JP5653110B2 - チップの製造方法 - Google Patents
チップの製造方法 Download PDFInfo
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- JP5653110B2 JP5653110B2 JP2010167440A JP2010167440A JP5653110B2 JP 5653110 B2 JP5653110 B2 JP 5653110B2 JP 2010167440 A JP2010167440 A JP 2010167440A JP 2010167440 A JP2010167440 A JP 2010167440A JP 5653110 B2 JP5653110 B2 JP 5653110B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 238000005530 etching Methods 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Chemical compound [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 3
- 230000006355 external stress Effects 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ONRPGGOGHKMHDT-UHFFFAOYSA-N benzene-1,2-diol;ethane-1,2-diamine Chemical compound NCCN.OC1=CC=CC=C1O ONRPGGOGHKMHDT-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- GSWAOPJLTADLTN-UHFFFAOYSA-N oxidanimine Chemical compound [O-][NH3+] GSWAOPJLTADLTN-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
Description
次に、本発明の第1実施形態に係るチップの製造方法ついて説明する。図7〜9は、本実施形態を説明するためのフロー図である。図7〜9に示すように、本実施形態では、加工対象物1の内部にレーザ光Lを集光させて改質領域7を形成し、加工対象物1の表面(一主面)3上に機能素子15及び保護膜16を形成した後、改質領域7に沿ってエッチングを選択的に進展させて加工対象物1の一部を基板11として切り抜き、所望厚さのチップ10を複数形成する。
次に、本発明の第2実施形態について説明する。なお、本実施形態の説明においては、上記第1実施形態と異なる点について主に説明する。
次に、本発明の第3実施形態について説明する。なお、本実施形態の説明においては、上記第1実施形態と異なる点について主に説明する。
次に、本発明の第4実施形態について説明する。なお、本実施形態の説明においては、上記第1実施形態と異なる点について主に説明する。
Claims (6)
- 基板上に機能素子が形成されて成るチップを製造するための製造方法であって、
シリコンで形成された板状の加工対象物の一主面に前記機能素子を形成する機能素子形成工程と、
前記加工対象物にレーザ光を集光させることにより、前記加工対象物における前記一主面から前記基板の厚さに対応する所定深さの位置に、第1改質領域を前記一主面に沿って形成する第1改質領域形成工程と、
前記加工対象物にレーザ光を集光させることにより、前記加工対象物における前記一主面側に、前記一主面から見て前記基板の側縁に対応して延在する第2改質領域を、前記加工対象物の厚さ方向に沿って前記第1改質領域に繋がるように形成する第2改質領域形成
工程と、
前記機能素子形成工程、前記第1及び第2改質領域形成工程の後、前記第1及び第2改質領域に沿ってエッチングを選択的に進展させることにより、前記加工対象物の一部を切り取って前記基板を形成するエッチング工程と、を含み、
前記第1及び第2改質領域形成工程では、前記一主面の反対側の他主面から前記加工対象物にレーザ光を入射して集光させることを特徴とするチップの製造方法。 - 前記エッチング工程では、前記加工対象物における前記一主面側の一部を前記基板として切り取ることを特徴とする請求項1記載のチップの製造方法。
- 前記第1及び第2改質領域形成工程は、前記機能素子形成工程の後に実施されることを特徴とする請求項1又は2記載のチップの製造方法。
- 前記機能素子形成工程は、前記第1及び第2改質領域形成工程の後に実施されることを特徴とする請求項1又は2記載のチップの製造方法。
- 前記機能素子形成工程は、前記第1改質領域形成工程の後に実施され、
前記第2改質領域形成工程は、前記機能素子形成工程の後に実施されることを特徴とする請求項1又は2記載のチップの製造方法。 - 前記エッチング工程では、前記加工対象物における前記一主面と反対側の他主面側を前記第1改質領域に沿って切り取って前記加工対象物を薄化すると共に、薄化された前記加工対象物を前記第2改質領域に沿って切断し、前記基板を形成することを特徴とする請求項1記載のチップの製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010167440A JP5653110B2 (ja) | 2010-07-26 | 2010-07-26 | チップの製造方法 |
KR1020127031686A KR101914146B1 (ko) | 2010-07-26 | 2011-07-19 | 칩의 제조 방법 |
CN201180036373.9A CN103026468B (zh) | 2010-07-26 | 2011-07-19 | 芯片的制造方法 |
PCT/JP2011/066344 WO2012014716A1 (ja) | 2010-07-26 | 2011-07-19 | チップの製造方法 |
