧‧‧Protective components

10‧‧‧Adhesion film

P‧‧‧spacing

W‧‧‧Width

X‧‧‧arrow

II-II‧‧‧Hatch line

Claims (15)

An adhesive film for semiconductor device manufacturing, comprising: a strip-shaped carrier film with a width of 100 mm or less; and a plurality of adhesive sheets arranged on the carrier film so as to be arranged along the longitudinal direction of the carrier film; and The adhesive sheet has a shape in which a recess is formed at at least one of both ends of at least one side of a rectangle or a square, and the adhesive film for semiconductor device manufacturing further includes a protective member covering the adhesive sheet and The second surface on the side opposite to the first surface on the carrier film side has the same shape as the adhesive sheet, and the light transmittance of the protective member is lower than the light transmittance of the carrier film. The adhesive film for manufacturing a semiconductor device according to claim 1, wherein the adhesive sheet has six or more corners. The adhesive film for semiconductor device manufacturing according to claim 2, wherein the adhesive sheet is L-shaped. The adhesive film for semiconductor device manufacturing according to claim 1, wherein the adhesive sheet has eight or more corners. The adhesive film for manufacturing semiconductor devices as described in any one of items 1 to 4 of the patent application scope, wherein the area of the adhesive sheet is 10mm ² ~200mm ² . The adhesive film for semiconductor device manufacturing according to any one of claims 1 to 4, wherein the carrier film is based on the area of the carrier film. The proportion of the surface of the body membrane that is covered by the plurality of adhesive sheets is 10% to 60%. The adhesive film for semiconductor device manufacturing according to any one of claims 1 to 4, wherein one or more rows including the plurality of adhesive sheets are formed on the carrier film. The adhesive film for semiconductor device manufacturing according to any one of claims 1 to 4, wherein the adhesive sheet is an adhesive layer formed to cover the surface of the carrier film Formed by die cutting. The adhesive film for semiconductor device manufacturing according to any one of items 1 to 4 of the patent application, wherein the adhesive force between the carrier film and the adhesive sheet is 0.5N/m~18N/m . The adhesive film for semiconductor device manufacturing according to any one of claims 1 to 4, wherein the adhesive sheet is formed by an adhesive layer formed to cover the surface of the carrier film. The protective member is formed by die-cutting a protective film disposed so as to cover the adhesive layer. The adhesive film for semiconductor device manufacturing according to any one of claims 1 to 4, wherein the adhesive force between the adhesive sheet and the protective member is 16 N/m or less. A semiconductor device including: a substrate; a semiconductor wafer; and The adhesive sheet of the adhesive film for semiconductor device manufacturing according to any one of claims 1 to 11; and the adhesive sheet is disposed between the substrate and the semiconductor wafer, and The substrate and the semiconductor wafer are bonded, and the shape of the semiconductor wafer is different from the shape of the adhesive sheet. A method of manufacturing a semiconductor device using the adhesive sheet of the adhesive film for manufacturing a semiconductor device according to any one of claims 1 to 11 of the claims. The manufacturing method of a semiconductor device according to claim 13, which includes: preparing a laminated body in which a substrate, the adhesive sheet, and a semiconductor wafer are sequentially laminated; and heating the laminated body. The step of bonding the substrate and the semiconductor wafer via the adhesive sheet; and the shape of the semiconductor wafer is different from the shape of the adhesive sheet. The manufacturing method of a semiconductor device according to claim 14, wherein the semiconductor wafer and the substrate are bonded by using the adhesive sheet by heating the laminated body to a temperature of 160° C. or lower.