CN209615159U - The snap ring of chemical-mechanical polishing device carrier head and the carrier head for having it - Google Patents
The snap ring of chemical-mechanical polishing device carrier head and the carrier head for having it Download PDFInfo
- Publication number
- CN209615159U CN209615159U CN201822188431.1U CN201822188431U CN209615159U CN 209615159 U CN209615159 U CN 209615159U CN 201822188431 U CN201822188431 U CN 201822188431U CN 209615159 U CN209615159 U CN 209615159U
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- Prior art keywords
- snap ring
- carrier head
- main body
- diaphragm
- head according
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
The utility model relates to the snap ring of chemical-mechanical polishing device carrier head and the carrier heads for having it, comprising: carrier head ontology；Diaphragm is installed in below carrier head ontology；Snap ring, including snap ring main body and guide hump, the snap ring main body are separatedly configured at the lateral surface of diaphragm, and the guide hump protrudes to be formed in the inner face of snap ring main body.Carrier head ontology includes: body part, axis connection and is rotated with driving；Base portion connect and is rotated together with body part.Body part upper end is incorporated into drive shaft and carries out rotation driving.Diaphragm includes: bottom plate, and the next door of side, multiple annular states is incorporated into base portion between the center and side of bottom plate；Between diaphragm and base portion, it is formed with the multiple pressure chambers divided by next door.In multiple pressure chambers, the pressure sensor for measuring pressure respectively can be provided.The pressure of each pressure chamber can individually be adjusted according to the control of pressure control portion.
Description
Technical field
The utility model relates to the snap ring of chemical-mechanical polishing device carrier head and the carrier heads for having it, more specifically
For, it is related to a kind of chemical-mechanical polishing device carrying of lapping liquid and foreign matter that can be effectively removed and flow into snap ring inner face
The snap ring of head and the carrier head for having it.
Background technique
In semiconductor element manufacturing process, due to executing the chip of masking, etching and cabling processes etc. and generation repeatedly
The bumps on surface lead to that difference in height occurs between unit area and peripheral circuit area, eliminate the complete of this difference in height to realize
Face planarization improves because of circuit formation wafer surface roughness caused by contact/wiring UF membrane and highly integrated element etc.,
Precise finiss processing is carried out to wafer surface, chemical-mechanical polishing (CMP) device is exactly the device for being used for this.
In this CMP device, carrier head is before and after grinding process, with the abradant surface of chip and the opposite state of grinding pad
It pressurizes to the chip, allows to carry out grinding process, meanwhile, after grinding process, with direct or indirect vacuum suction and handle
The state for holding chip is transplanted on next process.
If carrier head 1 includes: body part 110 shown in referring to FIG. 1 and FIG. 2；Base portion 120, with body part 110 1
With rotation；Snap ring 130 can be installed additional up or down, be revolved together with base portion 120 to surround the annular state of base portion 120
Turn；The diaphragm 140 of elastic material, is fixed on base portion 120, space between base portion 120 formed pressure chamber C1,
C2,C3,C4,C5；Pressure control portion 150 is being supplied by air pressure service duct 155 to pressure chamber C1, C2, C3, C4, C5
Pressure is adjusted while answering or be discharged air.
The diaphragm 140 of elastic material is formed with side in the edge termination bending for the flat floor 141 pressurizeed to wafer W
142.The central portion end 140a of diaphragm 140 is fixed on base portion 120, forms the inlet hole 77 for being directly sucked in wafer W.In diaphragm
140 central portion can not also form inlet hole, and be created as the face pressurizeed to wafer W.The center from diaphragm 140 to
Between side 142, it is formed with the multiple next doors 143 for being fixed on the annular state of base portion 120, on the basis of next door 143, multiple pressures
Power chamber C1, C2, C3, C4, C5 is with concentric circles morphologic arrangement.
Therefore, in chemical-mechanical polishing process, by means of the air pressure accessed from pressure regulating part 150, pressure
Chamber C1, C2, C3, C4, C5 are pressurizeed while expansion by plate face of the film bottom plate 141 to wafer W.
