SG11201811135QA - Light-emitting element housing member, array member, and light-emitting device - Google Patents

Light-emitting element housing member, array member, and light-emitting device

Info

Publication number
SG11201811135QA
SG11201811135QA SG11201811135QA SG11201811135QA SG11201811135QA SG 11201811135Q A SG11201811135Q A SG 11201811135QA SG 11201811135Q A SG11201811135Q A SG 11201811135QA SG 11201811135Q A SG11201811135Q A SG 11201811135QA SG 11201811135Q A SG11201811135Q A SG 11201811135QA
Authority
SG
Singapore
Prior art keywords
light
emitting element
element housing
housing member
substrate
Prior art date
Application number
SG11201811135QA
Other languages
English (en)
Inventor
Youji Furukubo
Sentaro Yamamoto
Masanori Okamoto
Katsuaki Masaki
Takehiro Nishimura
Kazuya Shibata
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of SG11201811135QA publication Critical patent/SG11201811135QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0207—Substrates having a special shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
SG11201811135QA 2016-04-18 2017-04-18 Light-emitting element housing member, array member, and light-emitting device SG11201811135QA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016082994 2016-04-18
JP2016146592 2016-07-26
JP2016166726 2016-08-29
PCT/JP2017/015601 WO2017183638A1 (ja) 2016-04-18 2017-04-18 発光素子収納用部材、アレイ部材および発光装置

Publications (1)

Publication Number Publication Date
SG11201811135QA true SG11201811135QA (en) 2019-01-30

Family

ID=60116793

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201811135QA SG11201811135QA (en) 2016-04-18 2017-04-18 Light-emitting element housing member, array member, and light-emitting device

Country Status (9)

Country Link
US (1) US10862264B2 (ja)
EP (1) EP3447864B1 (ja)
JP (2) JP6298225B1 (ja)
KR (1) KR102281484B1 (ja)
CN (1) CN109075526B (ja)
RU (1) RU2018140496A (ja)
SG (1) SG11201811135QA (ja)
TW (1) TWI652867B (ja)
WO (1) WO2017183638A1 (ja)

Families Citing this family (7)

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CN111386637B (zh) 2017-11-24 2023-07-28 京瓷株式会社 发光元件搭载用基板和阵列基板、以及发光装置
EP3859912B1 (en) * 2018-09-28 2023-08-09 Kyocera Corporation Light-emitting element mounting substrate, array substrate, and light-emitting device
JP7122392B2 (ja) * 2018-11-08 2022-08-19 京セラ株式会社 発光素子収納用基板および発光装置
WO2020218595A1 (ja) * 2019-04-25 2020-10-29 京セラ株式会社 発光素子搭載用基板および発光装置
JP2021015849A (ja) * 2019-07-10 2021-02-12 住友電気工業株式会社 光モジュール、ステム部品
JP7469985B2 (ja) 2020-08-05 2024-04-17 シャープ福山レーザー株式会社 発光装置および発光装置セット
WO2023228851A1 (ja) * 2022-05-25 2023-11-30 ローム株式会社 半導体発光素子用保護ケース及びその製造方法並びに半導体発光装置

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JPS6063981A (ja) * 1984-07-27 1985-04-12 Hitachi Ltd 半導体発光装置
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JP2001332799A (ja) * 2000-05-19 2001-11-30 Rohm Co Ltd モールド型半導体レーザ
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Also Published As

Publication number Publication date
RU2018140496A (ru) 2020-05-19
WO2017183638A1 (ja) 2017-10-26
EP3447864A4 (en) 2020-03-11
CN109075526B (zh) 2022-05-31
EP3447864A1 (en) 2019-02-27
KR20180136448A (ko) 2018-12-24
JP2018088556A (ja) 2018-06-07
TW201840081A (zh) 2018-11-01
EP3447864B1 (en) 2024-05-01
TWI652867B (zh) 2019-03-01
US20190131765A1 (en) 2019-05-02
JPWO2017183638A1 (ja) 2018-04-26
CN109075526A (zh) 2018-12-21
KR102281484B1 (ko) 2021-07-26
US10862264B2 (en) 2020-12-08
JP6298225B1 (ja) 2018-03-20
JP6584549B2 (ja) 2019-10-02
BR112018071345A2 (pt) 2019-02-05

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