GB952609A
(en)
|
1959-05-07 |
1964-03-18 |
Rank Xerox Ltd |
Improved image development
|
NL267831A
(en)
|
1960-08-17 |
|
|
|
GB1082116A
(en)
|
1964-09-03 |
1967-09-06 |
Owens Illinois Inc |
Organopolysiloxane resins and their production
|
US3722181A
(en)
|
1970-05-22 |
1973-03-27 |
Du Pont |
Chromatographic packing with chemically bonded organic stationary phases
|
FR2110495A5
(en)
|
1970-10-19 |
1972-06-02 |
Michelin & Cie |
|
IE35508B1
(en)
|
1971-08-11 |
1976-03-03 |
Intercontinental Chem Co Ltd |
Method of forming adhesive bonds between surfaces
|
US4096315A
(en)
|
1976-12-15 |
1978-06-20 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Process for producing a well-adhered durable optical coating on an optical plastic substrate
|
GB1583544A
(en)
|
1977-07-25 |
1981-01-28 |
Uop Inc |
Metal-clad laminates
|
US4179324A
(en)
|
1977-11-28 |
1979-12-18 |
Spire Corporation |
Process for fabricating thin film and glass sheet laminate
|
JPS5614533A
(en)
|
1979-07-16 |
1981-02-12 |
Shin Etsu Chem Co Ltd |
Production of polarizing film or sheet
|
GB2107930B
(en)
|
1981-10-21 |
1985-06-12 |
Secr Defence |
Photoconductive strip detectors
|
US4397722A
(en)
|
1981-12-31 |
1983-08-09 |
International Business Machines Corporation |
Polymers from aromatic silanes and process for their preparation
|
JPS58222438A
(en)
|
1982-06-18 |
1983-12-24 |
Tdk Corp |
Magnetic recording medium
|
FR2531235B1
(en)
|
1982-07-27 |
1985-11-15 |
Corning Glass Works |
POLARIZING TRANSPARENT LAMINATE GLASSES AND PROCESS FOR OBTAINING SAME
|
US4599243A
(en)
|
1982-12-23 |
1986-07-08 |
International Business Machines Corporation |
Use of plasma polymerized organosilicon films in fabrication of lift-off masks
|
US4849284A
(en)
|
1987-02-17 |
1989-07-18 |
Rogers Corporation |
Electrical substrate material
|
US4822466A
(en)
|
1987-06-25 |
1989-04-18 |
University Of Houston - University Park |
Chemically bonded diamond films and method for producing same
|
US4810326A
(en)
|
1987-08-31 |
1989-03-07 |
International Business Machines Corporation |
Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
|
US5357726A
(en)
|
1989-02-02 |
1994-10-25 |
Chemfab Corporation |
Composite materials for structural end uses
|
US5141800A
(en)
|
1989-02-02 |
1992-08-25 |
Chemical Fabrics Corporation |
Method of making laminated PTFE-containing composites and products thereof
|
US4990462A
(en)
|
1989-04-12 |
1991-02-05 |
Advanced Micro Devices, Inc. |
Method for coplanar integration of semiconductor ic devices
|
US5073181A
(en)
|
1990-08-09 |
1991-12-17 |
Corning Incorporated |
Method of protecting glass surfaces using submicron refractory particles
|
CA2065918A1
(en)
|
1991-04-22 |
1992-10-23 |
Bradley W. Reed |
Liquid membrane modules with minimal effective membrane thickness and methods of making the same
|
CA2069038C
(en)
|
1991-05-22 |
1997-08-12 |
Kiyofumi Sakaguchi |
Method for preparing semiconductor member
|
JPH07500122A
(en)
|
1991-06-14 |
1995-01-05 |
ダブリュ.エル.ゴア アンド アソシエーツ,インコーポレイティド |
Surface-modified porous expanded expanded polytetrafluoroethylene and its manufacturing method
|
US5462781A
(en)
|
1991-06-14 |
1995-10-31 |
W. L. Gore & Associates, Inc. |
Surface modified porous expanded polytetrafluoroethylene and process for making
|
US5222494A
(en)
|
1991-07-31 |
1993-06-29 |
Cyberonics, Inc. |
Implantable tissue stimulator output stabilization system
|
JP3039070B2
(en)
|
1991-10-09 |
2000-05-08 |
住友電気工業株式会社 |
Fluororesin coating
|
FR2690279B1
(en)
|
1992-04-15 |
1997-10-03 |
Picogiga Sa |
MULTISPECTRAL PHOTOVOLTAUIC COMPONENT.
|
US5491571A
(en)
|
1993-01-19 |
1996-02-13 |
Hughes Aircraft Company |
Liquid crystal display including electrodes and driver devices integrally formed in monocrystalline semiconductor layer
|
US5482896A
(en)
|
1993-11-18 |
1996-01-09 |
Eastman Kodak Company |
Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same
|
US5616179A
(en)
|
1993-12-21 |
1997-04-01 |
Commonwealth Scientific Corporation |
Process for deposition of diamondlike, electrically conductive and electron-emissive carbon-based films
|
US5554680A
(en)
|
1994-02-16 |
1996-09-10 |
E. I. Du Pont De Nemours And Company |
Heat-resistant perfluoroelastomer composition
|
JP3136951B2
(en)
|
1994-06-28 |
2001-02-19 |
松下電工株式会社 |
Surface treatment method for glass cloth
|
JP3081122B2
(en)
|
1994-07-18 |
2000-08-28 |
シャープ株式会社 |
Jig for transporting substrate and method of manufacturing liquid crystal display element using the same
|
US5760100B1
(en)
|
1994-09-06 |
2000-11-14 |
Ciba Vision Corp |
Extended wear ophthalmic lens
|
US5413940A
(en)
|
1994-10-11 |
1995-05-09 |
Taiwan Semiconductor Manufacturing Company |
Process of treating SOG layer using end-point detector for outgassing
|
US5461934A
(en)
|
1994-12-20 |
1995-10-31 |
Budd; Alexander G. |
Ambient air collection device for use with a self-contained breathing apparatus
|
EP0764704B1
(en)
|
1995-09-25 |
2000-03-08 |
Dow Corning Corporation |
Use of preceramic polymers as electronic adhesives
|
AU7435896A
(en)
|
1995-10-13 |
1997-04-30 |
Dow Chemical Company, The |
Coated plastic substrate
|
US5661618A
(en)
|
1995-12-11 |
1997-08-26 |
International Business Machines Corporation |
Magnetic recording device having a improved slider
|
JP3930591B2
(en)
|
1995-12-22 |
2007-06-13 |
東陶機器株式会社 |
Photocatalytic hydrophilic coating composition, method for forming hydrophilic film and coated article
|
US5888591A
(en)
|
1996-05-06 |
1999-03-30 |
Massachusetts Institute Of Technology |
Chemical vapor deposition of fluorocarbon polymer thin films
|
US5989998A
(en)
|
1996-08-29 |
1999-11-23 |
Matsushita Electric Industrial Co., Ltd. |
Method of forming interlayer insulating film
|
US6124154A
(en)
|
1996-10-22 |
2000-09-26 |
Seiko Epson Corporation |
Fabrication process for thin film transistors in a display or electronic device
|
US5820991A
(en)
|
1997-02-24 |
1998-10-13 |
Cabo; Ana M. |
Fused glass sheets having ceramic paint and metal foil and method of making same
|
DE19711459A1
(en)
|
1997-03-19 |
1998-09-24 |
Flachglas Automotive Gmbh |
Process for the production of a curved laminated safety glass pane
|
JP3551702B2
(en)
|
1997-05-08 |
2004-08-11 |
カシオ計算機株式会社 |
Liquid crystal display device and driving method thereof
|
US5972152A
(en)
|
1997-05-16 |
1999-10-26 |
Micron Communications, Inc. |
Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
|
US6687969B1
(en)
|
1997-05-16 |
2004-02-10 |
Micron Technology, Inc. |
Methods of fixturing flexible substrates and methods of processing flexible substrates
|
JPH1126733A
(en)
|
1997-07-03 |
1999-01-29 |
Seiko Epson Corp |
Transfer method of thin film device, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display and electronic equipment
|
EP1018153A1
(en)
|
1997-08-29 |
