SG11201608293YA - Retaining ring having inner surfaces with facets - Google Patents
Retaining ring having inner surfaces with facetsInfo
- Publication number
- SG11201608293YA SG11201608293YA SG11201608293YA SG11201608293YA SG11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA
- Authority
- SG
- Singapore
- Prior art keywords
- facets
- retaining ring
- inner surfaces
- retaining
- ring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/259,089 US9368371B2 (en) | 2014-04-22 | 2014-04-22 | Retaining ring having inner surfaces with facets |
PCT/US2015/026004 WO2015164149A1 (en) | 2014-04-22 | 2015-04-15 | Retaining ring having inner surfaces with facets |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201608293YA true SG11201608293YA (en) | 2016-11-29 |
Family
ID=54322619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201608293YA SG11201608293YA (en) | 2014-04-22 | 2015-04-15 | Retaining ring having inner surfaces with facets |
Country Status (8)
Country | Link |
---|---|
US (4) | US9368371B2 (en) |
EP (1) | EP3134915B1 (en) |
JP (1) | JP6797690B2 (en) |
KR (1) | KR102416432B1 (en) |
CN (2) | CN106233431B (en) |
SG (1) | SG11201608293YA (en) |
TW (2) | TW201930012A (en) |
WO (1) | WO2015164149A1 (en) |
Families Citing this family (18)
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JP5821883B2 (en) * | 2013-03-22 | 2015-11-24 | 信越半導体株式会社 | Template assembly and method for manufacturing template assembly |
US9368371B2 (en) * | 2014-04-22 | 2016-06-14 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
US9530655B2 (en) * | 2014-09-08 | 2016-12-27 | Taiwan Semiconductor Manufacting Company, Ltd. | Slurry composition for chemical mechanical polishing of Ge-based materials and devices |
JP2016155188A (en) * | 2015-02-24 | 2016-09-01 | 株式会社荏原製作所 | Retainer ring, substrate holding device, polishing device, and maintenance method of retainer ring |
US10500695B2 (en) * | 2015-05-29 | 2019-12-10 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
CN108883515A (en) * | 2016-03-24 | 2018-11-23 | 应用材料公司 | The pulvinulus of veining for chemically mechanical polishing |
USD786419S1 (en) * | 2016-05-16 | 2017-05-09 | Kewaunee Scientific Corporation | Baffle for fume hoods |
WO2018022520A2 (en) * | 2016-07-25 | 2018-02-01 | Applied Materials, Inc. | Retaining ring for cmp |
JP6827663B2 (en) * | 2017-04-24 | 2021-02-10 | 株式会社荏原製作所 | Substrate polishing device |
US11400560B2 (en) | 2017-10-04 | 2022-08-02 | Applied Materials, Inc. | Retaining ring design |
CN109397070A (en) * | 2018-10-24 | 2019-03-01 | 中国科学院上海技术物理研究所 | The substrate of a kind of indium phosphide wafer and its epitaxial wafer piece polishes mold |
CN209615159U (en) * | 2018-11-28 | 2019-11-12 | 凯斯科技股份有限公司 | The snap ring of chemical-mechanical polishing device carrier head and the carrier head for having it |
KR20200070825A (en) | 2018-12-10 | 2020-06-18 | 삼성전자주식회사 | chemical mechanical polishing apparatus for controlling polishing uniformity |
JP2020163529A (en) * | 2019-03-29 | 2020-10-08 | 株式会社荏原製作所 | Polishing head for holding base board and base board processing device |
JP7466658B2 (en) | 2020-07-08 | 2024-04-12 | アプライド マテリアルズ インコーポレイテッド | Magnetically controlled retaining ring with multiple teeth |
US11623321B2 (en) * | 2020-10-14 | 2023-04-11 | Applied Materials, Inc. | Polishing head retaining ring tilting moment control |
US20230356354A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Compliant inner ring for a chemical mechanical polishing system |
CN117484381B (en) * | 2023-12-29 | 2024-04-16 | 江苏中科智芯集成科技有限公司 | Wafer grinding device and grinding process |
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US9227297B2 (en) | 2013-03-20 | 2016-01-05 | Applied Materials, Inc. | Retaining ring with attachable segments |
US9368371B2 (en) * | 2014-04-22 | 2016-06-14 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
TWM493229U (en) * | 2014-07-04 | 2015-01-01 | Donken It Consultants Ltd | Mobile system cabinet |
US10500695B2 (en) * | 2015-05-29 | 2019-12-10 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
US11400560B2 (en) * | 2017-10-04 | 2022-08-02 | Applied Materials, Inc. | Retaining ring design |
-
2014
- 2014-04-22 US US14/259,089 patent/US9368371B2/en active Active
-
2015
- 2015-04-15 CN CN201580021182.3A patent/CN106233431B/en active Active
- 2015-04-15 CN CN202010266127.3A patent/CN111451929B/en active Active
- 2015-04-15 WO PCT/US2015/026004 patent/WO2015164149A1/en active Application Filing
- 2015-04-15 EP EP15783681.8A patent/EP3134915B1/en active Active
- 2015-04-15 JP JP2016564001A patent/JP6797690B2/en active Active
- 2015-04-15 SG SG11201608293YA patent/SG11201608293YA/en unknown
- 2015-04-15 KR KR1020167032464A patent/KR102416432B1/en active IP Right Grant
- 2015-04-16 TW TW108112609A patent/TW201930012A/en unknown
- 2015-04-16 TW TW104112243A patent/TWI680829B/en active
-
2016
- 2016-02-08 US US15/018,443 patent/US11056350B2/en active Active
-
2021
- 2021-04-27 US US17/242,162 patent/US11682561B2/en active Active
-
2023
- 2023-05-17 US US18/198,337 patent/US20230290645A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR102416432B1 (en) | 2022-07-01 |
EP3134915A1 (en) | 2017-03-01 |
US20210249276A1 (en) | 2021-08-12 |
CN106233431A (en) | 2016-12-14 |
EP3134915B1 (en) | 2020-12-09 |
US9368371B2 (en) | 2016-06-14 |
TW201542319A (en) | 2015-11-16 |
CN111451929A (en) | 2020-07-28 |
TWI680829B (en) | 2020-01-01 |
US20160151879A1 (en) | 2016-06-02 |
JP6797690B2 (en) | 2020-12-09 |
TW201930012A (en) | 2019-08-01 |
JP2017514310A (en) | 2017-06-01 |
KR20160145786A (en) | 2016-12-20 |
WO2015164149A1 (en) | 2015-10-29 |
CN111451929B (en) | 2022-07-19 |
EP3134915A4 (en) | 2017-12-13 |
US11056350B2 (en) | 2021-07-06 |
CN106233431B (en) | 2020-05-01 |
US20230290645A1 (en) | 2023-09-14 |
US20150303070A1 (en) | 2015-10-22 |
US11682561B2 (en) | 2023-06-20 |
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