SG11202001118WA - Semiconductor manufacturing apparatus - Google Patents
Semiconductor manufacturing apparatusInfo
- Publication number
- SG11202001118WA SG11202001118WA SG11202001118WA SG11202001118WA SG11202001118WA SG 11202001118W A SG11202001118W A SG 11202001118WA SG 11202001118W A SG11202001118W A SG 11202001118WA SG 11202001118W A SG11202001118W A SG 11202001118WA SG 11202001118W A SG11202001118W A SG 11202001118WA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing apparatus
- semiconductor manufacturing
- semiconductor
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710682504.XA CN109390249A (zh) | 2017-08-10 | 2017-08-10 | 半导体制造装置 |
PCT/CN2018/099545 WO2019029602A1 (zh) | 2017-08-10 | 2018-08-09 | 半导体制造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001118WA true SG11202001118WA (en) | 2020-03-30 |
Family
ID=65273169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001118WA SG11202001118WA (en) | 2017-08-10 | 2018-08-09 | Semiconductor manufacturing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US11551948B2 (ja) |
JP (1) | JP7029520B2 (ja) |
KR (1) | KR102358962B1 (ja) |
CN (1) | CN109390249A (ja) |
SG (1) | SG11202001118WA (ja) |
TW (1) | TWI692844B (ja) |
WO (1) | WO2019029602A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110783238B (zh) * | 2019-11-18 | 2020-07-21 | 嘉兴德基机械设计有限公司 | 一种半导体封装装片装置 |
CN111816591B (zh) * | 2020-07-24 | 2023-05-16 | 长电科技(滁州)有限公司 | 一种装片系统及装片方法 |
CN112103210B (zh) * | 2020-08-13 | 2023-03-31 | 上饶市广丰时代科技有限公司 | 一种用于半导体芯片封装的芯片粘接工艺设备 |
CN113314438B (zh) * | 2021-04-22 | 2023-08-15 | 浙江晶引电子科技有限公司 | 一种定位准确的芯片制造用成品封装设备 |
CN113654694B (zh) * | 2021-10-20 | 2022-01-18 | 山东汉芯科技有限公司 | 压力传感器芯片封装系统及其封装方法 |
CN115966492B (zh) * | 2022-12-28 | 2023-08-18 | 方泰(广东)科技有限公司 | 一种半导体ic载板自动组合机的封装工具 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05129372A (ja) | 1991-10-31 | 1993-05-25 | Taiyo Yuden Co Ltd | 電子回路部品のマウント方法及びそれに使用する治具 |
JP2000025709A (ja) | 1998-07-13 | 2000-01-25 | Hitachi Ltd | 半導体装置の製造方法,その方法で使用されるキャリヤテープおよび半導体製造装置 |
JP2000058707A (ja) | 1998-08-17 | 2000-02-25 | Citizen Watch Co Ltd | 半導体パッケージの製造方法 |
JP2000068327A (ja) | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
DE19912441A1 (de) * | 1999-03-19 | 2000-09-21 | Elfo Ag Sachseln Sachseln | Multi-Chip-Modul |
JP4064795B2 (ja) | 2002-11-28 | 2008-03-19 | 松下電器産業株式会社 | 電子部品実装装置 |
KR100546359B1 (ko) * | 2003-07-31 | 2006-01-26 | 삼성전자주식회사 | 동일 평면상에 횡 배치된 기능부 및 실장부를 구비하는 반도체 칩 패키지 및 그 적층 모듈 |
JP4624813B2 (ja) | 2005-01-21 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
JP4831091B2 (ja) | 2008-02-21 | 2011-12-07 | パナソニック株式会社 | ダイボンディング装置及びダイボンディング方法 |
CN102592962A (zh) * | 2011-01-06 | 2012-07-18 | 均豪精密工业股份有限公司 | 半导体组件的整合式制造设备及整合式制造方法 |
JP5968705B2 (ja) | 2012-07-13 | 2016-08-10 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
CN103681439B (zh) * | 2012-09-04 | 2016-06-15 | 无锡华润安盛科技有限公司 | 具有改进夹具的半导体键合设备及其封装方法 |
KR101425613B1 (ko) * | 2013-03-28 | 2014-08-01 | 한미반도체 주식회사 | 플립칩 본딩장치 및 플립칩 본딩방법 |
CN104183527A (zh) * | 2013-05-28 | 2014-12-03 | 北京中电科电子装备有限公司 | 工件键合系统 |