2000-07-12 |
Sharon N. Farrens |
In situ plasma wafer bonding method
|
US5966622A
(en)
|
1997-10-08 |
1999-10-12 |
Lucent Technologies Inc. |
Process for bonding crystalline substrates with different crystal lattices
|
US6211065B1
(en)
|
1997-10-10 |
2001-04-03 |
Applied Materials, Inc. |
Method of depositing and amorphous fluorocarbon film using HDP-CVD
|
US20010045351A1
(en)
|
1997-11-21 |
2001-11-29 |
Korea Institute Of Science And Technology |
Plasma polymerization on surface of material
|
US6852650B2
(en)
|
1998-02-05 |
2005-02-08 |
Asm Japan K.K. |
Insulation film on semiconductor substrate and method for forming same
|
EP2261921A3
(en)
|
1998-02-23 |
2011-03-09 |
Kabushiki Kaisha Toshiba |
Information storage medium, information playback method and apparatus and information recording method
|
US6159385A
(en)
|
1998-05-08 |
2000-12-12 |
Rockwell Technologies, Llc |
Process for manufacture of micro electromechanical devices having high electrical isolation
|
JP3811713B2
(en)
|
1998-09-22 |
2006-08-23 |
株式会社片山化学工業研究所 |
Paper separation promoter and method for preventing paper breakage
|
EP1048628A1
(en)
|
1999-04-30 |
2000-11-02 |
Schott Glas |
Polymer coated glassfoil substrate
|
US6379746B1
(en)
|
1999-02-02 |
2002-04-30 |
Corning Incorporated |
Method for temporarily protecting glass articles
|
JP3202718B2
(en)
|
1999-02-23 |
2001-08-27 |
鹿児島日本電気株式会社 |
Display device manufacturing jig and display device manufacturing method using the same
|
US6387736B1
(en)
|
1999-04-26 |
2002-05-14 |
Agilent Technologies, Inc. |
Method and structure for bonding layers in a semiconductor device
|
US6338901B1
(en)
|
1999-05-03 |
2002-01-15 |
Guardian Industries Corporation |
Hydrophobic coating including DLC on substrate
|
EP1054454A3
(en)
|
1999-05-18 |
2004-04-21 |
Nippon Sheet Glass Co., Ltd. |
Glass sheet with conductive film, method of manufacturing the same, and photoelectric conversion device using the same
|
US8853696B1
(en)
|
1999-06-04 |
2014-10-07 |
Semiconductor Energy Laboratory Co., Ltd. |
Electro-optical device and electronic device
|
US6824879B2
(en)
|
1999-06-10 |
2004-11-30 |
Honeywell International Inc. |
Spin-on-glass anti-reflective coatings for photolithography
|
SG93210A1
(en)
|
1999-06-29 |
2002-12-17 |
Univ Singapore |
Method for lamination of fluoropolymer to metal and printed circuit board (pcb) substrate
|
TW487959B
(en)
|
1999-08-13 |
2002-05-21 |
Semiconductor Energy Lab |
Laser apparatus, laser annealing method, and manufacturing method of a semiconductor device
|
EP1258035A4
(en)
|
2000-02-01 |
2008-12-24 |
Analog Devices Inc |
Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
|
US6902987B1
(en)
|
2000-02-16 |
2005-06-07 |
Ziptronix, Inc. |
Method for low temperature bonding and bonded structure
|
EP1127706B2
(en)
|
2000-02-22 |
2013-10-02 |
Agfa Graphics N.V. |
Ink jet recording material
|
US6528145B1
(en)
|
2000-06-29 |
2003-03-04 |
International Business Machines Corporation |
Polymer and ceramic composite electronic substrates
|
DE10034737C2
(en)
|
2000-07-17 |
2002-07-11 |
Fraunhofer Ges Forschung |
Process for producing a permanent release layer by plasma polymerization on the surface of a molding tool, a molding tool which can be produced by the process and its use
|
US6649540B2
(en)
|
2000-11-09 |
2003-11-18 |
The Boc Group, Inc. |
Organosilane CVD precursors and their use for making organosilane polymer low-k dielectric film
|
US6599437B2
(en)
|
2001-03-20 |
2003-07-29 |
Applied Materials Inc. |
Method of etching organic antireflection coating (ARC) layers
|
FR2823599B1
(en)
|
2001-04-13 |
2004-12-17 |
Commissariat Energie Atomique |
DEMOMTABLE SUBSTRATE WITH CONTROLLED MECHANICAL HOLDING AND METHOD OF MAKING
|
FR2823596B1
(en)
|
2001-04-13 |
2004-08-20 |
Commissariat Energie Atomique |
SUBSTRATE OR DISMOUNTABLE STRUCTURE AND METHOD OF MAKING SAME
|
FR2824821B1
(en)
|
2001-05-17 |
2003-08-29 |
Essilor Int |
PROCESS FOR THE PREPARATION OF A GLASS SUITABLE FOR OVERFLOWING, GLASS THUS OBTAINED AND METHOD FOR OVERFLOWING SUCH A GLASS
|
US7045878B2
(en)
|
2001-05-18 |
2006-05-16 |
Reveo, Inc. |
Selectively bonded thin film layer and substrate layer for processing of useful devices
|
US6956268B2
(en)
|
2001-05-18 |
2005-10-18 |
Reveo, Inc. |
MEMS and method of manufacturing MEMS
|
JP5415658B2
(en)
|
2001-05-28 |
2014-02-12 |
三菱樹脂株式会社 |
Intermediate film adhesive sheet and transparent laminate
|
WO2003001616A2
(en)
|
2001-06-20 |
2003-01-03 |
Showa Denko K.K. |
Light emitting material and organic light-emitting device
|
JP4036018B2
(en)
|
2001-06-20 |
2008-01-23 |
昭和電工株式会社 |
Organic light emitting device and light emitting material
|
EP1275624B1
(en)
|
2001-06-29 |
2007-08-15 |
Crystal Systems Inc. |
Antifogging product, inorganic hydrophilic hard layer forming material and process for producing antifogging lens
|
US6735982B2
(en)
|
2001-07-12 |
2004-05-18 |
Intel Corporation |
Processing relatively thin glass sheets
|
US6649212B2
(en)
|
2001-07-30 |
2003-11-18 |
Guardian Industries Corporation |
Modified silicon-based UV absorbers useful in crosslinkable polysiloxane coatings via sol-gel polymerization
|
TW558743B
(en)
|
2001-08-22 |
2003-10-21 |
Semiconductor Energy Lab |
Peeling method and method of manufacturing semiconductor device
|
JP2003077187A
(en)
|
2001-08-30 |
2003-03-14 |
Toshiba Corp |
Method for manufacturing optical disk
|
JP2003071937A
(en)
|
2001-09-05 |
2003-03-12 |
Toppan Printing Co Ltd |
Laminated body, method for manufacturing it, and multi- layer circuit board
|
US7033910B2
(en)
|
2001-09-12 |
2006-04-25 |
Reveo, Inc. |
Method of fabricating multi layer MEMS and microfluidic devices
|
US6528351B1
(en)
|
2001-09-24 |
2003-03-04 |
Jigsaw Tek, Inc. |
Integrated package and methods for making same
|
US6814833B2
(en)
|
2001-10-26 |
2004-11-09 |
Corning Incorporated |
Direct bonding of articles containing silicon
|
US6521857B1
(en)
|
2001-11-19 |
2003-02-18 |
Geomat Insights, Llc |
Plasma enhanced bonding method and device
|
DE10162435A1
(en)
|
2001-12-19 |
2003-07-17 |
Joerg Lahann |
Process for the production of surface coatings which reduce the adsorption of proteins or the adhesion of bacteria and / or cells
|
US6824872B2
(en)
|
2002-04-23 |
2004-11-30 |
Laurel Products Llc |
Surface-treating fluoropolymer powders using atmospheric plasma
|
US6699798B2
(en)
|
2002-04-24 |
2004-03-02 |
Intel Corporation |
Promoting adhesion of fluoropolymer films to semiconductor substrates
|
FR2874455B1
(en)
|
2004-08-19 |
2008-02-08 |
Soitec Silicon On Insulator |
HEAT TREATMENT BEFORE BONDING TWO PLATES
|
JP3639978B2
(en)
|
2002-05-10 |
2005-04-20 |
日本航空電子工業株式会社 |
Light switch
|
EP1363319B1
(en)
|
2002-05-17 |
2009-01-07 |
Semiconductor Energy Laboratory Co., Ltd. |
