SG11201708368UA - Retaining ring having inner surfaces with features - Google Patents

Retaining ring having inner surfaces with features

Info

Publication number
SG11201708368UA
SG11201708368UA SG11201708368UA SG11201708368UA SG11201708368UA SG 11201708368U A SG11201708368U A SG 11201708368UA SG 11201708368U A SG11201708368U A SG 11201708368UA SG 11201708368U A SG11201708368U A SG 11201708368UA SG 11201708368U A SG11201708368U A SG 11201708368UA
Authority
SG
Singapore
Prior art keywords
features
retaining ring
inner surfaces
retaining
ring
Prior art date
Application number
SG11201708368UA
Other languages
English (en)
Inventor
Steven Mark Reedy
Simon Yavelberg
Jeonghoon Oh
Steven M Zuniga
Andrew J Nagengast
Samuel Chu-Chiang Hsu
Gautam Shashank Dandavate
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201708368UA publication Critical patent/SG11201708368UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Materials For Medical Uses (AREA)
SG11201708368UA 2015-05-29 2016-05-27 Retaining ring having inner surfaces with features SG11201708368UA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562168578P 2015-05-29 2015-05-29
US14/992,763 US10500695B2 (en) 2015-05-29 2016-01-11 Retaining ring having inner surfaces with features
PCT/US2016/034811 WO2016196360A1 (en) 2015-05-29 2016-05-27 Retaining ring having inner surfaces with features

Publications (1)

Publication Number Publication Date
SG11201708368UA true SG11201708368UA (en) 2017-12-28

Family

ID=57398011

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202108096RA SG10202108096RA (en) 2015-05-29 2016-05-27 Retaining ring having inner surfaces with features
SG11201708368UA SG11201708368UA (en) 2015-05-29 2016-05-27 Retaining ring having inner surfaces with features

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10202108096RA SG10202108096RA (en) 2015-05-29 2016-05-27 Retaining ring having inner surfaces with features

Country Status (8)

Country Link
US (4) US10500695B2 (zh)
EP (1) EP3302877B1 (zh)
JP (3) JP6891127B2 (zh)
KR (3) KR102461965B1 (zh)
CN (3) CN106181752B (zh)
SG (2) SG10202108096RA (zh)
TW (3) TWI768627B (zh)
WO (1) WO2016196360A1 (zh)

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US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
SG11201900152SA (en) * 2016-07-25 2019-02-27 Applied Materials Inc Retaining ring for cmp
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TWI634613B (zh) * 2017-12-27 2018-09-01 億力鑫系統科技股份有限公司 Carrier disk
CN110047796B (zh) * 2018-01-16 2021-10-01 亿力鑫系统科技股份有限公司 承载盘
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CN118163032A (zh) * 2019-09-30 2024-06-11 清华大学 一种化学机械抛光保持环和化学机械抛光承载头
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Also Published As

Publication number Publication date
SG10202108096RA (en) 2021-08-30
CN106181752B (zh) 2021-01-26
KR20240011233A (ko) 2024-01-25
TW202124096A (zh) 2021-07-01
EP3302877B1 (en) 2022-08-10
US20240316723A1 (en) 2024-09-26
WO2016196360A1 (en) 2016-12-08
CN106181752A (zh) 2016-12-07
KR20180004127A (ko) 2018-01-10
US20200114489A1 (en) 2020-04-16
JP6891127B2 (ja) 2021-06-18
US11453099B2 (en) 2022-09-27
JP2021185013A (ja) 2021-12-09
CN205799209U (zh) 2016-12-14
TWI768627B (zh) 2022-06-21
EP3302877A1 (en) 2018-04-11
CN112621560A (zh) 2021-04-09
US10500695B2 (en) 2019-12-10
JP2023075112A (ja) 2023-05-30
KR20220150435A (ko) 2022-11-10
JP7232285B2 (ja) 2023-03-02
CN112621560B (zh) 2022-12-13
KR102624126B1 (ko) 2024-01-12
TW201711802A (zh) 2017-04-01
KR102461965B1 (ko) 2022-11-02
EP3302877A4 (en) 2019-01-02
US20230019815A1 (en) 2023-01-19
US20160346897A1 (en) 2016-12-01
US12048981B2 (en) 2024-07-30
TWI717353B (zh) 2021-02-01
TWM547177U (zh) 2017-08-11
JP2018517574A (ja) 2018-07-05

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