EP11812308.2A EP2600390B1 (en) | 2010-07-26 | 2011-07-19 | Chip manufacturing method |
US13/389,053 US8802544B2 (en) | 2010-07-26 | 2011-07-19 | Method for manufacturing chip including a functional device formed on a substrate |
TW100126371A TWI527101B (zh) | 2010-07-26 | 2011-07-26 | The manufacturing method of the wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2010167440A JP5653110B2 (ja) | 2010-07-26 | 2010-07-26 | チップの製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012028646A JP2012028646A (ja) | 2012-02-09 |
JP5653110B2 true JP5653110B2 (ja) | 2015-01-14 |
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JP2010167440A Active JP5653110B2 (ja) | 2010-07-26 | 2010-07-26 | チップの製造方法 |
Country Status (7)
Country | Link |
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US (1) | US8802544B2 (ja) |
EP (1) | EP2600390B1 (ja) |
JP (1) | JP5653110B2 (ja) |
KR (1) | KR101914146B1 (ja) |
CN (1) | CN103026468B (ja) |
TW (1) | TWI527101B (ja) |
WO (1) | WO2012014716A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120299219A1 (en) * | 2011-05-27 | 2012-11-29 | Hamamatsu Photonics K.K. | Laser processing method |
US20130344684A1 (en) * | 2012-06-20 | 2013-12-26 | Stuart Bowden | Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material |
US9404198B2 (en) * | 2012-07-30 | 2016-08-02 | Rayton Solar Inc. | Processes and apparatuses for manufacturing wafers |
US9499921B2 (en) | 2012-07-30 | 2016-11-22 | Rayton Solar Inc. | Float zone silicon wafer manufacturing system and related process |
US8809166B2 (en) * | 2012-12-20 | 2014-08-19 | Nxp B.V. | High die strength semiconductor wafer processing method and system |
ITAN20130231A1 (it) * | 2013-12-05 | 2015-06-06 | Munoz David Callejo | Procedimento per ottenere una pluralita' di lamine da un lingotto di materiale con struttura monocristallina |
US20150158117A1 (en) * | 2013-12-05 | 2015-06-11 | David Callejo Muñoz | System and method for obtaining laminae made of a material having known optical transparency characteristics |
JP2017071074A (ja) * | 2015-10-05 | 2017-04-13 | 国立大学法人埼玉大学 | 内部加工層形成単結晶基板の製造方法、および、単結晶基板の製造方法 |
JP6341959B2 (ja) | 2016-05-27 | 2018-06-13 | 浜松ホトニクス株式会社 | ファブリペロー干渉フィルタの製造方法 |
TWI717519B (zh) | 2016-05-27 | 2021-02-01 | 日商濱松赫德尼古斯股份有限公司 | 法布立-培若干涉濾光器之製造方法 |
WO2018204206A2 (en) | 2017-05-01 | 2018-11-08 | Icu Medical, Inc. | Medical fluid connectors and methods for providing additives in medical fluid lines |
US11517732B2 (en) | 2018-11-07 | 2022-12-06 | Icu Medical, Inc. | Syringe with antimicrobial properties |
CN116213967A (zh) * | 2018-12-21 | 2023-06-06 | 东京毅力科创株式会社 | 周缘去除装置和周缘去除方法 |
JP7203863B2 (ja) * | 2018-12-21 | 2023-01-13 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