Method of transferring an object and method of manufacturing a semiconductor device
|
KR101005989B1
(en)
|
2002-06-11 |
2011-01-05 |
코니카 미놀타 홀딩스 가부시키가이샤 |
Surface treatment method and optical part
|
US7101947B2
(en)
|
2002-06-14 |
2006-09-05 |
Florida State University Research Foundation, Inc. |
Polyelectrolyte complex films for analytical and membrane separation of chiral compounds
|
US7279239B2
(en)
|
2002-08-07 |
2007-10-09 |
Kabushiki Kaisha Toyota Chuo Kenkyusho |
Laminating product including adhesion layer and laminate product including protective film
|
JP3941627B2
(en)
|
2002-08-07 |
2007-07-04 |
株式会社豊田中央研究所 |
Laminate with adhesion layer
|
WO2004027110A2
(en)
|
2002-09-18 |
2004-04-01 |
Arch Specialty Chemicals, Inc. |
Additives to prevent degradation of alkyl-hydrogen siloxanes
|
DE20215401U1
(en)
|
2002-10-07 |
2004-02-19 |
Schott Glas |
Composite of a thin substrate and a carrier substrate with releasable connecting means
|
TW578439B
(en)
|
2002-10-25 |
2004-03-01 |
Ritdisplay Corp |
Organic light emitting diode and material applied in the organic light emitting diode
|
EP1573788A3
(en)
|
2002-11-20 |
2005-11-02 |
Reveo, Inc. |
Method and system for fabricating multi layer devices on a substrate
|
JP2004178891A
(en)
|
2002-11-26 |
2004-06-24 |
Mitsubishi Electric Corp |
Manufacturing method of electron emitting type light emitting device
|
AU2003299296A1
(en)
|
2002-11-29 |
2004-06-23 |
Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. |
Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
|
DE10353530A1
(en)
|
2003-11-14 |
2005-06-23 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Processing, especially thinning, wafers with components on one side involves applying coating system to wafer front with separating coating so coating system supports or carries wafer during thinning
|
DE50311232D1
(en)
|
2002-12-17 |
2009-04-09 |
Wipf Ag |
SUBSTRATE WITH A POLAR PLASMAPOLYMERIZED LAYER
|
US6762074B1
(en)
|
2003-01-21 |
2004-07-13 |
Micron Technology, Inc. |
Method and apparatus for forming thin microelectronic dies
|
US7089635B2
(en)
|
2003-02-25 |
2006-08-15 |
Palo Alto Research Center, Incorporated |
Methods to make piezoelectric ceramic thick film arrays and elements
|
US6964201B2
(en)
|
2003-02-25 |
2005-11-15 |
Palo Alto Research Center Incorporated |
Large dimension, flexible piezoelectric ceramic tapes
|
TWI361814B
(en)
|
2003-03-07 |
2012-04-11 |
Kuraray Co |
Plastic bonding method
|
US7220656B2
(en)
|
2003-04-29 |
2007-05-22 |
Micron Technology, Inc. |
Strained semiconductor by wafer bonding with misorientation
|
US6969166B2
(en)
|
2003-05-29 |
2005-11-29 |
3M Innovative Properties Company |
Method for modifying the surface of a substrate
|
JP2005014599A
(en)
|
2003-05-30 |
2005-01-20 |
Toyota Central Res & Dev Lab Inc |
Resin sheet and electroluminescence display device
|
FR2855909B1
(en)
|
2003-06-06 |
2005-08-26 |
Soitec Silicon On Insulator |
PROCESS FOR THE CONCURRENT PRODUCTION OF AT LEAST ONE PAIR OF STRUCTURES COMPRISING AT LEAST ONE USEFUL LAYER REPORTED ON A SUBSTRATE
|
US20040258850A1
(en)
|
2003-06-18 |
2004-12-23 |
Ann Straccia |
Environmentally friendly reactive fixture to allow localized surface engineering for improved adhesion to coated and non-coated substrates
|
US20050001201A1
(en)
|
2003-07-03 |
2005-01-06 |
Bocko Peter L. |
Glass product for use in ultra-thin glass display applications
|
FR2859312B1
(en)
|
2003-09-02 |
2006-02-17 |
Soitec Silicon On Insulator |
MULTIFUNCTIONAL METAL SEAL
|
US7242041B2
(en)
|
2003-09-22 |
2007-07-10 |
Lucent Technologies Inc. |
Field-effect transistors with weakly coupled layered inorganic semiconductors
|
US20050069713A1
(en)
|
2003-09-30 |
2005-03-31 |
Rahul Gupta |
Capillary coating method
|
WO2005036604A2
(en)
|
2003-10-09 |
2005-04-21 |
E.I. Dupont De Nemours And Company |
Apparatus and method for supporting a flexible substrate during processing
|
US6992371B2
(en)
|
2003-10-09 |
2006-01-31 |
Freescale Semiconductor, Inc. |
Device including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication
|
US20050081993A1
(en)
|
2003-10-16 |
2005-04-21 |
Ilkka Steven J. |
Method of bonding glass
|
GB0326537D0
(en)
|
2003-11-14 |
2003-12-17 |
Koninkl Philips Electronics Nv |
Flexible devices
|
US20050118742A1
(en)
|
2003-11-17 |
2005-06-02 |
Frank Henning |
Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device
|
GB0327093D0
(en)
|
2003-11-21 |
2003-12-24 |
Koninkl Philips Electronics Nv |
Active matrix displays and other electronic devices having plastic substrates
|
KR101002936B1
(en)
|
2003-12-17 |
2010-12-21 |
삼성전자주식회사 |
Carrier plate, method of laminating plastic plate using the same, and method of manufacturing display device having the flexibility
|
US7220497B2
(en)
|
2003-12-18 |
2007-05-22 |
Lam Research Corporation |
Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components
|
KR101073032B1
(en)
|
2003-12-19 |
2011-10-12 |
삼성전자주식회사 |
Method of laminating the plastic plate method of manufacturing display device having the flexibility using the same
|
US7041608B2
(en)
|
2004-02-06 |
2006-05-09 |
Eastman Kodak Company |
Providing fluorocarbon layers on conductive electrodes in making electronic devices such as OLED devices
|
US7147891B2
(en)
|
2004-02-11 |
2006-12-12 |
Dionex Corporation |
Polymer substrate coated with weak cationic-exchange functional layer
|
EP1737044B1
(en)
|
2004-03-12 |
2014-12-10 |
Japan Science and Technology Agency |
Amorphous oxide and thin film transistor
|
US7087134B2
(en)
|
2004-03-31 |
2006-08-08 |
Hewlett-Packard Development Company, L.P. |
System and method for direct-bonding of substrates
|
JP2005300972A
(en)
|
2004-04-13 |
2005-10-27 |
Seiko Epson Corp |
Method for manufacturing display device and substrate sticking device
|
JP2006003684A
(en)
|
2004-06-18 |
2006-01-05 |
Nikon Corp |
Manufacturing method of substrateless filter
|
ITMI20041252A1
(en)
|
2004-06-22 |
2004-09-22 |
Solvay Solexis Spa |
PERFLUOROELASTOMERIC COMPOSITIONS
|
US7261793B2
(en)
|
2004-08-13 |
2007-08-28 |
Hewlett-Packard Development Company, L.P. |
System and method for low temperature plasma-enhanced bonding
|
US7226869B2
(en)
|
2004-10-29 |
2007-06-05 |
Lam Research Corporation |
Methods for protecting silicon or silicon carbide electrode surfaces from morphological modification during plasma etch processing
|
US20060134362A1
(en)
|
2004-12-17 |
2006-06-22 |
3M Innovative Properties Company |
Optically clear pressure sensitive adhesive
|
AU2006216707B2
(en)
|
2005-02-24 |
2010-09-02 |
Pilkington North America, Inc. |
Anti-reflective, thermally insulated glazing articles
|
JP5068674B2
(en)
|
2005-03-01 |
2012-11-07 |
ダウ・コーニング・コーポレイション |
Temporary wafer bonding method for semiconductor processing.