CN103367208B (zh) | 2013-07-02 | 2015-10-28 | 华中科技大学 | 一种用于高密度芯片的倒装键合平台 |
JP5737536B2 (ja) | 2013-11-21 | 2015-06-17 | 株式会社東京精密 | プローバ |
JP2015130414A (ja) | 2014-01-08 | 2015-07-16 | 東レエンジニアリング株式会社 | 自動ボンディング装置 |
KR101614204B1 (ko) * | 2014-04-29 | 2016-04-20 | 세메스 주식회사 | 다이 픽업 유닛, 이를 포함하는 다이 본딩 장치 및 방법 |
JP2016016635A (ja) | 2014-07-10 | 2016-02-01 | 大日本印刷株式会社 | 射出成形用金型、成形装置、樹脂付きリードフレームの多面付け体 |
US10127153B1 (en) * | 2015-09-28 | 2018-11-13 | Apple Inc. | Cache dependency handling |
TWM521802U (zh) | 2015-10-07 | 2016-05-11 | Youngtek Electronics Corp | 封裝晶片檢測裝置及其晶片轉向模組 |
CN105470173B (zh) * | 2015-12-15 | 2018-08-14 | 上海微电子装备(集团)股份有限公司 | 一种芯片接合系统及方法 |
US10910248B2 (en) | 2016-01-06 | 2021-02-02 | Shinkawa Ltd. | Electronic component mounting apparatus |
-
2017
- 2017-08-10 CN CN201710682504.XA patent/CN109390249A/zh active Pending
-
2018
- 2018-08-09 SG SG11202001118WA patent/SG11202001118WA/en unknown
- 2018-08-09 JP JP2020506865A patent/JP7029520B2/ja active Active
- 2018-08-09 US US16/637,639 patent/US11551948B2/en active Active
- 2018-08-09 WO PCT/CN2018/099545 patent/WO2019029602A1/zh active Application Filing
- 2018-08-09 KR KR1020207006430A patent/KR102358962B1/ko active IP Right Grant
- 2018-08-10 TW TW107127896A patent/TWI692844B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201911495A (zh) | 2019-03-16 |
CN109390249A (zh) | 2019-02-26 |
JP7029520B2 (ja) | 2022-03-03 |
TWI692844B (zh) | 2020-05-01 |
KR102358962B1 (ko) | 2022-02-08 |
US20200273730A1 (en) | 2020-08-27 |
JP2020530208A (ja) | 2020-10-15 |
US11551948B2 (en) | 2023-01-10 |
KR20200033335A (ko) | 2020-03-27 |
WO2019029602A1 (zh) | 2019-02-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1253883A1 (zh) | 半導體器件 | |
HK1251728A1 (zh) | 半導體裝置 | |
TWI562209B (en) | Semiconductor device and method for manufacturing the same | |
SG10201707339PA (en) | Semiconductor device | |
GB201701487D0 (en) | Semiconductor arrangement | |
EP3379588A4 (en) | Semiconductor device manufacturing method | |
SG10201912585TA (en) | Semiconductor device and method for manufacturing the same | |
HK1245998A1 (zh) | 半導體器件 | |
SG10201608814YA (en) | Semiconductor device and method for manufacturing the semiconductor device | |
SG11201709671YA (en) | Semiconductor device manufacturing method | |
EP3279924A4 (en) | Semiconductor device manufacturing method | |
HK1255949A1 (zh) | 半導體器件 | |
SG11201708564WA (en) | Film for manufacturing semiconductor parts | |
SG10201605337UA (en) | Manufacturing method of semiconductor device | |
TWI563631B (en) | Semiconductor Device | |
HK1222476A1 (zh) | 半導體器件 | |
SG11202001118WA (en) | Semiconductor manufacturing apparatus | |
HK1252338A1 (zh) | 半導體器件 | |
HK1249276A1 (zh) | 半導體器件 | |
EP3499556A4 (en) | DEVICE FOR PRODUCING SEMICONDUCTORS | |
GB201800780D0 (en) | Semiconductor device and method for manufacturing semiconductor device | |
IL268308B (en) | Warehouse for storing containers | |
GB201814693D0 (en) | Semiconductor devices | |
HK1244353A1 (zh) | 半導體器件 | |
GB2567746B (en) | Semiconductor device |