DE102019201438A1 (de) * | 2019-02-05 | 2020-08-06 | Disco Corporation | Verfahren zum Herstellen eines Substrats und System zum Herstellen eines Substrats |
JP7230650B2 (ja) | 2019-04-05 | 2023-03-01 | Tdk株式会社 | 無機材料基板の加工方法、デバイス、およびデバイスの製造方法 |
JP7129558B2 (ja) * | 2019-04-19 | 2022-09-01 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
JP7405365B2 (ja) * | 2020-01-31 | 2023-12-26 | 国立大学法人東海国立大学機構 | レーザ加工方法、半導体部材製造方法、及び、レーザ加工装置 |
JP7427189B2 (ja) * | 2020-01-31 | 2024-02-05 | 国立大学法人東海国立大学機構 | レーザ加工方法、半導体部材製造方法、及び、レーザ加工装置 |
DE102020108247A1 (de) | 2020-03-25 | 2021-09-30 | Trumpf Laser- Und Systemtechnik Gmbh | Grossvolumiges entfernen von material durch laser-unterstütztes ätzen |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04150212A (ja) | 1990-10-09 | 1992-05-22 | Seiko Epson Corp | 水晶基板のエッチング加工方法 |
JP2873937B2 (ja) | 1996-05-24 | 1999-03-24 | 工業技術院長 | ガラスの光微細加工方法 |
JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
JP4880820B2 (ja) | 2001-01-19 | 2012-02-22 | 株式会社レーザーシステム | レーザ支援加工方法 |
EP2400539B1 (en) | 2002-03-12 | 2017-07-26 | Hamamatsu Photonics K.K. | Substrate dividing method |
CA2428187C (en) | 2002-05-08 | 2012-10-02 | National Research Council Of Canada | Method of fabricating sub-micron structures in transparent dielectric materials |
JP4150212B2 (ja) | 2002-05-17 | 2008-09-17 | パナソニック コミュニケーションズ株式会社 | 印刷システム |
JP4329374B2 (ja) | 2002-07-29 | 2009-09-09 | パナソニック電工株式会社 | 発光素子およびその製造方法 |
JP4158481B2 (ja) | 2002-10-21 | 2008-10-01 | セイコーエプソン株式会社 | レーザー加工方法およびその装置、並びにその装置を用いた穴あけ加工方法 |
JP2004160618A (ja) | 2002-11-15 | 2004-06-10 | Seiko Epson Corp | マイクロマシン及びマイクロマシンの製造方法 |
JP4334864B2 (ja) | 2002-12-27 | 2009-09-30 | 日本電波工業株式会社 | 薄板水晶ウェハ及び水晶振動子の製造方法 |
JP2004223586A (ja) | 2003-01-24 | 2004-08-12 | Institute Of Physical & Chemical Research | 透明材料内部の処理方法 |
JP2004259846A (ja) * | 2003-02-25 | 2004-09-16 | Ogura Jewel Ind Co Ltd | 基板上形成素子の分離方法 |
JP2004304130A (ja) | 2003-04-01 | 2004-10-28 | Seiko Epson Corp | 半導体装置の製造方法 |
JP2004343008A (ja) | 2003-05-19 | 2004-12-02 | Disco Abrasive Syst Ltd | レーザ光線を利用した被加工物分割方法 |
JP2004351494A (ja) | 2003-05-30 | 2004-12-16 | Seiko Epson Corp | レーザーに対して透明な材料の穴あけ加工方法 |
JP2004359475A (ja) | 2003-06-02 | 2004-12-24 | Seiko Epson Corp | 光学素子の製造方法及び光学装置 |
JP4182841B2 (ja) * | 2003-08-28 | 2008-11-19 | セイコーエプソン株式会社 | 単結晶基板の加工方法 |
JP2005086175A (ja) | 2003-09-11 | 2005-03-31 | Hamamatsu Photonics Kk | 半導体薄膜の製造方法、半導体薄膜、半導体薄膜チップ、電子管、及び光検出素子 |
JP2005121916A (ja) | 2003-10-16 | 2005-05-12 | Seiko Epson Corp | レンチキュラレンズ用凹部付き基板の製造方法、レンチキュラレンズ用凹部付き基板、レンチキュラレンズ基板、透過型スクリーンおよびリア型プロジェクタ |
JP2005121915A (ja) | 2003-10-16 | 2005-05-12 | Seiko Epson Corp | マイクロレンズ用凹部付き基板の製造方法、マイクロレンズ用凹部付き基板、マイクロレンズ基板、液晶パネル用対向基板、液晶パネルおよび投射型表示装置 |