|
US8043697B2
(en)
|
2005-04-19 |
2011-10-25 |
Ube Industries, Ltd. |
Polyimide film-laminated body
|
US20060246218A1
(en)
|
2005-04-29 |
2006-11-02 |
Guardian Industries Corp. |
Hydrophilic DLC on substrate with barrier discharge pyrolysis treatment
|
TWI402935B
(en)
|
2005-05-17 |
2013-07-21 |
Koninkl Philips Electronics Nv |
Colour active martix displays
|
US7462552B2
(en)
|
2005-05-23 |
2008-12-09 |
Ziptronix, Inc. |
Method of detachable direct bonding at low temperatures
|
US20070020451A1
(en)
|
2005-07-20 |
2007-01-25 |
3M Innovative Properties Company |
Moisture barrier coatings
|
US7166520B1
(en)
|
2005-08-08 |
2007-01-23 |
Silicon Genesis Corporation |
Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process
|
CN101242951B
(en)
|
2005-08-09 |
2012-10-31 |
旭硝子株式会社 |
Thin sheet glass laminate and method for manufacturing display using thin sheet glass laminate
|
US20070048530A1
(en)
|
2005-08-29 |
2007-03-01 |
Wen-Kuang Tsao |
Anti-static substrate
|
TWI288493B
(en)
|
2005-09-13 |
2007-10-11 |
Ind Tech Res Inst |
Method for fabricating a device with flexible substrate and method for stripping flexible-substrate
|
US7901743B2
(en)
|
2005-09-30 |
2011-03-08 |
Tokyo Electron Limited |
Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system
|
US7462551B2
(en)
|
2005-09-30 |
2008-12-09 |
Intel Corporation |
Adhesive system for supporting thin silicon wafer
|
US8039049B2
(en)
|
2005-09-30 |
2011-10-18 |
Tokyo Electron Limited |
Treatment of low dielectric constant films using a batch processing system
|
JP2007138144A
(en)
|
2005-10-18 |
2007-06-07 |
Hitachi Chem Co Ltd |
Silica-based coated film-forming composition
|
KR20070047114A
(en)
|
2005-11-01 |
2007-05-04 |
주식회사 엘지화학 |
Manufacturing method of device with flexible substrate and device with flexible substrate manufactured by the same
|
WO2007055142A1
(en)
|
2005-11-11 |
2007-05-18 |
Semiconductor Energy Laboratory Co., Ltd. |
Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
|
FR2893750B1
(en)
|
2005-11-22 |
2008-03-14 |
Commissariat Energie Atomique |
METHOD FOR MANUFACTURING SCREEN TYPE FLEXIBLE ELECTRONIC DEVICE COMPRISING A PLURALITY OF THIN FILM COMPONENTS
|
US20070134784A1
(en)
|
2005-12-09 |
2007-06-14 |
Halverson Kurt J |
Microreplicated microarrays
|
DE602007013478D1
(en)
|
2006-02-08 |
2011-05-12 |
Semiconductor Energy Lab |
RFID device
|
DE102006013834A1
(en)
|
2006-03-23 |
2007-09-27 |
Tesa Ag |
Electroluminescent PSAs
|
KR100831562B1
(en)
|
2006-03-23 |
2008-05-21 |
주식회사 엘지화학 |
Pressure Sensitive Adhesive Composition for Transferring Flexible Substrate
|
US7909928B2
(en)
|
2006-03-24 |
2011-03-22 |
The Regents Of The University Of Michigan |
Reactive coatings for regioselective surface modification
|
US7737035B1
(en)
|
2006-03-31 |
2010-06-15 |
Novellus Systems, Inc. |
Dual seal deposition process chamber and process
|
US20070248809A1
(en)
|
2006-04-19 |
2007-10-25 |
Steven Vincent Haldeman |
Interlayers Comprising Stable Infrared Absorbing Agents
|
WO2007121524A1
(en)
|
2006-04-20 |
2007-11-01 |
Epitactix Pty Ltd. |
Method of manufacture and resulting structures for semiconductor devices
|
CN101437772B
(en)
|
2006-05-08 |
2011-09-07 |
旭硝子株式会社 |
Thin plate glass laminate, process for producing display device using thin plate glass laminate, and support glass substrate
|
KR101358255B1
(en)
|
2006-06-27 |
2014-02-05 |
엘지디스플레이 주식회사 |
Hydrophobic mold of photo-curable type and manufacturing method for the same
|
EP2041782A4
(en)
|
2006-07-05 |
2014-03-26 |
Univ Arizona |
Method of temporarily attaching a rigid carrier to a substrate
|
KR20090037856A
(en)
|
2006-07-12 |
2009-04-16 |
아사히 가라스 가부시키가이샤 |
Glass substrate with protective glass, process for producing display using glass substrate with protective glass, and silicone for release paper
|
US8084103B2
(en)
|
2006-08-15 |
2011-12-27 |
Sakhrani Vinay G |
Method for treating a hydrophilic surface
|
US20080044588A1
(en)
|
2006-08-15 |
2008-02-21 |
Sakhrani Vinay G |
Method for Treating a Hydrophilic Surface
|
JP2008072087A
(en)
|
2006-08-16 |
2008-03-27 |
Kyoto Univ |
Semiconductor device and manufacturing method of the semiconductor device, and display device
|
EP2074188A1
(en)
|
2006-10-13 |
2009-07-01 |
Sunwoo AMC Co., Ltd. |
Laminating film of plastic/teflon-silicon and method for preparing the same
|
GB0620955D0
(en)
|
2006-10-20 |
2006-11-29 |
Speakman Stuart P |
Methods and apparatus for the manufacture of microstructures
|
US7903083B2
(en)
|
2006-11-13 |
2011-03-08 |
Motorola Mobility, Inc. |
Mixed-mode encapsulated electrophoretic display for electronic device
|
JP5008381B2
(en)
|
2006-11-15 |
2012-08-22 |
富士フイルム株式会社 |
Method for producing organic electroluminescence light-emitting panel using flexible substrate, organic electroluminescence light-emitting panel produced thereby, and supporting substrate used for production thereof
|
US8069229B2
(en)
|
2006-12-28 |
2011-11-29 |
Computer Associates Think, Inc. |
Topology static zones
|
KR100890250B1
(en)
|
2007-01-08 |
2009-03-24 |
포항공과대학교 산학협력단 |
Method of manufacturing a flexible device and method of manufacturing a flexible display
|
US8110906B2
(en)
|
2007-01-23 |
2012-02-07 |
Infineon Technologies Ag |
Semiconductor device including isolation layer
|
WO2008111361A1
(en)
|
2007-03-12 |
2008-09-18 |
Asahi Glass Company, Limited |
Glass substrate provided with protection glass and method for manufacturing display device using glass substrate provided with protection glass
|
JP5277552B2
(en)
|
2007-03-19 |
2013-08-28 |
富士通セミコンダクター株式会社 |
Manufacturing method of semiconductor device
|
US8399047B2
(en)
|
2007-03-22 |
2013-03-19 |
The Regents Of The Univeristy Of Michigan |
Multifunctional CVD coatings
|
ATE495181T1
(en)
|
2007-04-26 |
2011-01-15 |
Basf Se |
SILANES CONTAINING PHENOTHIAZINE S-OXIDE OR PHENOTHIAZINE S,S-DIOXIDE GROUPS AND THEIR USE IN OLEDS
|
KR101436115B1
(en)
|
2007-04-27 |
2014-09-01 |
가부시키가이샤 한도오따이 에네루기 켄큐쇼 |
Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device
|
US7960916B2
(en)
|
2007-05-16 |
2011-06-14 |
Advanced Lcd Technologies Development Center Co., Ltd. |
Display device and electronic device using thin-film transistors formed on semiconductor thin films which are crystallized on insulating substrates
|
JP5359871B2
(en)
|
2007-06-20 |
2013-12-04 |
旭硝子株式会社 |
Surface treatment method of oxide glass with fluorinating agent
|
JP5788173B2
(en)
|
2007-06-25 |
2015-09-30 |
ブルーワー サイエンス アイ エヌシー. |
High temperature spin-on temporary bonding composition
|
KR20080113576A
(en)
|
2007-06-25 |
2008-12-31 |
엘지디스플레이 주식회사 |
Liquid crystal display device and method for fabricating thereof
|
TW200907003A
(en)
|
2007-07-03 |
2009-02-16 |
Hitachi Chemical Co Ltd |
Adhesive composition and method of manufacturing thereof, adhesive member using the adhesive composition and method of manufacturing thereof, supporting member for mounting semiconductor and method of manufacturing thereof, and semiconductor apparatus an