At the same time, 130s is also to grinding pad below the snap ring 130 rotated together with body part 110 and base portion 120
11 pressurize and rotate, to prevent from being detached from by the circular wafer W of snap ring 130 to except carrier head 1.
On the other hand, snap ring 130 can install additional up or down relative to ontology 110 and pedestal 120, thus in order to ensure
Snap ring moves up and down relative to the diaphragm for being fixedly installed in ontology 100 and (keeps contactless state), between diaphragm and snap ring
Form gap.
But in the past in grinding process, the lapping liquid S that there is the abradant surface for being supplied to grinding pad 11 is flowed into diaphragm
The problem of being remained behind the gap formed between 140 and snap ring 130.
In particular, if the lapping liquid S for flowing into the gap L 1 of diaphragm 140 and snap ring 130 can not be removed rapidly, with stream
The lapping liquid for entering gap L 1 is fixed, there are problems that snap ring 130 is interfered smoothly to move up and down, exists and remain on grinding for gap L 1
Grinding fluid is re-attached to substrate or diaphragm, or the problem of work as the source S/C (S/C source).
Therefore, allow to remove to the 1 jet cleaning liquid of gap L formed between diaphragm 140 and snap ring 130 in the past
The lapping liquid S of gap L 1 is flowed into, but the cleaning solution 15 for being supplied to gap L 1 is unable to fully scatter and just flow directly out, thus there is hardly possible
The problem of to effectively remove the lapping liquid for remaining on diaphragm 140 and 130 gap of snap ring.
For this purpose, carrying out being intended to effectively remove the foreign matter for remaining on snap ring and diaphragm gap (lapping liquid and particle) recently
Multiplicity inquire into, it is but also far from enough, it is desirable that the exploitation to this.
Utility model content
The utility model aim is that the change for remaining on the foreign matter of snap ring and diaphragm gap can be effectively removed by providing one kind
It learns the snap ring of mechanical polishing device carrier head and has its carrier head.
In particular, the utility model aim is to allow the cleaning solution supplied between snap ring and the gap of diaphragm to fill
It scatter, so as to effectively remove the lapping liquid and foreign matter that flow into snap ring inner face.
In addition, the utility model aim is to make it possible to save money, process efficiency and yield are improved.
In addition, the utility model aim is to make it possible to improve stability and reliability, precision is improved.
In addition, the utility model aim is to make it possible to improve the processability of snap ring and assemblability, it is opposite to improve snap ring
In the flatness of grinding pad.
In addition, the utility model aim is the replacement process for making it possible to simplify snap ring, shorten what replacement process needed
Time.
In addition, the utility model aim is to make it possible to improve productivity and yield, manufacturing cost is saved.
According to the preferred embodiment in the utility model for being intended to reach above-mentioned the utility model aim, a kind of carrier head is provided,
It include: carrier head ontology；Diaphragm, is installed in below carrier head ontology, and substrate is stressed on grinding pad；Snap ring comprising
It is separatedly configured at the snap ring main body of the lateral surface of diaphragm and protrudes the guide hump to be formed in the inner face of snap ring main body, be incorporated into
Carrier head ontology constrains the side of substrate.
In conclusion according to the utility model, it can obtain to effectively remove and remain between snap ring and the gap of diaphragm
The advantageous effects of lapping liquid.
In particular, according to the utility model, so that sufficiently scatter to the cleaning solution that the inner face of snap ring main body is supplied, by means of
This, can obtain and improve cleaning solution to the advantageous effects of the cleaning efficiency in gap (gap between diaphragm and snap ring main body).
In addition, carrying out the non-cleaning area in the gap of snap ring and diaphragm (not based on cleaning solution according to the utility model
Cleaning region) generation realize minimize, the advantageous effects for further increasing cleaning efficiency can be obtained.
In addition, can save the time and expense that removal lapping liquid needs according to the utility model, raising work can be obtained
The advantageous effects of sequence efficiency and yield.
In addition, according to the utility model, the processability for improving snap ring and assemblability can be obtained, improve snap ring relative to grinding
Grind the advantageous effects of the flatness of pad.
In addition, the replacement process of simplified snap ring can be obtained according to the utility model, shorten the time that replacement process needs
Advantageous effects.
