JP2012166999A - Method for manufacturing glass substrate for interposer, method for manufacturing interposer, glass substrate for interposer, and interposer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a glass substrate for an interposer, easily handleable of the glass substrate, and furthermore, formable of fine through-holes in the glass substrate.SOLUTION: The method for manufacturing a glass substrate for an interposer having at least one through-hole includes: (a) a process of preparing a glass substrate having a first surface and a second surface, and having a first thickness; (b) a process of forming a thin-walled part thinner than the thickness of the first thickness on the first surface of the glass substrate, and thereby, forming the thin-walled part, and a thick-walled part surrounding the thin-walled part; and (c) a process of forming at least one through-hole in a region within the thin-walled part.

Description

  The present invention relates to a glass substrate and an interposer for an interposer, and a manufacturing method thereof.

  In general, the laser ablation method can form a fine pattern on a substrate material to be processed. Therefore, the laser ablation method is widely used in the field of semiconductor element manufacturing that requires miniaturization and high-density mounting. (For example, Patent Documents 1 and 2).

  Recently, it has become clear that structures such as through holes for fine patterns and vias can be formed on transparent substrates such as glass substrates by laser ablation using laser light such as excimer lasers. ing.

  For example, Patent Document 3 discloses a method of manufacturing a glass substrate for an interposer by forming a plurality of through holes (vias) by irradiating a plate glass with laser light.

JP 2005-88045 A JP 2002-126886 A International Publication No. WO2010 / 087483 Pamphlet

  In the field of semiconductor element manufacturing, further miniaturization and higher density of elements are required, and the need for miniaturization of through-holes (vias) will increase further in the future for glass substrates for interposers. is expected.

  Here, in the method for producing a glass substrate for interposer in Patent Document 3, a through hole is formed by irradiating the surface of a plate glass having a thickness of 0.05 mm or more and 0.4 mm or less with laser light. It is shown.

  However, in such a method, there is a problem that it is difficult to properly form a fine through hole (for example, a through hole having a diameter of 10 μmφ or less) for the following reason.

  Usually, the through-hole formed by the laser ablation method has a tapered shape with a diameter decreasing from the first surface (side closer to the laser beam) to the second surface (side farther from the laser beam) of the glass substrate. . Therefore, when a fine through-hole is formed by irradiating laser light from the first surface side, the hole does not extend to the second surface side, and an opening may not be formed on the second surface. Because you get.

  As described above, in the normal laser ablation method, it is difficult to reduce the diameter of the through hole to a certain extent (for example, a diameter of 10 μmφ) or less. For this reason, in the normal method, fine through holes are arranged at a high density. Has its limits.

  In addition, in order to deal with this problem, when the thickness of the glass substrate is reduced, the glass substrate may be damaged or the glass substrate may be chipped during handling of the glass substrate such as a processing step and a conveyance step. Becomes higher. That is, in a thin glass substrate, the strength is lowered, and it may be difficult to handle the glass substrate.

  This invention is made | formed in view of such a background, and this invention aims at provision of the manufacturing method of the glass substrate for interposers which can form a fine through-hole while being easy to handle. Another object of the present invention is to provide a method for producing an interposer having such characteristics, a glass substrate for an interposer, and an interposer including such a glass substrate.

In the present invention (first invention)
A method for producing a glass substrate for an interposer having at least one through hole,
(A) preparing a glass substrate having a first surface and a second surface and having a first thickness;
(B) forming a thin portion thinner than the first thickness on the first surface of the glass substrate, thereby forming the thin portion and the thick portion surrounding the thin portion; A process to be performed;
(C) forming at least one through hole in the region within the thin portion;
A manufacturing method is provided.

  Here, in the manufacturing method of the glass substrate for interposers by this invention, the said thin part may be formed in the area | region except the peripheral part of the said glass substrate.

  In the method for manufacturing a glass substrate for an interposer according to the present invention, a plurality of the thin portions may be formed on the first surface of the glass substrate.

  In the method for manufacturing a glass substrate for an interposer according to the present invention, the first thickness may be in a range of 0.1 mm to 5 mm.

  Moreover, in the manufacturing method of the glass substrate for interposers by this invention, the thickness of the said thin part may be 5 micrometers or more and less than 100 micrometers.

  In the method for manufacturing a glass substrate for an interposer according to the present invention, the diameter of the through hole may be in the range of 5 μm to 100 μm.

  Moreover, in the manufacturing method of the glass substrate for interposers by this invention, the process of said (b) may have a process of etching the said glass substrate and forming the said thin part.

  Moreover, in the manufacturing method of the glass substrate for interposers by this invention, the process of said (c) may have the process of irradiating a laser beam to the area | region in the said thin part.

In the method of manufacturing a glass substrate for an interposer according to the present invention, the laser light may be excimer laser light, YAG laser light, or CO ₂ laser light.