|
JP2009035721A
(en)
|
2007-07-11 |
2009-02-19 |
Seiko Epson Corp |
Substrate with joining film, joining method and joined product
|
US8449970B2
(en)
|
2007-07-23 |
2013-05-28 |
3M Innovative Properties Company |
Antistatic article, method of making the same, and display device having the same
|
JP2009028923A
(en)
|
2007-07-24 |
2009-02-12 |
Seiko Epson Corp |
Joining method, joint article and wiring board
|
JP2009028922A
(en)
|
2007-07-24 |
2009-02-12 |
Seiko Epson Corp |
Joining method, joint article, droplet ejection head and droplet ejection device
|
JP2009074002A
(en)
|
2007-09-21 |
2009-04-09 |
Seiko Epson Corp |
Adhesion sheet, joining method and joined body
|
US20090091025A1
(en)
|
2007-10-04 |
2009-04-09 |
Agency For Science, Technology And Research |
Method for forming and releasing interconnects
|
WO2009085362A2
(en)
|
2007-10-05 |
2009-07-09 |
The Regents Of The University Of Michigan |
Ultrastrong and stiff layered polymer nanocomposites and hierarchical laminate materials thereof
|
JP4710897B2
(en)
|
2007-11-28 |
2011-06-29 |
セイコーエプソン株式会社 |
Separation method of joined body
|
KR101445734B1
(en)
|
2007-12-07 |
2014-10-01 |
삼성전자 주식회사 |
Liquid Crystal Display
|
US20100260994A1
(en)
*
|
2007-12-20 |
2010-10-14 |
Roland Groenen |
substrate coated with amorphous hydrogenated carbon
|
US9111981B2
(en)
|
2008-01-24 |
2015-08-18 |
Brewer Science Inc. |
Method for reversibly mounting a device wafer to a carrier substrate
|
WO2009092664A1
(en)
|
2008-01-24 |
2009-07-30 |
Basf Se |
Superhydrophilic coating compositions and their preparation
|
JP5024087B2
(en)
|
2008-02-05 |
2012-09-12 |
旭硝子株式会社 |
GLASS LAMINATE, PANEL FOR DISPLAY DEVICE WITH SUPPORT AND METHOD FOR PRODUCING THEM
|
US8859101B2
(en)
|
2008-02-05 |
2014-10-14 |
Saint-Gobain Performance Plastics Corporation |
Multi-layer article
|
GB0802912D0
(en)
|
2008-02-15 |
2008-03-26 |
Carben Semicon Ltd |
Thin-film transistor, carbon-based layer and method of production thereof
|
KR20090095026A
(en)
|
2008-03-04 |
2009-09-09 |
삼성전자주식회사 |
Method of manufacturing for display device
|
JP5555226B2
(en)
|
2008-04-08 |
2014-07-23 |
アリゾナ ボード オブ リージェンツ ア ボディー コーポレート アクティング オン ビハーフ オブ アリゾナ ステイト ユニバーシティ |
Assembly and method for reducing warp and bow of a flexible substrate during semiconductor processing
|
KR20110007134A
(en)
|
2008-04-17 |
2011-01-21 |
아사히 가라스 가부시키가이샤 |
Glass laminate, display panel with support, method for producing glass laminate and method for manufacturing display panel with support
|
KR101500684B1
(en)
|
2008-04-17 |
2015-03-10 |
삼성디스플레이 주식회사 |
Carrier glasses and menufacturing method of flexible display device using the same
|
US7842548B2
(en)
|
2008-04-22 |
2010-11-30 |
Taiwan Semconductor Manufacturing Co., Ltd. |
Fixture for P-through silicon via assembly
|
KR101458901B1
(en)
|
2008-04-29 |
2014-11-10 |
삼성디스플레이 주식회사 |
Method of manufacturing flexible display device
|
US7960840B2
(en)
|
2008-05-12 |
2011-06-14 |
Texas Instruments Incorporated |
Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level
|
JP2009283155A
(en)
|
2008-05-19 |
2009-12-03 |
Seiko Epson Corp |
Manufacturing method of display device, display device, and electronic apparatus
|
JP2009298916A
(en)
|
2008-06-13 |
2009-12-24 |
Toyo Ink Mfg Co Ltd |
Antistatic acrylic resin composition, antistatic acrylic pressure sensitive adhesive composition, and pressure sensitive adhesive protective film for protecting optical member
|
JP5029523B2
(en)
|
2008-07-14 |
2012-09-19 |
旭硝子株式会社 |
GLASS LAMINATE, PANEL FOR DISPLAY DEVICE WITH SUPPORT, PANEL FOR DISPLAY DEVICE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
|
US7690344B2
(en)
|
2008-07-24 |
2010-04-06 |
Gm Global Technology Operations, Inc. |
Method and apparatus for supporting stop-and-go engine functionality
|
GB2462615A
(en)
|
2008-08-12 |
2010-02-17 |
Nec Corp |
Optional Access Stratum security activation depending on purpose of request or message parameter in an evolved UTRAN communication network.
|
DE102008045370B4
(en)
|
2008-09-02 |
2010-07-08 |
Grenzebach Maschinenbau Gmbh |
Method and device for transporting large-area, thin glass plates
|
KR20110055728A
(en)
|
2008-09-12 |
2011-05-25 |
아리조나 보드 오브 리전트스, 아리조나주의 아리조나 주립대 대행법인 |
Methods for attaching flexible substrates to rigid carriers and resulting devices
|
TWI354854B
(en)
|
2008-09-15 |
2011-12-21 |
Ind Tech Res Inst |
Substrate structures applied in flexible electrica
|
JP2010107597A
(en)
|
2008-10-28 |
2010-05-13 |
Seiko Epson Corp |
Optical element and method for producing same
|
KR101555551B1
(en)
|
2008-11-07 |
2015-09-24 |
엘지디스플레이 주식회사 |
Method for fabricating flexible display device
|
WO2010059710A1
(en)
|
2008-11-19 |
2010-05-27 |
Dow Corning Corporation |
A silicone composition and a method for preparing the same
|
US8211270B2
(en)
|
2008-11-21 |
2012-07-03 |
Nitto Denko Corporation |
Method of detaching attached boards from each other
|
DE102009022628A1
(en)
|
2008-12-05 |
2010-06-10 |
Evonik Goldschmidt Gmbh |
Method for modifying surfaces
|
CN102239553B
(en)
|
2008-12-05 |
2014-08-27 |
皇家飞利浦电子股份有限公司 |
Electronic devices having plastic substrates
|
TW201033000A
(en)
|
2009-01-09 |
2010-09-16 |
Asahi Glass Co Ltd |
Glass laminate and manufacturing method therefor
|
US9063605B2
(en)
|
2009-01-09 |
2015-06-23 |
Apple Inc. |
Thin glass processing using a carrier
|
JP5207306B2
(en)
|
2009-01-26 |
2013-06-12 |
武井電機工業株式会社 |
Thin film removal method and apparatus for thin film laminated glass substrate
|
CA2751881C
(en)
|
2009-02-27 |
2013-09-17 |
Exxonmobil Oil Corporation |
Plasma treated evoh multilayer film
|
TWI410329B
(en)
|
2009-03-09 |
2013-10-01 |
Ind Tech Res Inst |
Apparatus for releasing a flexible device and method thereof
|
JP5402184B2
(en)
|
2009-04-13 |
2014-01-29 |
日本電気硝子株式会社 |
Glass film and method for producing the same
|
CN101873532B
(en)
|
2009-04-22 |
2013-01-02 |
电信科学技术研究院 |
Method, base station and UE (User End) for sending and acquiring control information in multicast broadcast system
|
JP5514302B2
(en)
|
2009-05-06 |
2014-06-04 |
コーニング インコーポレイテッド |
Carrier for glass substrate
|
JP5578174B2
(en)
|
2009-05-08 |
2014-08-27 |
日立化成株式会社 |
Film-like adhesive for semiconductor sealing, semiconductor device and method for manufacturing the same
|
GB0908193D0
(en)
|
2009-05-13 |
2009-06-24 |
Albright Patents |
Treatment of disease state
|
US8298959B2
(en)
|
2009-06-03 |
2012-10-30 |
Applied Materials, Inc. |
Method and apparatus for etching
|
CN101924067B
(en)
|
2009-06-09 |
2013-05-08 |
财团法人工业技术研究院 |
Method for separating flexible membrane from carrier plate and manufacturing method of flexible electronic device
|
JP2010284869A
(en)
|
2009-06-11 |
2010-12-24 |
Shin-Etsu Chemical Co Ltd |
Joining member
|
JP5594522B2
(en)
|
2009-07-03 |
2014-09-24 |
日本電気硝子株式会社 |
Glass film laminate for manufacturing electronic devices
|
US8568184B2
