SG11201810376PA - Production method for fabry-perot interference filter - Google Patents

Production method for fabry-perot interference filter

Info

Publication number
SG11201810376PA
SG11201810376PA SG11201810376PA SG11201810376PA SG11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA SG 11201810376P A SG11201810376P A SG 11201810376PA
Authority
SG
Singapore
Prior art keywords
fabry
production method
expected
interference filter
mirror
Prior art date
Application number
SG11201810376PA
Other languages
English (en)
Inventor
Takashi Kasahara
Katsumi Shibayama
Masaki Hirose
Toshimitsu Kawai
Hiroki Oyama
Yumi Kuramoto
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of SG11201810376PA publication Critical patent/SG11201810376PA/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12Generating the spectrum; Monochromators
    • G01J3/26Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/28Interference filters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Optical Filters (AREA)
  • Micromachines (AREA)
SG11201810376PA 2016-05-27 2017-05-26 Production method for fabry-perot interference filter SG11201810376PA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016106269 2016-05-27
JP2016163942 2016-08-24
JP2016163916 2016-08-24
PCT/JP2017/019680 WO2017204326A1 (ja) 2016-05-27 2017-05-26 ファブリペロー干渉フィルタの製造方法

Publications (1)

Publication Number Publication Date
SG11201810376PA true SG11201810376PA (en) 2018-12-28

Family

ID=60412818

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810376PA SG11201810376PA (en) 2016-05-27 2017-05-26 Production method for fabry-perot interference filter

Country Status (11)

Country Link
US (1) US11041755B2 (ja)
EP (1) EP3467567B1 (ja)
JP (1) JP7018873B2 (ja)
KR (1) KR102432363B1 (ja)
CN (1) CN109196405B (ja)
ES (1) ES2972587T3 (ja)
FI (1) FI3467567T3 (ja)
PH (1) PH12018502444A1 (ja)
SG (1) SG11201810376PA (ja)
TW (1) TWI717519B (ja)
WO (1) WO2017204326A1 (ja)

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FI3505987T3 (fi) 2016-08-24 2023-12-19 Hamamatsu Photonics Kk Fabry-perot-häiriösuodatin
JP6517309B1 (ja) 2017-11-24 2019-05-22 浜松ホトニクス株式会社 異物除去方法、及び光検出装置の製造方法
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US20220037145A1 (en) * 2020-07-31 2022-02-03 Psiquantum, Corp. Silicon nitride films having reduced interfacial strain

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Also Published As

Publication number Publication date
EP3467567A4 (en) 2020-03-11
PH12018502444A1 (en) 2019-09-09
CN109196405A (zh) 2019-01-11
FI3467567T3 (fi) 2024-04-22
JPWO2017204326A1 (ja) 2019-03-22
TWI717519B (zh) 2021-02-01
KR102432363B1 (ko) 2022-08-16
US11041755B2 (en) 2021-06-22
JP7018873B2 (ja) 2022-02-14
CN109196405B (zh) 2021-09-10
TW201805229A (zh) 2018-02-16
US20200141801A1 (en) 2020-05-07
KR20190011768A (ko) 2019-02-07
ES2972587T3 (es) 2024-06-13
EP3467567B1 (en) 2024-02-07
WO2017204326A1 (ja) 2017-11-30
EP3467567A1 (en) 2019-04-10

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