  In the method for manufacturing a glass substrate for an interposer according to the present invention, the step (b) may further include a step of forming a second thin portion on the second surface of the glass substrate. .

The method for producing a glass substrate for an interposer according to the present invention further comprises:
(D) You may have the process of cut | disconnecting the said glass substrate.

  In this case, the step (d) may include a step of cutting the glass substrate along the thick portion.

In the present invention (second invention),
An interposer manufacturing method comprising:
(A) A step of preparing a glass substrate having a through-hole, wherein the glass substrate is a glass substrate manufactured by the method for manufacturing a glass substrate for an interposer having the characteristics as described in the first invention. When,
(B) forming an insulating layer having a through-opening installed on the second surface of the glass substrate so as to correspond to the through-hole;
(C) a step of installing a conductive layer of a conductive material on the insulating layer, the conductive material filling the through hole and the through opening;
(D) installing a resin layer on top of the conductive layer;
A method for manufacturing an interposer is provided.

In the present invention (third invention),
An interposer manufacturing method comprising:
(I) a step of preparing a glass substrate having a first surface and a second surface, wherein the glass substrate has a thin portion surrounded by a thick portion on the first surface;
(Ii) installing an insulating layer on the second surface of the glass substrate;
(Iii) forming at least one through hole penetrating from the insulating layer to the thin portion of the glass substrate;
(Iv) a step of installing a conductive layer of a conductive material on at least a part of the insulating layer, the conductive material filling the through hole;
(V) installing a resin layer on top of the conductive layer;
An interposer manufacturing method is provided.

In the present invention (fourth invention),
An interposer glass substrate having at least one through hole,
A thin portion and a thick portion surrounding the thin portion;
An interposer glass substrate is provided in which the through hole is formed in a region of the thin portion.

  Here, in the glass substrate for an interposer according to the present invention, the thickness of the thick portion may be in a range of 0.1 mm to 5 mm.

  In the glass substrate for an interposer according to the present invention, the thin portion may have a thickness of 5 μm or more and less than 100 μm.

In the glass substrate for an interposer according to the present invention, the diameter of the through hole is
It may be in the range of 5 μm to 100 μm.

In the present invention (the fifth invention),
An interposer having at least one via formed in a glass layer and filled with a conductive material, a wiring layer electrically connected to the conductive material, and a resin layer disposed on the wiring layer There,
The via is constituted by the through hole of the glass substrate for interposer as in the fourth invention described above.

  The present invention can provide a method for producing a glass substrate for an interposer that is easy to handle and can form fine through holes. Moreover, in this invention, the manufacturing method of the interposer which has such a characteristic, the glass substrate for interposers, and the interposer containing such a glass substrate can be provided.

It is the figure which showed roughly an example of the flow of the manufacturing method of the glass substrate for interposers by this invention. It is the figure which showed an example of the arrangement | positioning form of a thin part and a thick part. It is the figure which showed an example of the arrangement | positioning form of a thin part and a thick part. It is the figure which showed an example of the arrangement | positioning form of a thin part and a thick part. It is the figure which showed an example of the arrangement | positioning form of a thin part and a thick part. It is the figure which showed an example of the apparatus structure used when forming a through-hole in the thin part of a glass substrate by the laser ablation method. It is the figure which showed the cutting position of the glass substrate roughly. It is the figure which showed the cutting position of the glass substrate roughly. It is sectional drawing which showed an example of the structural member in each process of the manufacturing method of the interposer by this invention. It is the figure which showed roughly an example of the flow of the 2nd manufacturing method of an interposer. It is sectional drawing which showed roughly an example of the structure of the structural member in each process of FIG. It is the figure which showed the upper side figure of the plate glass in which the some thin part was formed. It is the figure which showed sectional drawing in the AA of the plate glass of FIG.

  As described above, in general, in a method for manufacturing a glass substrate for an interposer having a through hole using a laser ablation method, the through hole to be formed is first from the first surface (side closer to the laser beam) of the glass substrate. It tends to become a tapered shape with a diameter decreasing toward the surface of 2 (the side far from the laser beam). Therefore, in the conventional method, in the case of a glass substrate having a thickness exceeding 100 μm, it is difficult to reduce the diameter of the through hole to a certain extent (for example, a diameter of 10 μmφ) or less. There is a limit to disposing fine through holes at high density in a glass substrate.

  In addition, in order to cope with this problem, when the thickness of the glass substrate is reduced, the glass substrate may be damaged or the glass substrate may be chipped during handling of the glass substrate such as a processing step and a conveyance step. Becomes higher. That is, in a thin glass substrate, a problem may arise that strength is lowered and handling of the glass substrate becomes difficult.

In contrast, in the present invention,
A method for producing a glass substrate for an interposer having at least one through hole,
(A) preparing a glass substrate having a first surface and a second surface and having a first thickness;
(B) forming a thin portion thinner than the first thickness on the first surface of the glass substrate, thereby forming the thin portion and the thick portion surrounding the thin portion; A process to be performed;
(C) forming at least one through hole in the region within the thin portion;
The manufacturing method characterized by including is provided.

