SG10201601379WA - Retaining ring for lower wafer defects - Google Patents

Retaining ring for lower wafer defects

Info

Publication number
SG10201601379WA
SG10201601379WA SG10201601379WA SG10201601379WA SG10201601379WA SG 10201601379W A SG10201601379W A SG 10201601379WA SG 10201601379W A SG10201601379W A SG 10201601379WA SG 10201601379W A SG10201601379W A SG 10201601379WA SG 10201601379W A SG10201601379W A SG 10201601379WA
Authority
SG
Singapore
Prior art keywords
retaining ring
lower wafer
wafer defects
defects
retaining
Prior art date
Application number
SG10201601379WA
Inventor
Hu Yongqi
Yavelberg Simon
Sheelavant Gangadhar
R Narendrnath Kadthala
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201601379WA publication Critical patent/SG10201601379WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
SG10201601379WA 2015-03-19 2016-02-24 Retaining ring for lower wafer defects SG10201601379WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562135677P 2015-03-19 2015-03-19

Publications (1)

Publication Number Publication Date
SG10201601379WA true SG10201601379WA (en) 2016-10-28

Family

ID=56924291

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201601379WA SG10201601379WA (en) 2015-03-19 2016-02-24 Retaining ring for lower wafer defects

Country Status (6)

Country Link
US (1) US10399202B2 (en)
JP (1) JP6352326B2 (en)
KR (1) KR101841580B1 (en)
CN (2) CN105983901B (en)
SG (1) SG10201601379WA (en)
TW (2) TWI693985B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201601379WA (en) * 2015-03-19 2016-10-28 Applied Materials Inc Retaining ring for lower wafer defects
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
JP6360586B1 (en) * 2017-04-13 2018-07-18 三菱電線工業株式会社 Elastic film for wafer holding of CMP apparatus
CN109420969B (en) * 2017-08-29 2020-12-01 中芯国际集成电路制造(上海)有限公司 Grinding head and chemical mechanical grinding device
CN109693174A (en) * 2017-10-23 2019-04-30 中芯国际集成电路制造(上海)有限公司 A kind of grinding head and chemical mechanical polishing device
CN107953242A (en) * 2017-12-22 2018-04-24 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Color-buffing finish device and polishing system
KR20200070825A (en) * 2018-12-10 2020-06-18 삼성전자주식회사 chemical mechanical polishing apparatus for controlling polishing uniformity
US11344991B2 (en) * 2019-02-28 2022-05-31 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head
CN112548846B (en) * 2019-09-25 2022-10-28 夏泰鑫半导体(青岛)有限公司 Retaining ring for chemical mechanical polishing
CN110524412A (en) * 2019-09-30 2019-12-03 清华大学 A kind of Retaining Ring in Chemical Mechanical Polishing Process and chemically mechanical polishing carrier head
CN111482893A (en) * 2020-04-16 2020-08-04 华海清科股份有限公司 Chemical mechanical polishing retaining ring and chemical mechanical polishing bearing head
CN111318959B (en) * 2020-04-16 2024-02-06 清华大学 Retaining ring and carrier head for chemical mechanical polishing
CN111531464B (en) * 2020-05-08 2022-04-08 西安奕斯伟材料科技有限公司 Grinding head and grinding equipment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
DE10208414B4 (en) * 2002-02-27 2013-01-10 Advanced Micro Devices, Inc. Apparatus with an improved polishing pad conditioner for chemical mechanical polishing
DE602004027412D1 (en) * 2003-11-13 2010-07-08 Applied Materials Inc HOLDING WITH SHAPED SURFACE
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US7134948B2 (en) * 2005-01-15 2006-11-14 Applied Materials, Inc. Magnetically secured retaining ring
KR20070118277A (en) * 2005-04-12 2007-12-14 니혼 세이미츠 덴시 가부시키가이샤 Retainer ring for cmp device, method of manufacturing the same, and cmp device
JP2007158135A (en) * 2005-12-07 2007-06-21 Nippon Seimitsu Denshi Co Ltd Retainer ring for cmp equipment
JP2008006526A (en) * 2006-06-28 2008-01-17 Konica Minolta Opto Inc Polishing carrier
JP2009034745A (en) * 2007-07-31 2009-02-19 Nippon Seimitsu Denshi Co Ltd Retainer ring for cmp apparatus
SG10201601379WA (en) * 2015-03-19 2016-10-28 Applied Materials Inc Retaining ring for lower wafer defects

Also Published As

Publication number Publication date
TW201702001A (en) 2017-01-16
JP2016178304A (en) 2016-10-06
CN105983901B (en) 2021-01-29
TWI693985B (en) 2020-05-21
TWM533308U (en) 2016-12-01
KR20160113017A (en) 2016-09-28
CN105983901A (en) 2016-10-05
JP6352326B2 (en) 2018-07-04
CN205734411U (en) 2016-11-30
US10399202B2 (en) 2019-09-03
KR101841580B1 (en) 2018-03-23
US20160271750A1 (en) 2016-09-22

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