SG11201802991UA - Component handling system - Google Patents

Component handling system

Info

Publication number
SG11201802991UA
SG11201802991UA SG11201802991UA SG11201802991UA SG11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA SG 11201802991U A SG11201802991U A SG 11201802991UA
Authority
SG
Singapore
Prior art keywords
handling system
component handling
component
handling
Prior art date
Application number
SG11201802991UA
Other languages
English (en)
Inventor
Henri Junker
Markus Ferstl
Original Assignee
Muehlbauer Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer Gmbh & Co Kg filed Critical Muehlbauer Gmbh & Co Kg
Publication of SG11201802991UA publication Critical patent/SG11201802991UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H01L2224/75651—Belt conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H01L2224/75823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Specific Conveyance Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Sorting Of Articles (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
SG11201802991UA 2015-10-16 2016-09-22 Component handling system SG11201802991UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015013494.9A DE102015013494B3 (de) 2015-10-16 2015-10-16 Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung
PCT/EP2016/072481 WO2017063837A1 (de) 2015-10-16 2016-09-22 Bauteilhandhabungsvorrichtung

Publications (1)

Publication Number Publication Date
SG11201802991UA true SG11201802991UA (en) 2018-05-30

Family

ID=57047184

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201802991UA SG11201802991UA (en) 2015-10-16 2016-09-22 Component handling system

Country Status (11)

Country Link
US (2) US10804123B2 (ja)
EP (2) EP3363043B1 (ja)
JP (2) JP6557413B2 (ja)
KR (2) KR102109877B1 (ja)
CN (2) CN110459489B (ja)
DE (1) DE102015013494B3 (ja)
MY (1) MY194251A (ja)
PH (1) PH12018500797A1 (ja)
SG (1) SG11201802991UA (ja)
TW (1) TWI698946B (ja)
WO (1) WO2017063837A1 (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015013494B3 (de) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung
EP3610500B1 (de) * 2017-04-11 2021-03-31 Mühlbauer GmbH & Co. KG. Bauteil-empfangseinrichtung mit optischem sensor
DE102017008869B3 (de) * 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg Bauteilzentrierung
BR112020019442A2 (pt) * 2018-03-28 2021-01-05 Transitions Optical, Ltd. Estação de diagnóstico para linha de produção
CN108226186A (zh) * 2018-03-31 2018-06-29 苏州梅克兰检测服务有限公司 一种液晶显示屏抗磨性检测装置
MY192110A (en) * 2018-07-26 2022-07-28 Mi Equipment M Sdn Bhd Method for automatic alignment of an electronic component during die sorting process
DE102018006760A1 (de) * 2018-08-27 2020-02-27 Mühlbauer Gmbh & Co. Kg Inspektion beim Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
CN109592368B (zh) * 2018-12-26 2024-02-27 星光印刷（苏州）有限公司 粘粉机
CN110033704B (zh) * 2019-04-19 2022-07-19 京东方科技集团股份有限公司 转印装置和转印方法
DE102019125127A1 (de) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
CN110683100A (zh) * 2019-11-07 2020-01-14 苏州领裕电子科技有限公司 一种新型平行送料载带包装机
EP4075154A4 (en) * 2019-12-13 2024-01-10 Shandong Caiju Electronic Technology Co., Ltd CHIP DETECTION DEVICE AND SYSTEM, AND CONTROL METHOD
JP7289144B2 (ja) * 2019-12-25 2023-06-09 Ｋｎｅ株式会社 部品移載装置
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
CN111613565B (zh) * 2020-05-18 2023-03-31 武汉国创科光电装备有限公司 一种适用于柔性电子制造的双翻转头芯片转移装置
US20220059406A1 (en) * 2020-08-21 2022-02-24 Advanced Semiconductor Engineering, Inc. Method for manufacturing semiconductor package
CN112351672A (zh) * 2020-10-29 2021-02-09 顺德职业技术学院 一种电气元件的滚轮式插接装置
CN113137917B (zh) * 2021-04-13 2023-01-13 重庆市和鑫达电子有限公司 Pcb板孔位检测装置
DE102021111953A1 (de) * 2021-05-07 2022-11-10 Mühlbauer Gmbh & Co. Kg Optische Bauteilinspektion
CN113307012A (zh) * 2021-05-28 2021-08-27 湖州天吉新能源有限公司 一种新能源汽车电池的运输装置
CN114013715A (zh) * 2021-11-05 2022-02-08 苏州领裕电子科技有限公司 一种上料检测包装生产线
JP2024016319A (ja) * 2022-07-26 2024-02-07 ファスフォードテクノロジ株式会社 実装装置および半導体装置の製造方法