  Here, in the present application, the “first thickness” of the glass substrate means that in the glass substrate having the first surface and the second surface, when the first surface and the second surface are substantially parallel, It means the distance between the surface of one and the second surface. “Substantially parallel” means that they are visually parallel. On the other hand, when the first surface and the second surface of the glass substrate are not parallel to each other, the “first thickness” of the glass substrate is the distance between the first surface and the second surface of the glass substrate. Of these, the smallest value is meant.

  In the manufacturing method of this invention, a glass substrate has a thin part and a thick part, and these parts have a role as a through-hole formation part of a glass substrate, and the intensity | strength ensuring part of a glass substrate, respectively. That is, in the present invention, the thin portion of the glass substrate can be used as a region for forming a through hole, and the thick portion of the glass substrate can be used as a region for increasing the strength of the glass substrate and reinforcing the glass substrate. .

  In the manufacturing method of the present invention, since the thin portion of the glass substrate is used as a region for forming a through hole, even when a method in which a tapered through hole is easily formed, such as a laser ablation method, is used. Fine through holes can be easily formed. Therefore, in the manufacturing method of the present invention, a large number of fine through holes corresponding to the vias of the interposer can be formed in the glass substrate at a high density.

  Moreover, in the manufacturing method of this invention, a glass substrate has a thick part and this part functions as a reinforcement member of a glass substrate. Accordingly, cracking of the glass substrate or breakage of the glass substrate during handling of the glass substrate is significantly suppressed.

(Specific configuration of the present invention)
Hereinafter, the present invention will be described in more detail with reference to the drawings.

  In FIG. 1, an example of the flow of the manufacturing method of the glass substrate for interposers by this invention is shown roughly.

As shown in FIG. 1, the manufacturing method of the glass substrate for interposers by this invention is the following.
(A) preparing a glass substrate having a first surface and a second surface and having a first thickness (step 110);
(B) forming a thin portion thinner than the first thickness on the first surface of the glass substrate, thereby forming the thin portion and the thick portion surrounding the thin portion; A process to be performed (step 120);
(C) including a step of forming at least one through hole in the region within the thin wall portion (step 130).

In addition, the manufacturing method of the glass substrate for interposers according to the present invention, if necessary,
(D) You may have the process (step S140) which cut | disconnects the said glass substrate. Hereinafter, each step will be described in detail.

(Step S110)
First, a glass substrate to be processed is prepared.

  The shape of the glass substrate is not particularly limited, and the glass substrate may be rectangular or disk-shaped.

  The material of the glass substrate is not particularly limited as long as it is glass. The glass substrate may be, for example, silica glass, soda lime glass, aluminoborosilicate alkali-free glass, or phosphate glass.

  The thickness of the glass substrate (first thickness) is not particularly limited, but it should be noted that the present invention can also be applied to a thick glass substrate. The 1st thickness of a glass substrate is the range of 100 micrometers-5 mm, for example.

(Step S120)
Next, a thin part is formed on one surface (for example, the first surface) of the glass substrate using the glass substrate prepared in step S110. Moreover, the thick part surrounding this thin part is formed.

  The method for forming the thin portion on the glass substrate is not particularly limited. Examples of the method for forming the thin-walled portion include a wet or dry etching method, a sand blast method, a mechanical polishing method, and a pressure molding method. However, in the sand blasting method, one surface of the thin part to be obtained becomes rough, so that a method other than sand blasting is preferably used when a flat surface is required. Among these, the wet etching method is particularly preferable. This is because the wet etching method suppresses the possibility of cracks and cracks occurring in the glass substrate during processing.

  The thickness of the thin portion is, for example, not less than 5 μm and less than 100 μm. The thickness of the thin-walled portion is not limited to one type, and may have a thin-walled portion having various thicknesses.

  The formation position of the thin-walled portion (and thick-walled portion) is not particularly limited, but in a normal case, the thin-walled portion is formed in a portion other than the peripheral portion of the glass substrate (in this case, the peripheral portion of the glass substrate is It becomes a thick part). In addition, the shape, the number, the arrangement form, and the like of the thin-walled portion (and the thick-walled portion) are not particularly limited and can be freely determined according to the application.

  2-5 shows an example of the arrangement | positioning form of a thin part (and thick part).

  In the example of the arrangement form shown in FIG. 2, the thin portion 110 is formed in the entire region except for the peripheral portion on the first surface 105 of the rectangular glass substrate 100. For this reason, the peripheral part of the glass substrate 100 becomes the thick part 120.

  In the example of the arrangement form shown in FIG. 3, the thin portion 210 is formed in the entire region of the first surface 205 of the disk-shaped glass substrate 200 except the peripheral portion. For this reason, the peripheral part of the glass substrate 200 becomes the thick part 220.