(en)
|
2009-07-15 |
2013-10-29 |
Apple Inc. |
Display modules
|
US7987566B2
(en)
|
2009-07-15 |
2011-08-02 |
Sturzebecher Richard J |
Capacitor forming method
|
CN101989469A
(en)
|
2009-07-31 |
2011-03-23 |
群康科技(深圳)有限公司 |
Current-conducting plate
|
US8048794B2
(en)
|
2009-08-18 |
2011-11-01 |
International Business Machines Corporation |
3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport
|
DE102009028640A1
(en)
|
2009-08-19 |
2011-02-24 |
Evonik Goldschmidt Gmbh |
Curable composition containing urethane-containing silylated polymers and their use in sealants and adhesives, binders and / or surface modifiers
|
JP2011048979A
(en)
|
2009-08-26 |
2011-03-10 |
Canon Inc |
Image display apparatus
|
US9847243B2
(en)
|
2009-08-27 |
2017-12-19 |
Corning Incorporated |
Debonding a glass substrate from carrier using ultrasonic wave
|
US20110117728A1
(en)
|
2009-08-27 |
2011-05-19 |
Applied Materials, Inc. |
Method of decontamination of process chamber after in-situ chamber clean
|
JPWO2011024690A1
(en)
|
2009-08-27 |
2013-01-31 |
旭硝子株式会社 |
Laminated structure of flexible substrate-support, panel for electronic device with support, and method for manufacturing panel for electronic device
|
JP5562597B2
(en)
|
2009-08-28 |
2014-07-30 |
荒川化学工業株式会社 |
SUPPORT, GLASS SUBSTRATE LAMINATE, DISPLAY DEVICE PANEL WITH SUPPORT AND METHOD FOR PRODUCING DISPLAY DEVICE PANEL
|
WO2011030716A1
(en)
|
2009-09-08 |
2011-03-17 |
旭硝子株式会社 |
Glass/resin laminate, and electronic device using same
|
JP2011058579A
(en)
|
2009-09-10 |
2011-03-24 |
Tokyo Institute Of Technology |
Energy absorption structure
|
KR101583394B1
(en)
|
2009-09-11 |
2016-01-07 |
헨켈 아이피 앤드 홀딩 게엠베하 |
Compositions for polymer bonding
|
WO2011034034A1
(en)
|
2009-09-18 |
2011-03-24 |
日本電気硝子株式会社 |
Method for producing glass film, method for processing glass film, and glass film laminate
|
CN102576106B
(en)
|
2009-10-20 |
2015-02-11 |
旭硝子株式会社 |
Glass laminate, glass laminate manufacturing method, display panel manufacturing method, and display panel obtained by means of display panel manufacturing method
|
WO2011048978A1
(en)
|
2009-10-20 |
2011-04-28 |
旭硝子株式会社 |
Glass laminate, display device panel with supporting body, display device panel, display device, method for producing glass laminate, method for producing display device panel with supporting body, and method for producing display device panel
|
KR101617280B1
(en)
|
2009-10-21 |
2016-05-03 |
엘지디스플레이 주식회사 |
Methode of fabricating display device using flexible plastic substrate
|
KR20110043376A
(en)
|
2009-10-21 |
2011-04-27 |
엘지디스플레이 주식회사 |
Electrophoretic display device and method of fabricating the same
|
KR20110045136A
(en)
|
2009-10-26 |
2011-05-04 |
주식회사 삼영테크놀로지 |
Coating method for separating display panel from window
|
US9019211B2
(en)
|
2009-10-30 |
2015-04-28 |
Corning Incorporated |
Methods and apparatus for providing touch sensitive displays
|
KR101635914B1
(en)
|
2009-12-16 |
2016-07-05 |
엘지디스플레이 주식회사 |
Method of fabricating flexible display device
|
RU2593841C2
(en)
|
2009-12-17 |
2016-08-10 |
Керамтек Гмбх |
Conditioning of surface of improving bone cement adhesion to ceramic substrates
|
EP2463253B1
(en)
|
2010-01-12 |
2019-11-06 |
Nippon Electric Glass Co., Ltd. |
Glass film laminate, method of producing the same, and method of producing glass film
|
JP2011159697A
(en)
|
2010-01-29 |
2011-08-18 |
Dainippon Printing Co Ltd |
Thin film transistor mounting substrate, method of manufacturing the same, and image display device
|
GB201003067D0
(en)
|
2010-02-23 |
2010-04-07 |
Semblant Ltd |
Plasma-polymerized polymer coating
|
US8995146B2
(en)
|
2010-02-23 |
2015-03-31 |
Semblant Limited |
Electrical assembly and method
|
JP2011201977A
(en)
|
2010-03-24 |
2011-10-13 |
Seiko Epson Corp |
Bonding method
|
JP2011201976A
(en)
|
2010-03-24 |
2011-10-13 |
Seiko Epson Corp |
Bonding method
|
US8349727B2
(en)
|
2010-04-08 |
2013-01-08 |
Liang Guo |
Integrated method for high-density interconnection of electronic components through stretchable interconnects
|
US20110256385A1
(en)
|
2010-04-15 |
2011-10-20 |
Seiko Epson Corporation |
Bonding film-attached substrate and bonding film-attached substrate manufacturing method
|
JP5625470B2
(en)
|
2010-05-10 |
2014-11-19 |
セイコーエプソン株式会社 |
Joining method
|
JP5516046B2
(en)
|
2010-05-11 |
2014-06-11 |
セイコーエプソン株式会社 |
Bonding film transfer sheet and bonding method
|
JP2011235556A
(en)
|
2010-05-11 |
2011-11-24 |
Seiko Epson Corp |
Excitation energy specification method and apparatus, and bonding method and apparatus
|
CN102883879B
(en)
|
2010-05-11 |
2015-06-17 |
旭硝子株式会社 |
Process for producing laminate, and laminate
|
JP2011248011A
(en)
|
2010-05-25 |
2011-12-08 |
Bridgestone Corp |
Particle for display medium and information display panel using the same
|
GB201008912D0
(en)
|
2010-05-27 |
2010-07-14 |
Gx Labs Holdings Ltd |
Biocidal coating composition
|
GB2481187B
(en)
|
2010-06-04 |
2014-10-29 |
Plastic Logic Ltd |
Processing substrates
|
KR101721414B1
(en)
|
2010-06-09 |
2017-03-31 |
삼성디스플레이 주식회사 |
Backlight assembly and liquid crystal display apparatus including the same
|
US8852391B2
(en)
|
2010-06-21 |
2014-10-07 |
Brewer Science Inc. |
Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
|
TWI432835B
(en)
|
2010-06-24 |
2014-04-01 |
Au Optronics Corp |
Flexible display panel and method of fabricating the same
|
DE102010025967B4
(en)
|
2010-07-02 |
2015-12-10 |
Schott Ag |
Method for producing a multiplicity of holes, device for this and glass interposer
|
CN101916022B
(en)
|
2010-07-06 |
2012-10-10 |
友达光电股份有限公司 |
Flexible display panel and manufacturing method thereof
|
WO2012014959A1
(en)
|
2010-07-28 |
2012-02-02 |
日本電気硝子株式会社 |
Glass film laminate
|
JP5602529B2
(en)
|
2010-07-29 |
2014-10-08 |
日本合成化学工業株式会社 |
Manufacturing method of laminate, manufacturing method of polarizing plate with glass substrate, and polarizing plate with glass substrate obtained thereby
|
US9263314B2
(en)
|
2010-08-06 |
2016-02-16 |
Brewer Science Inc. |
Multiple bonding layers for thin-wafer handling
|
US20120035309A1
(en)
|
2010-08-06 |
2012-02-09 |
Baker Hughes Incorporated |
Method to disperse nanoparticles into elastomer and articles produced therefrom
|
JP5462107B2
(en)
|
2010-08-09 |
2014-04-02 |
株式会社日本製鋼所 |
Method and apparatus for manufacturing hollow molded article
|
US8846499B2
(en)
|
2010-08-17 |
2014-09-30 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Composite carrier structure
|
TWI446420B
(en)
|
2010-08-27 |
2014-07-21 |
Advanced Semiconductor Eng |
Releasing carrier method for semiconductor process
|
US20120063952A1
(en)
|
2010-09-10 |
2012-03-15 |
Hong Keith C |
Uv resistant clear laminates
|
KR101164945B1
(en)
|
2010-09-13 |
2012-07-12 |
한국과학기술원 |
Fabrication Method of Flexible Devices
|
KR101779586B1
(en)
|
2010-09-27 |
2017-10-10 |
엘지디스플레이 주식회사 |
Method of fabricating display device using flexible plastic substrate