JP2005144586A (ja) | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | 構造体の製造方法、液滴吐出ヘッド、液滴吐出装置 |
JP2005144622A (ja) | 2003-11-18 | 2005-06-09 | Seiko Epson Corp | 構造体の製造方法、液滴吐出ヘッド、液滴吐出装置 |
JP2005152693A (ja) | 2003-11-20 | 2005-06-16 | Seiko Epson Corp | 構造体の製造方法、液滴吐出ヘッド、液滴吐出装置 |
JP2005208175A (ja) | 2004-01-20 | 2005-08-04 | Seiko Epson Corp | 光部品及びその製造方法、光モジュール、光通信装置、電子機器 |
JP2005206401A (ja) | 2004-01-21 | 2005-08-04 | Seiko Epson Corp | 構造体の製造方法、液滴吐出ヘッド及び液滴吐出装置 |
US7202141B2 (en) * | 2004-03-29 | 2007-04-10 | J.P. Sercel Associates, Inc. | Method of separating layers of material |
JP2005294325A (ja) | 2004-03-31 | 2005-10-20 | Sharp Corp | 基板製造方法及び基板製造装置 |
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JP4694795B2 (ja) * | 2004-05-18 | 2011-06-08 | 株式会社ディスコ | ウエーハの分割方法 |
JP2005351774A (ja) | 2004-06-10 | 2005-12-22 | Seiko Epson Corp | マイクロアレイ作製用ヘッドの製造方法、マイクロアレイ作製用ヘッドおよびマイクロアレイ作製用装置 |
JP4634089B2 (ja) | 2004-07-30 | 2011-02-16 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP4630971B2 (ja) | 2004-12-21 | 2011-02-09 | 並木精密宝石株式会社 | パルスレーザによる微小構造の形成方法 |
JP2006290630A (ja) | 2005-02-23 | 2006-10-26 | Nippon Sheet Glass Co Ltd | レーザを用いたガラスの加工方法 |
JP2007036758A (ja) | 2005-07-27 | 2007-02-08 | Seiko Epson Corp | Atカット水晶振動片、その製造方法、及び水晶デバイス |
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US7838331B2 (en) * | 2005-11-16 | 2010-11-23 | Denso Corporation | Method for dicing semiconductor substrate |
JP2007165850A (ja) * | 2005-11-16 | 2007-06-28 | Denso Corp | ウェハおよびウェハの分断方法 |
US8603351B2 (en) * | 2007-05-25 | 2013-12-10 | Hamamatsu Photonics K.K. | Working method for cutting |
JP4612024B2 (ja) * | 2007-07-27 | 2011-01-12 | 株式会社アマチ | 回転表示装置 |
JP5225639B2 (ja) * | 2007-09-06 | 2013-07-03 | 浜松ホトニクス株式会社 | 半導体レーザ素子の製造方法 |
JP5198887B2 (ja) * | 2008-01-24 | 2013-05-15 | 株式会社ディスコ | 積層型半導体装置の製造方法 |
JP2010021398A (ja) | 2008-07-11 | 2010-01-28 | Disco Abrasive Syst Ltd | ウェーハの処理方法 |
JP2010153590A (ja) * | 2008-12-25 | 2010-07-08 | Hamamatsu Photonics Kk | 切断用加工方法 |
JP5614738B2 (ja) * | 2010-01-26 | 2014-10-29 | 国立大学法人埼玉大学 | 基板加工方法 |
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US8802544B2 (en) | 2014-08-12 |
EP2600390A1 (en) | 2013-06-05 |
TW201220378A (en) | 2012-05-16 |
TWI527101B (zh) | 2016-03-21 |
KR101914146B1 (ko) | 2018-11-02 |
WO2012014716A1 (ja) | 2012-02-02 |
CN103026468B (zh) | 2015-11-25 |
KR20130088746A (ko) | 2013-08-08 |
EP2600390B1 (en) | 2019-08-21 |
EP2600390A4 (en) | 2016-05-18 |
US20120135585A1 (en) | 2012-05-31 |
CN103026468A (zh) | 2013-04-03 |
JP2012028646A (ja) | 2012-02-09 |
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