  In the example of the arrangement form illustrated in FIG. 4, a plurality of rectangular thin walls are formed in the first surface 305 of the rectangular glass substrate 300 along the long side direction (X direction) and the short side direction (Y direction). The parts 310 are regularly arranged. In addition to the peripheral edge of the glass substrate 300, the thick part 320 is also formed in a lattice shape along the X direction and the Y direction in regions other than the peripheral part.

  In the above example, the case where the thin part (110, 210, 310) is formed only on the first surface (105, 205, 305) of the glass substrate (100, 200, 300) has been described. Accordingly, the second surface (106, 206, 306) of the glass substrate remains substantially flat. However, the present invention is not limited to such a configuration, and a thin portion (and a thick portion) may also be formed on the second surface of the glass substrate.

  FIG. 5 shows an example of a cross-sectional view of a glass substrate in which a thin portion (and a thick portion) is also formed on the second surface of the glass substrate.

  As shown in FIG. 5, in the glass substrate 400, a plurality of thin portions 410 and a thick portion 420 are formed on the first surface 405, and a plurality of thin walls are also formed on the second surface 406 side. A part 450 and a thick part 460 are formed. Further, the positions in the vertical direction (Z direction) of the thin portion 450 and the thick portion 460 on the second surface 406 correspond to the positions of the thin portion 410 and the thick portion 420 formed on the first surface 405, respectively. is doing. The thin part (and thick part) may be arranged on both surfaces of the glass substrate in this way.

  The arrangement of the thin portions 110, 210, 310, 410, 450 and the thick portions 120, 220, 320, 420, and 460 shown in FIGS. 2 to 5 is merely an example, and other than this, It will be apparent to those skilled in the art that thin and thick portions can be formed in various arrangements.

(Step S130)
Next, at least one through hole is formed in the region within the thin portion formed in the above-described step.

  As described above, the thickness of the glass substrate is significantly reduced in the thin portion compared to the thick portion. For this reason, a through-hole can be formed in the area | region in a thin part comparatively easily in a comparatively short time. In particular, in such a structure, a through-hole having a tapered shape as in the conventional case (for example, noticeable in the laser ablation method) is formed, and the first surface side and the second surface side are penetrated. Since the problem that the diameters of the holes are greatly different is reduced, fine through holes can be appropriately formed. Furthermore, since the thick portion 120 exists in the glass substrate, the glass substrate 100 is also significantly suppressed from being broken or cracked during handling due to insufficient strength or the like.

  The diameter of the through hole may be, for example, in the range of 5 μm to 100 μm, preferably in the range of 5 μm to 30 μm.

The method for forming the through hole is not particularly limited. The through hole may be formed by, for example, a laser ablation method, a sand blast method, a mechanical drilling method, an etching method, an electric discharge machining method, or a combination thereof. In the case of the laser ablation method, the laser light used is not particularly limited, and the laser light may be, for example, excimer laser light, YAG laser light, CO ₂ laser light, or the like.

  FIG. 6 shows an example of an apparatus configuration used when a through hole is formed in a thin portion of a glass substrate by a laser ablation method.

  As shown in FIG. 6, the apparatus 600 includes a light source 611 for laser light, a homogenizer 616, a mask 613 having a plurality of through holes, a projection lens 617, and a stage 614. In addition, the apparatus 600 includes a plurality of mirrors 615 for guiding the laser light 621 emitted from the laser light source 611 to a desired position. On the stage 614, the glass substrate 612 on which the thin portion and the thick portion are formed by the above-described method is placed.

  In such a configuration of the apparatus 600, when the laser light 621 is emitted from the light source 611 for laser light, the laser light 621 is guided into the homogenizer 616, where it is adjusted to the laser light 622 having uniform intensity. Is done. The laser beam 622 is guided toward the mask 613 by a mirror 615 or the like. Since the mask 613 has a large number of through holes as described above, a part of the laser light 622 is guided to the projection lens 617 through the through holes. Further, the laser light 623 that has reached the projection lens 617 is irradiated onto the thin portion 650 of the glass substrate 612 in a reduced projection state. Thereby, one or two or more through holes are formed in the thin portion 650 of the glass substrate 612.

  In the case where a plurality of through holes are formed over a wider area of the thin portion 650 of the glass substrate 612, for example, after the above operation, the emission of the laser light 621 from the light source 611 is temporarily stopped and the stage 614 On the other hand, the glass substrate 612 may be moved. Thereafter, the laser beam 621 may be emitted again from the light source 611 to perform the same thing. Alternatively, it will be apparent to those skilled in the art that a plurality of through-holes can be formed over a wider area by other methods.

  6 is merely an example, and it will be apparent to those skilled in the art that through holes may be formed in the thin portion of the glass substrate using another device.

(Step S140)
Although the necessary number of through holes can be formed in the thin portion of the glass substrate by the above steps, a step of cutting the glass substrate at a necessary position may be performed if necessary.