|
EP2624326A4
(en)
|
2010-09-29 |
2017-05-10 |
Posco |
Method for manufacturing a flexible electronic device using a roll-shaped motherboard, flexible electronic device, and flexible substrate
|
US8822306B2
(en)
|
2010-09-30 |
2014-09-02 |
Infineon Technologies Ag |
Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
|
KR101267529B1
(en)
|
2010-10-30 |
2013-05-24 |
엘지디스플레이 주식회사 |
Method of fabricating flexible organic electro luminescent device
|
US8859103B2
(en)
|
2010-11-05 |
2014-10-14 |
Joseph Eugene Canale |
Glass wafers for semiconductor fabrication processes and methods of making same
|
CN102034746B
(en)
|
2010-11-08 |
2013-06-05 |
昆山工研院新型平板显示技术中心有限公司 |
Manufacturing method of active matrix organic light-emitting display array base plate
|
KR101295532B1
(en)
|
2010-11-11 |
2013-08-12 |
엘지디스플레이 주식회사 |
Method for manufacturing Flexible Flat Device
|
KR101271838B1
(en)
|
2010-11-24 |
2013-06-07 |
주식회사 포스코 |
Method of manufacturing flexible electronic device, flexibleelectronic device and flexible substrate using a reinforcing substrate
|
KR101842134B1
(en)
|
2010-11-26 |
2018-03-26 |
엘지디스플레이 주식회사 |
Electrophoretic Display Device and Method for Manufacturing The Same
|
EP2458620B1
(en)
|
2010-11-29 |
2021-12-01 |
IHP GmbH-Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik |
Fabrication of graphene electronic devices using step surface contour
|
TW201238014A
(en)
|
2010-11-30 |
2012-09-16 |
Corning Inc |
Methods of forming a glass wiring board substrate
|
JP2012119611A
(en)
|
2010-12-03 |
2012-06-21 |
Asahi Glass Co Ltd |
Manufacturing method of through hole electrode substrate
|
KR101049380B1
(en)
|
2010-12-21 |
2011-07-15 |
한국기계연구원 |
Tsv for 3d packaging of semiconductor device and fabrication method thereof
|
CN102070120B
(en)
|
2010-12-31 |
2012-09-05 |
东南大学 |
Preparation method for high-density interposer for microelectronic system-in-package
|
EP2641883A4
(en)
|
2011-02-01 |
2014-10-01 |
Micro Technology Co Ltd |
Thin plate glass substrate bonded body and method for producing same
|
JP2012166999A
(en)
|
2011-02-16 |
2012-09-06 |
Asahi Glass Co Ltd |
Method for manufacturing glass substrate for interposer, method for manufacturing interposer, glass substrate for interposer, and interposer
|
KR101918284B1
(en)
|
2011-03-03 |
2019-01-30 |
엘지디스플레이 주식회사 |
Method of manufacturing a flexible display device
|
JP5355618B2
(en)
|
2011-03-10 |
2013-11-27 |
三星ディスプレイ株式會社 |
Flexible display device and manufacturing method thereof
|
JP2012209545A
(en)
|
2011-03-17 |
2012-10-25 |
Sekisui Chem Co Ltd |
Manufacturing method of semiconductor laminate
|
TWI445626B
(en)
|
2011-03-18 |
2014-07-21 |
Eternal Chemical Co Ltd |
Method for fabricating a flexible device
|
JP2012227310A
(en)
|
2011-04-19 |
2012-11-15 |
Panasonic Corp |
Ceramic multilayer substrate, and method of manufacturing the same
|
US10155361B2
(en)
|
2011-11-09 |
2018-12-18 |
Corning Incorporated |
Method of binding nanoparticles to glass
|
KR20140018937A
(en)
|
2011-04-22 |
2014-02-13 |
아사히 가라스 가부시키가이샤 |
Laminate, method for producing same, and use of same
|
JP5862238B2
(en)
|
2011-05-27 |
2016-02-16 |
東洋紡株式会社 |
LAMINATE, MANUFACTURING METHOD THEREOF, AND DEVICE STRUCTURE MANUFACTURING METHOD USING THE SAME
|
JP5760696B2
(en)
|
2011-05-27 |
2015-08-12 |
株式会社デンソー |
Image recognition device
|
JP5862866B2
(en)
|
2011-05-30 |
2016-02-16 |
東洋紡株式会社 |
Method for producing laminate and method for producing film device using the laminate
|
JP5883236B2
(en)
|
2011-06-10 |
2016-03-09 |
日東電工株式会社 |
Carrier material for thin layer substrate
|
KR20130000211A
(en)
|
2011-06-22 |
2013-01-02 |
삼성전자주식회사 |
Methods for processing substrates
|
KR20130003997A
(en)
|
2011-07-01 |
2013-01-09 |
엘지디스플레이 주식회사 |
Separation-combination method of carrier substrate and slim glass
|
WO2013006865A2
(en)
|
2011-07-07 |
2013-01-10 |
Brewer Science Inc. |
Methods of transferring device wafers or layers between carrier substrates and other surfaces
|
US8617925B2
(en)
|
2011-08-09 |
2013-12-31 |
Soitec |
Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods
|
US8383460B1
(en)
|
2011-09-23 |
2013-02-26 |
GlobalFoundries, Inc. |
Method for fabricating through substrate vias in semiconductor substrate
|
WO2013044941A1
(en)
|
2011-09-27 |
2013-04-04 |
Applied Materials, Inc. |
Carrier for thin glass substrates and use thereof
|
JP5790392B2
(en)
|
2011-10-12 |
2015-10-07 |
旭硝子株式会社 |
Manufacturing method of electronic device
|
JP5796449B2
(en)
|
2011-10-12 |
2015-10-21 |
旭硝子株式会社 |
Manufacturing method of electronic device, manufacturing method of carrier substrate with resin layer
|
KR101973826B1
(en)
|
2011-10-18 |
2019-08-26 |
에이지씨 가부시키가이샤 |
Laminate, method for producing laminate, and method for producing glass substrate having member for electronic devices attached thereto
|
KR101820171B1
(en)
|
2011-10-24 |
2018-01-19 |
엘지디스플레이 주식회사 |
Method of fabricating lightweight and thin liquid crystal display device
|
US8696864B2
(en)
|
2012-01-26 |
2014-04-15 |
Promerus, Llc |
Room temperature debonding composition, method and stack
|
US8550061B2
(en)
|
2012-01-26 |
2013-10-08 |
Maruzen Company Limited |
Toy gun
|
US8975157B2
(en)
|
2012-02-08 |
2015-03-10 |
Advanced Semiconductor Engineering, Inc. |
Carrier bonding and detaching processes for a semiconductor wafer
|
US10543662B2
(en)
|
2012-02-08 |
2020-01-28 |
Corning Incorporated |
Device modified substrate article and methods for making
|
US9725357B2
(en)
|
2012-10-12 |
2017-08-08 |
Corning Incorporated |
Glass articles having films with moderate adhesion and retained strength
|
WO2013119737A2
(en)
|
2012-02-08 |
2013-08-15 |
Corning Incorporated |
Processing flexible glass with a carrier
|
US8696212B2
(en)
|
2012-03-01 |
2014-04-15 |
Amsted Rail Company, Inc. |
Roller bearing backing ring assembly
|
JP2013184346A
(en)
|
2012-03-07 |
2013-09-19 |
Asahi Glass Co Ltd |
Glass laminate, and method for producing electronic device
|
JP2013184872A
(en)
|
2012-03-09 |
2013-09-19 |
Nippon Electric Glass Co Ltd |
Edge treatment method of glass substrate, edge treatment device for glass substrate, and glass substrate
|
KR101390212B1
(en)
|
2012-03-14 |
2014-05-14 |
한양대학교 에리카산학협력단 |
Preparation method for gliadin nanoparticles by electrospray
|
JP2013207084A
(en)
|
2012-03-28 |
2013-10-07 |
Sumitomo Electric Ind Ltd |
Substrate module with radiator plate and method of manufacturing the same
|
JP2013216513A
(en)
|
2012-04-05 |
2013-10-24 |
Nippon Electric Glass Co Ltd |
Method for cutting glass film and glass film lamination body
|
EP2650938A1
(en)
|
2012-04-13 |
2013-10-16 |
Acreo Swedish ICT AB |
Organic Field-Effect Transistor Device
|
JP2013224475A
(en)
|
2012-04-23 |
2013-10-31 |
Shimazu Kogyo Kk |
Particle for thermal spraying, method for forming thermally sprayed coating film, and thermally sprayed member
|
DE102012207149A1
(en)
|
2012-04-27 |
