SG11201709206WA - Method for evaluating semiconductor wafer - Google Patents

Method for evaluating semiconductor wafer

Info

Publication number
SG11201709206WA
SG11201709206WA SG11201709206WA SG11201709206WA SG11201709206WA SG 11201709206W A SG11201709206W A SG 11201709206WA SG 11201709206W A SG11201709206W A SG 11201709206WA SG 11201709206W A SG11201709206W A SG 11201709206WA SG 11201709206W A SG11201709206W A SG 11201709206WA
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
evaluating semiconductor
evaluating
wafer
semiconductor
Prior art date
Application number
SG11201709206WA
Other languages
English (en)
Inventor
Masahiro Kato
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201709206WA publication Critical patent/SG11201709206WA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G01N2021/8864—Mapping zones of defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8874—Taking dimensions of defect into account
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8877—Proximity analysis, local statistics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG11201709206WA 2015-05-27 2016-03-09 Method for evaluating semiconductor wafer SG11201709206WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015107398A JP6256413B2 (ja) 2015-05-27 2015-05-27 半導体ウェーハの評価方法
PCT/JP2016/001274 WO2016189778A1 (ja) 2015-05-27 2016-03-09 半導体ウェーハの評価方法

Publications (1)

Publication Number Publication Date
SG11201709206WA true SG11201709206WA (en) 2017-12-28

Family

ID=57393222

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709206WA SG11201709206WA (en) 2015-05-27 2016-03-09 Method for evaluating semiconductor wafer

Country Status (8)

Country Link
US (1) US10054554B2 (ja)
EP (1) EP3306653B1 (ja)
JP (1) JP6256413B2 (ja)
KR (1) KR102115334B1 (ja)
CN (1) CN107615469B (ja)
SG (1) SG11201709206WA (ja)
TW (1) TWI674404B (ja)
WO (1) WO2016189778A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6536517B2 (ja) * 2016-09-07 2019-07-03 信越半導体株式会社 結晶欠陥評価方法
CN108303373B (zh) * 2018-02-01 2021-01-22 京东方科技集团股份有限公司 一种检测消影等级的装置及其控制方法
US10818005B2 (en) * 2018-03-12 2020-10-27 Kla-Tencor Corp. Previous layer nuisance reduction through oblique illumination
JP6675433B2 (ja) * 2018-04-25 2020-04-01 信越化学工業株式会社 欠陥分類方法、フォトマスクブランクの選別方法、およびマスクブランクの製造方法
JP6874737B2 (ja) * 2018-05-21 2021-05-19 三菱電機株式会社 ＳｉＣ基板の製造方法
JP7103211B2 (ja) 2018-12-27 2022-07-20 株式会社Sumco 半導体ウェーハの評価方法および製造方法ならびに半導体ウェーハの製造工程管理方法
JP7218710B2 (ja) * 2019-11-07 2023-02-07 株式会社Sumco レーザー表面検査装置の座標位置特定精度校正方法および半導体ウェーハの評価方法
JP7259736B2 (ja) * 2019-12-26 2023-04-18 株式会社Sumco 結晶欠陥の検出方法、エピタキシャル成長装置の管理方法およびエピタキシャルウェーハの製造方法
JP6918434B1 (ja) * 2021-03-30 2021-08-11 直江津電子工業株式会社 半導体ウエハの評価方法、半導体ウエハの評価システム、プログラム、半導体ウエハの検査方法および半導体ウエハの検査システム
JP2022178817A (ja) * 2021-05-21 2022-12-02 株式会社Sumco シリコン単結晶インゴットの評価方法、シリコンエピタキシャルウェーハの評価方法、シリコンエピタキシャルウェーハの製造方法およびシリコン鏡面ウェーハの評価方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
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IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US5399229A (en) * 1993-05-13 1995-03-21 Texas Instruments Incorporated System and method for monitoring and evaluating semiconductor wafer fabrication
DE10083372B4 (de) * 1999-10-14 2010-02-04 Sumitomo Mitsubishi Silicon Corp. Verfahren zum Untersuchen der Oberfläche von Halbleiterwafern
JP2001153635A (ja) * 1999-11-29 2001-06-08 Sumitomo Metal Ind Ltd 半導体ウェ−ハの品質評価方法
JP2001153815A (ja) * 1999-11-29 2001-06-08 Sumitomo Metal Ind Ltd 基板表面の評価方法
JP2001284423A (ja) * 2000-03-29 2001-10-12 Mitsubishi Electric Corp 半導体検査装置及び半導体装置の製造方法
US6515742B1 (en) * 2000-11-28 2003-02-04 Memc Electronic Materials, Inc. Defect classification using scattered light intensities
JP2002228596A (ja) * 2001-01-31 2002-08-14 Shin Etsu Handotai Co Ltd 半導体ウェーハの測定方法及び半導体ウェーハの製造方法
JP4230674B2 (ja) * 2001-03-01 2009-02-25 株式会社日立製作所 欠陥検査装置およびその方法
US6538730B2 (en) 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
WO2002082064A1 (en) * 2001-04-06 2002-10-17 Kla-Tencor Corporation Improved defect detection system
TWI257140B (en) * 2004-04-13 2006-06-21 Komatsu Denshi Kinzoku Kk Semiconductor wafer inspection device and method
JP4604734B2 (ja) * 2005-01-27 2011-01-05 株式会社Ｓｕｍｃｏ ウェーハの評価方法
JP5023900B2 (ja) * 2006-09-05 2012-09-12 株式会社Ｓｕｍｃｏ エピタキシャルシリコンウェーハ
JP5040315B2 (ja) * 2007-01-10 2012-10-03 富士通セミコンダクター株式会社 検査方法、検査システムおよび検査装置
JP5509581B2 (ja) * 2008-11-27 2014-06-04 信越半導体株式会社 半導体ウェーハの評価方法
KR101453033B1 (ko) * 2008-12-02 2014-10-23 주식회사 엘지실트론 에피택셜 웨이퍼의 에피 적층결함 검출방법
JP5521775B2 (ja) 2010-05-25 2014-06-18 株式会社Ｓｕｍｃｏ 単結晶シリコンウェーハの評価方法
JP6086050B2 (ja) * 2013-09-30 2017-03-01 信越半導体株式会社 ウエーハの評価方法

Also Published As

Publication number Publication date
JP6256413B2 (ja) 2018-01-10
EP3306653B1 (en) 2019-12-04
WO2016189778A1 (ja) 2016-12-01
US20180136143A1 (en) 2018-05-17
CN107615469A (zh) 2018-01-19
JP2016225347A (ja) 2016-12-28
TWI674404B (zh) 2019-10-11
TW201708811A (zh) 2017-03-01
EP3306653A1 (en) 2018-04-11
CN107615469B (zh) 2020-05-12
US10054554B2 (en) 2018-08-21
KR20180005674A (ko) 2018-01-16
KR102115334B1 (ko) 2020-05-26
EP3306653A4 (en) 2018-10-31

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