  7 and 8 schematically show an example of the cutting position of the glass substrate. In these drawings, it is assumed that the glass substrate 700 has a thin portion and a thick portion having a form as shown in FIG.

  For example, as shown in FIG. 7, the glass substrate 700 may be cut along the cutting line PP, that is, along the thick portion 720. In this case, each piece 790 cut has a form having a thick portion 720 (a part thereof) on the cut end face. Alternatively, when the width of the thick portion 720 (the length in the X direction) is equal to the cutting margin at the time of cutting, each piece 790 after cutting does not substantially have the thick portion 720 on the end surface (that is, In some cases, it is composed of only the thin portion 710.

  On the other hand, the glass substrate 700 may be cut along the cutting line QQ, that is, including only the thin portion 710 in advance, as shown in FIG.

  In addition, the glass substrate may be cut in various forms, and the piece 790 having at least one through hole 770 may be collected.

  As described above, in the manufacturing method according to the present invention, the glass substrate always has a thick portion during each step (step S120 to step S140), so that the strength of the glass substrate is lowered and the handling of the glass substrate is complicated. Or the problem that the glass substrate is broken can be significantly suppressed. In the manufacturing method according to the present invention, the through-hole is formed in the thin portion of the glass substrate. For this reason, for example, it is difficult to form a fine through hole as in the case of using a thick glass plate even if a method such as a laser ablation method in which a tapered through hole is easily formed is used. The problem can be significantly reduced.

(Interposer manufacturing method)
Next, with reference to FIG. 9, the manufacturing method of the interposer by this invention is demonstrated. In FIG. 9, an example of sectional drawing of the structural member in each process of the manufacturing method of the interposer by this invention is shown.

  First, as shown in FIG. 9A, a glass substrate 1000 having a first surface 1005 and a second surface 1006 is prepared.

  The glass substrate 1000 has a thin portion 1010 and a thick portion 1020 on the first surface 1005, and at least one (two in the example of FIG. 9) through-holes 1050 is formed in the region of the thin portion 1010. is set up. Such a glass substrate 1000 may be prepared using the method for manufacturing a glass substrate for an interposer according to the present invention as described above.

  Next, as shown in FIG. 9B, the conductive material 1060 is filled into the through hole 1050 of the glass substrate 1000. The conductive material 1060 may be a highly conductive metal such as copper.

  The installation method of the conductive material is not particularly limited, and the conductive material 1060 is formed by, for example, electroless plating or electrolytic plating.

  Next, as illustrated in FIG. 9C, the insulating layer 1070 is provided on the second surface 1006 of the glass substrate 1000. The material of the insulating layer 1070 is not particularly limited as long as it is an insulator, and the insulating layer 1070 may be made of, for example, an inorganic material or a resin.

  Moreover, the installation method of the insulating layer 1070 is not particularly limited. For example, when the insulating layer 1070 is made of a resin, the insulating layer 1070 may be installed by a coating method or the like. For example, when the insulating layer 1070 is made of an inorganic material, the insulating layer 1070 may be provided by a sputtering method or the like.

  Thereafter, a through-opening 1075 is formed in the insulating layer 1070 at a position corresponding to the conductive material 1060 filled in the glass substrate 1000. Such a through-opening 1075 can be easily formed by a technique such as photolithography. Or you may form the insulating layer 1070 which has the through-opening 1075 on the 2nd surface 1006 of the glass substrate 1000 from the beginning, for example by using a mask.

  Although not shown in the drawing, the insulating layer may be further provided on the first surface 1005 side of the glass substrate 1000.

  Next, as illustrated in FIG. 9D, the conductive layer 1080 is provided on the insulating layer 1070. The conductive layer 1080 fills the through-opening 1075 of the insulating layer 1070 and is installed so that the conductive layer 1080 and the conductive material 1060 in the through-hole 1050 of the glass substrate 1000 are electrically connected.

  The installation method of the conductive layer 1080 is not particularly limited. The conductive layer 1080 may be installed using a sputtering method, for example.

  If necessary, the conductive layer 1080 may be patterned so as to obtain a desired wiring pattern. The patterning method is not particularly limited, and the conductive layer 1080 may be patterned by, for example, a photolithography process using a mask.

  Next, as illustrated in FIG. 9E, a resin layer 1090 is provided on the conductive layer 1080. In addition, a through groove reaching the conductive layer 1080 is formed in the resin layer 1090 as necessary.

  Through the above steps, the interposer 1095 having fine vias can be manufactured. If necessary, the thick portion 1020 of the glass substrate 1000 may be finally cut. Thereby, a flat-shaped interposer can be provided. Alternatively, when the number of vias formed in the thin portion 1010 is too large, or when it is desired to reduce the size of the interposer, the glass substrate 1000 may be cut between vias in the thin portion 1010 or the like.