2013-10-31 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Composite with temporary protective film
|
JP5991373B2
(en)
|
2012-05-29 |
2016-09-14 |
旭硝子株式会社 |
Glass laminate and electronic device manufacturing method
|
KR20130095605A
(en)
|
2012-06-22 |
2013-08-28 |
코스텍시스템(주) |
Apparatus for bonding and debonding between device wafer and carrier wafer for semiconductor manufacturing
|
CN102815052B
(en)
|
2012-06-29 |
2016-08-24 |
法国圣戈班玻璃公司 |
Super-hydrophobic anti-reflection substrate and preparation method thereof
|
US9139469B2
(en)
|
2012-07-17 |
2015-09-22 |
Corning Incorporated |
Ion exchangeable Li-containing glass compositions for 3-D forming
|
JP2014019597A
(en)
|
2012-07-17 |
2014-02-03 |
Nippon Electric Glass Co Ltd |
Method for producing glass film, and glass film laminate
|
CN102789125B
(en)
|
2012-07-27 |
2013-11-13 |
京东方科技集团股份有限公司 |
Mask plate, mat manufacturing method and LCD panel
|
US20140050911A1
(en)
|
2012-08-17 |
2014-02-20 |
Corning Incorporated |
Ultra-thin strengthened glasses
|
CN102820262A
(en)
|
2012-09-05 |
2012-12-12 |
江苏物联网研究发展中心 |
Glass through hole manufacturing and interconnecting method
|
CN107265844B
(en)
|
2012-09-28 |
2020-04-14 |
Hoya株式会社 |
External protective cover glass, manufacturing method thereof, glass substrate and protective cover glass
|
EP3872047A1
(en)
|
2012-10-12 |
2021-09-01 |
Corning Incorporated |
Articles having retained strength
|
US20140150244A1
(en)
|
2012-11-30 |
2014-06-05 |
General Electric Company |
Adhesive-free carrier assemblies for glass substrates
|
CN103035490A
(en)
|
2012-12-11 |
2013-04-10 |
京东方科技集团股份有限公司 |
Preparation method for flexible display device
|
US10014177B2
(en)
|
2012-12-13 |
2018-07-03 |
Corning Incorporated |
Methods for processing electronic devices
|
US10086584B2
(en)
*
|
2012-12-13 |
2018-10-02 |
Corning Incorporated |
Glass articles and methods for controlled bonding of glass sheets with carriers
|
TWI617437B
(en)
|
2012-12-13 |
2018-03-11 |
康寧公司 |
Facilitated processing for controlling bonding between sheet and carrier
|
EP2932496A4
(en)
|
2012-12-13 |
2016-11-02 |
Corning Inc |
Glass and methods of making glass articles
|
US9340443B2
(en)
|
2012-12-13 |
2016-05-17 |
Corning Incorporated |
Bulk annealing of glass sheets
|
KR102046534B1
(en)
|
2013-01-25 |
2019-11-19 |
삼성전자주식회사 |
Methods for processing substrates
|
WO2014137801A1
(en)
|
2013-03-03 |
2014-09-12 |
John Moore |
Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
|
US10060851B2
(en)
|
2013-03-05 |
2018-08-28 |
Plexense, Inc. |
Surface plasmon detection apparatuses and methods
|
US9790407B2
(en)
|
2013-03-09 |
2017-10-17 |
Moore John |
Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturing
|
JP2016511517A
(en)
|
2013-03-15 |
2016-04-14 |
ビーエイエスエフ・ソシエタス・エウロパエアBasf Se |
Protective electrode structure
|
WO2014151353A1
(en)
|
2013-03-15 |
2014-09-25 |
Corning Incorporated |
Bulk annealing of glass sheets
|
WO2014142280A1
(en)
|
2013-03-15 |
2014-09-18 |
日産自動車株式会社 |
Non-aqueous electrolyte secondary battery
|
KR101432575B1
(en)
|
2013-03-29 |
2014-08-21 |
엘지디스플레이 주식회사 |
Method of fabricating lightweight and thin liquid crystal display device
|
TWI617522B
(en)
|
2013-04-02 |
2018-03-11 |
Asahi Glass Co Ltd |
Glass product with protective film and manufacturing method thereof
|
TWI617521B
(en)
|
2013-04-02 |
2018-03-11 |
Asahi Glass Co Ltd |
Covered glass substrate and manufacturing method thereof
|
KR102070617B1
(en)
|
2013-08-21 |
2020-01-30 |
엘지이노텍 주식회사 |
Micro electro mechanical systems am modulator and magnetic field sensor having the same
|
KR20150034829A
(en)
|
2013-08-30 |
2015-04-06 |
주식회사 엔씰텍 |
A supporting substrate using temporary bonding/debonding layer, a method thereof, a method of fabricating a flexible information display device using the same, and a flexible information display device fabriacated by the method
|
KR101580015B1
(en)
|
2013-08-30 |
2015-12-24 |
주식회사 엔씰텍 |
A supporting substrate using temporary bonding/debonding layer, a method thereof, a method of fabricating a flexible information display device using the same, and a flexible information display device fabriacated by the method
|
US20150099110A1
(en)
|
2013-10-07 |
2015-04-09 |
Corning Incorporated |
Glass articles and methods for controlled bonding of glass sheets with carriers
|
US10510576B2
(en)
|
2013-10-14 |
2019-12-17 |
Corning Incorporated |
Carrier-bonding methods and articles for semiconductor and interposer processing
|
JP6119567B2
(en)
|
2013-11-11 |
2017-04-26 |
旭硝子株式会社 |
Method for manufacturing glass laminate and method for manufacturing electronic device
|
JP6176067B2
(en)
|
2013-11-11 |
2017-08-09 |
旭硝子株式会社 |
GLASS LAMINATE AND ELECTRONIC DEVICE MANUFACTURING METHOD
|
JP6136909B2
(en)
|
2013-12-17 |
2017-05-31 |
旭硝子株式会社 |
Manufacturing method of support substrate with resin layer, manufacturing method of glass laminate, manufacturing method of electronic device
|
SG11201605964QA
(en)
*
|
2014-01-27 |
2016-08-30 |
Corning Inc |
Treatment of a surface modification layer for controlled bonding of thin sheets with carriers
|
US20150210466A1
(en)
*
|
2014-01-27 |
2015-07-30 |
The Procter & Gamble Company |
Dispensing System for Sanitary Tissue Products
|
CN106132688B
(en)
|
2014-01-27 |
2020-07-14 |
康宁股份有限公司 |
Article and method for controlled bonding of a sheet to a carrier
|
JP2017506204A
(en)
*
|
2014-01-27 |
2017-03-02 |
コーニング インコーポレイテッド |
Articles and methods for controlled bonding of polymeric surfaces to carriers
|
KR101522941B1
(en)
|
2014-02-05 |
2015-05-26 |
도레이첨단소재 주식회사 |
Silicone release film and manufacturing method thereof
|
CN105980150B
(en)
|
2014-02-07 |
2018-01-30 |
旭硝子株式会社 |
Glass laminate
|
US9406746B2
(en)
|
2014-02-19 |
2016-08-02 |
International Business Machines Corporation |
Work function metal fill for replacement gate fin field effect transistor process
|
JP2017087417A
(en)
|
2014-03-26 |
2017-05-25 |
旭硝子株式会社 |
Glass laminate
|
JP2017518954A
(en)
|
2014-04-09 |
2017-07-13 |
コーニング インコーポレイテッド |
Substrate article modified with device and method of manufacturing the same
|
CN106163798B
(en)
|
2014-04-10 |
2019-05-10 |
Agc株式会社 |
Glass laminate and its manufacturing method, the manufacturing method of electronic device
|
JP6322469B2
(en)
|
2014-04-25 |
2018-05-09 |
ニッタ株式会社 |
Substrate processing method
|
WO2015163134A1
(en)
|
2014-04-25 |
2015-10-29 |
旭硝子株式会社 |
Glass laminate body, and method for manufacturing electronic device
|
US9790593B2
(en)
|
2014-08-01 |
2017-10-17 |
Corning Incorporated |
Scratch-resistant materials and articles including the same
|
KR20170039135A
(en)
|
2014-08-01 |
2017-04-10 |
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|
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|
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|
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|
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|
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