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE160089C (ja)
DD160089A1 (de) 1981-06-30 1983-04-27 Klaus Osterland Verfahren zum abloesen einzelner halbleiterchips von halbleitertraegern
CA1217572A (en) * 1983-05-02 1987-02-03 Kenichi Saito Mounting apparatus for chip type electronic parts
US4626167A (en) * 1984-03-22 1986-12-02 Thomson Components-Mostek Corporation Manipulation and handling of integrated circuit dice
JPS6226833A (ja) * 1985-07-26 1987-02-04 Mitsubishi Electric Corp ダイボンデング装置
JPH01193630A (ja) * 1988-01-28 1989-08-03 Nikka Densoku Kk 粒状物搬送および検査装置
JPH02193813A (ja) * 1989-01-20 1990-07-31 Murata Mfg Co Ltd 電子部品の整列・反転方法
JPH04291795A (ja) 1991-03-20 1992-10-15 Matsushita Electric Ind Co Ltd 電子部品装着装置
US5547537A (en) 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
JPH06275991A (ja) * 1993-03-23 1994-09-30 Japan Tobacco Inc ワーク実装機
JPH0864998A (ja) * 1994-08-18 1996-03-08 Japan Tobacco Inc ワーク実装機
JP3105752B2 (ja) * 1994-11-29 2000-11-06 シオノギクオリカプス株式会社 偏平物品の側面検査装置、偏平物品の搬送装置及びそれらを用いた偏平物品の外観検査装置
JPH08227904A (ja) * 1995-10-30 1996-09-03 Rohm Co Ltd チップボンディング装置
JP3193292B2 (ja) * 1996-05-29 2001-07-30 株式会社 東京ウエルズ 電子部品検査装置および電子部品受け渡し装置
JPH1070395A (ja) 1996-08-27 1998-03-10 Matsushita Electric Ind Co Ltd 部品装着装置
DE69832337T2 (de) 1997-07-28 2006-08-03 Matsushita Electric Industrial Co., Ltd., Kadoma Bauteilzuführer und Vorrichtung zur Bestückung
JP3758004B2 (ja) * 1997-08-06 2006-03-22 シオノギクオリカプス株式会社 錠剤の外観検査装置
EP0906011A3 (de) * 1997-09-24 2000-05-24 Siemens Aktiengesellschaft Vorrichtung zum Bestücken von flachen Bauelementeträgern mit elektrischen Bauelementen
JP3446598B2 (ja) * 1998-03-23 2003-09-16 株式会社村田製作所 チップ部品の移載装置
JP4007526B2 (ja) * 1998-04-06 2007-11-14 日東工業株式会社 チップの６面検査装置
JP3504166B2 (ja) 1998-11-25 2004-03-08 株式会社新川 フリップチップボンディング装置
JP3846532B2 (ja) * 1999-09-01 2006-11-15 クオリカプス株式会社 錠剤の側面検査装置及び該側面検査装置を用いた錠剤の外観検査装置
US6364089B1 (en) * 1999-12-10 2002-04-02 National Semiconductor Corporation Multi-station rotary die handling device
JP3398109B2 (ja) * 2000-01-27 2003-04-21 三洋電機株式会社 電子部品装着装置
KR100353905B1 (ko) * 2000-12-29 2002-09-28 주식회사옌트 표면 실장용 칩 검사 장치에 사용되는 조명 시스템
JP2002276254A (ja) 2001-03-15 2002-09-25 Ykk Architectural Products Inc 折戸の逆折れ阻止機構および折戸
DE10128111A1 (de) 2001-06-11 2003-02-20 Bosch Gmbh Robert Vorrichtung zur Montage von Bauelementen auf einem Substrat
KR100414518B1 (ko) 2001-12-28 2004-01-07 (주) 인텍플러스 칩 마운팅 방법 및 장치
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
DE10203601A1 (de) * 2002-01-30 2003-08-14 Siemens Ag Chipentnahmevorrichtung, Chipentnahmesystem, Bestücksystem und Verfahren zum Entnehmen von Chips von einem Wafer
JP3879679B2 (ja) * 2003-02-25 2007-02-14 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
TW200419640A (en) 2003-02-25 2004-10-01 Matsushita Electric Ind Co Ltd Electronic component placement machine and electronic component placement method
JP4241439B2 (ja) * 2003-06-18 2009-03-18 株式会社村田製作所 チップ型電子部品の取扱い装置
JP4503969B2 (ja) * 2003-09-30 2010-07-14 株式会社日立ハイテクインスツルメンツ 移載装置
JP2005251978A (ja) * 2004-03-04 2005-09-15 Matsushita Electric Ind Co Ltd 電子部品装着装置および電子部品の装着方法
DE102004051301A1 (de) * 2004-10-20 2006-06-01 Ief Werner Gmbh Vorrichtung zur optischen Prüfung von Bauteilen
US7569932B2 (en) * 2005-11-18 2009-08-04 Checkpoint Systems, Inc. Rotary chip attach
EP1802192A1 (de) 2005-12-22 2007-06-27 Unaxis International Trading Ltd Verfahren für die Montage eines Flipchips auf einem Substrat
JP2009154889A (ja) * 2007-12-25 2009-07-16 Canon Machinery Inc 部品供給装置及びテーピング装置
DE102008018586A1 (de) * 2008-04-12 2009-11-05 Mühlbauer Ag Optische Erfassungsvorrichtung und Verfahren für die Erfassung von Oberflächen von Bauteilen
JP5457085B2 (ja) * 2009-06-22 2014-04-02 株式会社ユニテック ワーク搬送分類装置及びワーク搬送分類方法
EP2315236B1 (de) * 2009-10-22 2014-05-14 VAT Holding AG Klappen-Transferventil
TWI402510B (zh) * 2010-04-07 2013-07-21 Inventec Corp 測試裝置
DE102010053912B4 (de) 2010-12-09 2013-01-31 Mühlbauer Ag Optische Untersuchungseinrichtung und optisches Untersuchungsverfahren
CN103489811A (zh) * 2012-06-11 2014-01-01 北京中电科电子装备有限公司 键合设备上的双路拾片翻转机构
JP2012186505A (ja) * 2012-06-18 2012-09-27 Murata Mfg Co Ltd 部品供給装置
TWI557437B (zh) * 2012-10-30 2016-11-11 財團法人工業技術研究院 立體攝像裝置、自動校正裝置與校正方法
WO2014087491A1 (ja) * 2012-12-04 2014-06-12 上野精機株式会社 移載装置
DE102013102046A1 (de) * 2013-03-01 2014-09-04 Asm Assembly Systems Gmbh & Co. Kg Vorrichtung und Verfahren zur Zuführung von Bauelementen zu einem Bestückautomaten sowie Bestückautomat
MY156689A (en) 2013-05-28 2016-03-15 Oh Kuang Eng Method and apparatus for electronic components inspection and replacement in carrier tape
TWI648811B (zh) * 2013-09-13 2019-01-21 豪銳恩科技私人有限公司 定位半導體晶片及接合頭之系統與方法、熱接合系統與方法
WO2015151276A1 (ja) 2014-04-04 2015-10-08 上野精機株式会社 収容ユニット及び電子部品搬送装置
DE102015013494B3 (de) * 2015-10-16 2017-04-06 Mühlbauer Gmbh & Co. Kg Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung
DE102015013495B4 (de) * 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser

Also Published As

Publication number Publication date
KR102046031B1 (ko) 2019-11-18
KR102109877B1 (ko) 2020-05-12
MY194251A (en) 2022-11-24
WO2017063837A1 (de) 2017-04-20
TWI698946B (zh) 2020-07-11
EP3363043A1 (de) 2018-08-22
US20180308727A1 (en) 2018-10-25
US11232961B2 (en) 2022-01-25
CN108292615B (zh) 2022-03-11
JP6880114B2 (ja) 2021-06-02
JP2019505453A (ja) 2019-02-28
DE102015013494B3 (de) 2017-04-06
CN110459489A (zh) 2019-11-15
EP3576138A1 (de) 2019-12-04
TW201724319A (zh) 2017-07-01
CN108292615A (zh) 2018-07-17
EP3363043B1 (de) 2020-01-01
CN110459489B (zh) 2023-04-11
JP2019194130A (ja) 2019-11-07
US20200035521A1 (en) 2020-01-30
US10804123B2 (en) 2020-10-13
PH12018500797A1 (en) 2018-10-29
KR20180071318A (ko) 2018-06-27
KR20190073613A (ko) 2019-06-26
JP6557413B2 (ja) 2019-08-07

Similar Documents

Publication Publication Date Title
SG11201802991UA (en) Component handling system
IL257409B (en) Transport system
SG11201802800UA (en) Robot system
GB201517101D0 (en) Mixed-reality system
GB201501510D0 (en) System
GB201507208D0 (en) Location system
SG11201802817XA (en) Robot system
IL251748A0 (en) Baggage handling system
PT3073021T (pt) Sistema de conexão
ZA201705600B (en) Track-module bogie-suspension system
GB201517276D0 (en) System
HK1208776A1 (en) An aquaponic system
SG11201803509XA (en) Magnetic-anchored robotic system
HK1255537A1 (zh) 機器人和機器人系統
IL259859B (en) transportation system
IL257898B (en) Exception handling
GB2558139B (en) Hoisting system
HK1211785A2 (en) Engagement system
LT3380427T (lt) Krovinių tvarkymo transporto priemonė
PT3379987T (pt) Sistema de fixação de recipiente
GB201601627D0 (en) Loading system
GB201514541D0 (en) System
GB2545291B (en) Robotic system
GB201720131D0 (en) Hoisting system
PL3260404T3 (pl) Urządzenie do przenoszenia ładunku