  In the above-described method, as shown in FIGS. 9B to 9C, the insulating layer 1070 is installed after the through hole 1050 is filled with the conductive material 1060. However, unlike this, in the step of installing the insulating layer 1070 having the through opening 1075 on the second surface 1006 of the glass substrate 1000 and installing the conductive layer 1080, both the through hole 1050 and the through opening 1075 are provided. In addition, the conductive material may be filled at a time. In this case, the step of previously installing the conductive material 1060 in the through hole 1060 of the glass substrate 1000 can be omitted.

(Another method for manufacturing interposers)
Next, another method for manufacturing the interposer (second manufacturing method) according to the present invention will be described with reference to FIGS. In FIG. 10, an example of the flow of the 2nd manufacturing method of an interposer is shown roughly. FIG. 11 shows an example of a cross-sectional view of the constituent members in each step of FIG.

As shown in FIG. 10, the manufacturing method of the interposer according to the present invention includes
(I) A step of preparing a glass substrate having a first surface and a second surface, wherein the glass substrate has a thin portion surrounded by a thick portion on the first surface (step) S310)
(Ii) a step of installing an insulating layer on the second surface of the glass substrate (step S320);
(Iii) forming at least one through hole penetrating from the insulating layer to the thin portion of the glass substrate (step S330);
(Iv) a step of installing a conductive layer of a conductive material on at least a part of the insulating layer, the conductive material filling the through hole (step S340);
(V) installing a resin layer on top of the conductive layer (step S350);
Have

  Hereinafter, each step will be described in detail with reference to FIG.

(Step S310)
First, as shown in FIG. 11A, a glass substrate 1100 having a first surface 1105 and a second surface 1106 is prepared. The glass substrate 1100 has a thin portion 1110 and a thick portion 1120 on the first surface 1105 side.

  Such a glass substrate can be prepared, for example, by the processes shown in Steps S110 to S120 of the above-described glass substrate manufacturing method.

  In the following description, the second method for manufacturing an interposer according to the present invention will be described by taking as an example the glass substrate 1100 in which the thick portion 1120 is formed only at the peripheral portion of the first surface 1105 of the glass substrate 1100. However, the form of the glass substrate may be, for example, the glass substrate 100, 200, 300, 400 or the like shown in FIGS. 2 to 5, that is, as long as the glass substrate has a thin part and a thick part. It will be apparent to those skilled in the art that any form may be used.

(Step S320)
Next, as illustrated in FIG. 11B, an insulating layer 1170 </ b> A is provided on the second surface 1106 side of the glass substrate 1100. Further, an insulating layer 1170B is provided on the first surface 1105 side of the glass substrate 1100. However, the insulating layer 1170B may be omitted.

  The material of the insulating layers 1170A and 1170B is not particularly limited as long as it is an insulator, and the insulating layers 1170A and 1170B may be made of, for example, an inorganic material or a resin.

  Moreover, the installation method of the insulating layers 1170A and 1170B is not particularly limited. For example, when the insulating layers 1170A and 1170B are made of resin, the insulating layers 1170A and 1170B may be installed by a coating method or the like. For example, when the insulating layers 1170A and 1170B are made of an inorganic material, the insulating layers 1170A and 1170B may be provided by a sputtering method or the like.

(Step S330)
Next, as shown in FIG. 11C, at least one through-hole 1175 from the surface of the insulating layer 1170A through the thin portion 1110 of the glass substrate 1100 to the insulating layer 1170B is formed.

Such a through hole 1175 may be formed by, for example, a laser ablation method, a sand blast method, a mechanical drilling method, an etching method, an electric discharge machining method, or a combination thereof. In the case of the laser ablation method, the laser light used is not particularly limited, and the laser light may be, for example, excimer laser light, YAG laser light, CO ₂ laser light, or the like.

  Here, in the manufacturing method according to the present invention, since the through hole 1175 is formed in the region of the thin portion 1110 of the glass substrate 1100, the through hole 1175 having a fine diameter can be formed relatively easily. It is necessary to keep in mind. The diameter of the through hole 1175 may be, for example, in the range of 5 μm to 100 μm, preferably in the range of 5 μm to 30 μm.

(Step S340)
Next, as shown in FIG. 11D, a conductive layer 1180 made of a conductive material is provided on at least part of the insulating layer 1170A. The conductive material 1180 is installed so as to fill the through hole 1175.

  The installation method of the conductive layer 1180 is not particularly limited, and the conductive layer 1180 may be formed by a sputtering method, an electrolytic plating method, or the like.

  If necessary, the conductive layer 1180 may be patterned so as to obtain a desired wiring pattern. The patterning method is not particularly limited. For example, the conductive layer 1180 may be patterned by photolithography using a mask.

(Step S350)
Next, as illustrated in FIG. 11E, a resin layer 1190 is provided on the conductive layer 1180. In addition, a through groove reaching the conductive layer 1180 is formed in the resin layer 1190 as necessary.

  Through the above steps, an interposer 1195 having fine vias can be manufactured.

  If necessary, the thick part 1120 of the glass substrate 1100 may be finally cut. Thereby, a flat-shaped interposer can be provided. Alternatively, when the number of vias formed in the thin part 1110 is too large, or when it is desired to reduce the size of the interposer, the glass substrate 1100 may be cut between vias and vias in the thin part 1110.

  Examples of the present invention will be described below.

Example 1
A glass substrate having a large number of fine through holes was produced by the following method.

(Formation of thin part)
First, plate glass (ENA1 manufactured by Asahi Glass Co., Ltd.) made of alkali-free glass having a length of 600 mm, a width of 400 mm, and a thickness of 180 μm was prepared.

  Next, a plurality of thin portions were formed on the inner portion of one surface (first surface) of the plate glass. The thin-walled portion was formed by a general wet etching method used for etching a glass material. The thickness of the thin portion was 30 μm.

  In FIG. 12, the top view of the plate glass in which the several thin part was formed is shown. This figure is a view of the plate glass 1200 as viewed from the first surface 1205 side. Moreover, in FIG. 13, sectional drawing in the AA of this plate glass is shown.

  As shown in FIGS. 12 and 13, the glass sheet 1200 has a first surface 1205 and a second surface 1206 that are parallel to each other. Further, the plate glass 1200 has a thick portion 1220A formed along the outer peripheral edge of the plate glass 1200 on the first surface 1205 side, and along the long side direction (X direction) and the short side direction (Y direction). And a thick portion 1220B extending in a lattice shape. In addition, on the first surface 1205 of the plate glass 1200, a large number of square-shaped thin portions 1210 surrounded by the thick portions 1220A and 1220B are formed.

  In FIG. 12, the widths L1 and L2 in the X direction of the thick portion 1220A are both 30 mm, and the widths W1 and W2 in the Y direction of the thick portion 1220A are both 30 mm. Further, the width P1 in the X direction and the width P2 in the Y direction of the thick portion 1220B are both 2 mm. In the thin portion 1210, the length S1 in the X direction and the length S2 in the Y direction are both 6 mm.

(Formation of through holes)
Next, through holes were formed in each thin portion 1210 of the plate glass 1200 having the thick portions 1220A, 1220B and the thin portion 1210 of the above-described form.

The through hole was formed by a laser ablation method using the apparatus 600 having the configuration shown in FIG. An ArF laser light source was used as the laser light source 611. The wavelength of this laser beam is 193 nm. The mask 613 was made of stainless steel having a thickness of 0.4 mm and having a plurality of holes having a diameter of 80 μm. The irradiation fluence of the laser beam was adjusted to 5 J / cm ^{2 at} the position of the thin portion 1210 of the plate glass 1200. Laser light was irradiated from the first surface 1205 side of the plate glass 1200. The pitch of the through holes was 20 μm in both the long side direction (X direction) and the short side direction (Y direction) of the plate glass 1200.

  In the case of the through hole forming process, each time the laser ablation process is completed, the thin glass part 1210 is penetrated throughout by repeatedly shifting the plate glass 1200 by 2 mm in the X direction and / or the Y direction. A hole was formed.

  During the formation of the through holes and during the formation of the through holes, the plate glass 1200 did not have any problems such as breakage.

  When the shape of the through hole was observed with an optical microscope after the treatment, the diameter of the through hole was about 8 μmφ on the first surface 1205 side and about 6 μmφ on the second surface 1206 side. Therefore, the taper angle ≈ 1.9 °. Further, no damage such as cracking or chipping was observed in the plate glass.

(Example 2)
A glass substrate having a plurality of fine through holes was produced in the same manner as in Example 1.

  However, in Example 2, the glass material was soda lime glass (manufactured by Asahi Glass Co., Ltd.), and the glass shape was a disk shape having a diameter of 300 mm and a thickness of 500 μm.

  The thick portion was formed only around the first surface of the glass disk, and the other region of the first surface was a single thin portion. The width of the thick part was 20 mm, and the thickness of the thin part was 30 μm.

  Further, the through holes are regularly arranged along the vertical and horizontal directions, and the pitch of the through holes is set to 30 μm in both the vertical and horizontal directions.

  During the preparation of the formation of the through hole and during the formation process of the through hole, the glass disk had no problem such as breakage.

  As a result of optical microscope observation, the diameter of the first surface side of the obtained through-hole was about 5 μm, and the diameter of the second surface side was about 4 μm. Therefore, the taper angle is approximately 1.0 °. Further, no damage such as cracking or chipping was observed in the glass disk.

  The present invention can be suitably used for applications such as members for semiconductor elements, more specifically, insulating layers of multilayer circuit boards, wafer level packages, through holes for extracting electrodes, and interposers.

100 glass substrate 105 first surface 106 second surface 110 thin portion 120 thick portion 200 glass substrate 205 first surface 206 second surface 210 thin portion 220 thick portion 300 glass substrate 305 first surface 306 first 2 surface 310 thin part 320 thick part 400 glass substrate 405 first surface 406 second surface 410 thin part 420 thick part 450 thin part 460 thick part 600 device 611 light source 612 glass substrate 613 mask 614 stage 615 mirror 616 Homogenizer 617 Projection lens 621, 622, 623 Laser light 650 Thin part 700 Glass substrate 710 Thin part 720 Thick part 770 Through hole 790 Piece 1000 Glass substrate 1005 First surface 1006 Second surface 1010 Thin part 1020 Thick part 050 Through-hole 1060 Conductive material 1070 Insulating layer 1075 Through-opening 1080 Conductive layer 1090 Resin layer 1095 Interposer 1100 Glass substrate 1105 First surface 1106 Second surface 1110 Thin portion 1120 Thick portion 1170A, 1170B Insulating layer 1175 Through-hole 1180 Conductive layer 1190 Resin layer 1195 Interposer 1200 Sheet glass 1205 First surface 1206 Second surface 1210 Thin portion 1220A, 1220B Thick portion.

Claims (19)

A method for producing a glass substrate for an interposer having at least one through hole,
(A) preparing a glass substrate having a first surface and a second surface and having a first thickness;
(B) forming a thin portion thinner than the first thickness on the first surface of the glass substrate, whereby the thin portion and the thick portion surrounding the thin portion are formed. A process to be formed;
(C) forming at least one through hole in the region within the thin portion;
Manufacturing method.   The said thin part is formed in the area | region except the peripheral part of the said glass substrate, The manufacturing method of Claim 1 characterized by the above-mentioned.   The manufacturing method according to claim 1, wherein a plurality of the thin-walled portions are formed on the first surface of the glass substrate.   The manufacturing method according to any one of claims 1 to 3, wherein the first thickness is in a range of 0.1 mm to 5 mm.   5. The manufacturing method according to claim 1, wherein a thickness of the thin portion is not less than 5 μm and less than 100 μm.   The manufacturing method according to claim 1, wherein a diameter of the through hole is in a range of 5 μm to 100 μm.   The manufacturing method according to claim 1, wherein the step (b) includes a step of etching the glass substrate to form the thin portion.   The manufacturing method according to claim 1, wherein the step (c) includes a step of irradiating a region in the thin portion with a laser beam. The manufacturing method according to claim 8, wherein the laser light is excimer laser light, YAG laser light, or CO ₂ laser light.   10. The method according to claim 1, wherein the step (b) further includes a step of forming a second thin portion on the second surface of the glass substrate. 11. Production method. further,
(D) The process which cut | disconnects the said glass substrate. The manufacturing method as described in any one of the Claims 1 thru | or 10 characterized by the above-mentioned.   The manufacturing method according to claim 11, wherein the step (d) includes a step of cutting the glass substrate along the thick portion. An interposer manufacturing method comprising:
(A) A step of preparing a glass substrate having a through hole, wherein the glass substrate is a glass substrate manufactured by the manufacturing method according to any one of claims 1 to 11,
(B) forming an insulating layer having a through-opening installed on the second surface of the glass substrate so as to correspond to the through-hole;
(C) a step of installing a conductive layer of a conductive material on the insulating layer, the conductive material filling the through hole and the through opening;
(D) installing a resin layer on top of the conductive layer;
A method of manufacturing an interposer, comprising: An interposer manufacturing method comprising:
(I) a step of preparing a glass substrate having a first surface and a second surface, wherein the glass substrate has a thin portion surrounded by a thick portion on the first surface;
(Ii) installing an insulating layer on the second surface of the glass substrate;
(Iii) forming at least one through hole penetrating from the insulating layer to the thin portion of the glass substrate;
(Iv) a step of installing a conductive layer of a conductive material on at least a part of the insulating layer, the conductive material filling the through hole;
(V) installing a resin layer on top of the conductive layer;
A method of manufacturing an interposer having An interposer glass substrate having at least one through hole,
A thin portion and a thick portion surrounding the thin portion;
The glass substrate for an interposer, wherein the through hole is formed in the region of the thin portion.   The glass substrate for an interposer according to claim 15, wherein a thickness of the thick part is in a range of 0.1 mm to 5 mm.   The thickness of the said thin part is 5 micrometers or more and less than 100 micrometers, The glass substrate for interposers of Claim 15 or 16 characterized by the above-mentioned.   The diameter of the said through-hole is the range of 5 micrometers-100 micrometers, The glass substrate for interposers as described in any one of Claims 15 thru | or 17 characterized by the above-mentioned. An interposer having at least one via formed in a glass layer and filled with a conductive material, a wiring layer electrically connected to the conductive material, and a resin layer disposed on the wiring layer There,
The interposer is constituted by the through hole of the glass substrate for interposer according to any one of claims 15 to 18.

Images