In addition, can obtain according to the utility model and improve productivity and yield, the advantageous effects for saving manufacturing cost.
Detailed description of the invention
Fig. 1 is the half-sectional view for illustrating previous carrier head,
Fig. 2 is the enlarged drawing of the part Fig. 1 " A ",
Fig. 3 is the figure for illustrating the carrier head of the utility model,
Fig. 4 is the enlarged drawing of the part Fig. 3 " B ",
Carrier head of the Fig. 5 to Fig. 7 as the utility model is the figure for illustrating the variation of guide hump,
Carrier head of the Fig. 8 and Fig. 9 as the utility model is the figure for illustrating through slot and connecting path,
Carrier head of the Figure 10 to Figure 12 as the utility model is flat part and non-flat forms portion for illustrating snap ring
Figure,
Carrier head of the Figure 13 as the utility model is the figure for illustrating binder bolt,
Figure 14 is the figure for illustrating the carrier head of another embodiment of the utility model.
Label declaration
100: carrier head 101: carrier head ontology
103: guide hump 110: body part
120: base portion 130: snap ring
131: 132: the first ring element of snap ring main body
134: the second ring elements 136: guiding groove
137a: through slot 137b: connecting path
138: guide hump 140: diaphragm
Specific embodiment
With reference to the accompanying drawings, the preferred embodiment of the utility model is described in detail, but the utility model is not by embodiment
It limits or limits.As reference, in the present note, identical label censures substantially the same element, under this rule,
The content recorded in different figures can be quoted to be illustrated, be judged as that practitioner is self-evident or duplicate content can save
Slightly.
Fig. 3 is the figure for illustrating the carrier head of the utility model, and Fig. 4 is the enlarged drawing of the part Fig. 3 " B ", Fig. 5 to figure
7 carrier head as the utility model is the figure for illustrating the variation of guide hump.In addition, Fig. 8 and Fig. 9 are as this reality
It is the figure for illustrating through slot and connecting path, carrying of the Figure 10 to Figure 12 as the utility model with novel carrier head
Head is the figure of the flat part and non-flat forms portion for illustrating snap ring, and carrier head of the Figure 13 as the utility model, is for illustrating
The figure of binder bolt.
If the carrier head 100 of the utility model includes: carrier head ontology 101 referring to Fig. 3 to Figure 13；Diaphragm 140,
It is installed in below carrier head ontology 101, substrate W is stressed on into grinding pad 11；Snap ring 130 is incorporated into carrier head ontology
101, the side of substrate W is constrained, has snap ring main body 131 and guide hump 138, the snap ring main body 131 is separatedly configured at
The lateral surface of diaphragm 140, the guide hump 138 protrude to be formed in the inner face of snap ring main body 131.
This is to effectively remove the remaining lapping liquid S between snap ring 130 and the close clearance of diaphragm 140.
Although making it possible to remove between inflow that is, previous to the gap jet cleaning liquid formed between diaphragm and snap ring
The lapping liquid of gap, but the cleaning solution for being supplied to gap is unable to fully scatter and just flow directly out, and accordingly, there exist be difficult to effectively remove
The problem of remaining lapping liquid in the gap of diaphragm and snap ring.
But the utility model is convexly formed guide hump 138 in the inner face of snap ring main body 131, by means of this, supplies
Cleaning solution to (G of Fig. 4) between snap ring 130 and the gap of diaphragm 140 can sufficiently scatter by means of guide hump 138,
It can thus obtain so that the generation of non-cleaning area (not carrying out the region of the cleaning based on cleaning solution) is realized most in clearance G
Smallization effectively removes the advantageous effects of the lapping liquid and foreign matter that are flowed into 130 inner face of snap ring.
As reference, carrier head 100 is obtained after the substrate W that rack (not shown) is loaded into, in lapping liquid supply pipe
To under the grinding pad (not shown) states above being arranged in grinding flat plate (not shown), pressurizes, hold to substrate W
Row chemical-mechanical polishing process is moved substrate W after using the chemical-mechanical polishing process of grinding pad and lapping liquid
It is sent to cleaning device.
In the present invention, so-called substrate W, it can be understood as the grinding object object that can be ground on grinding pad, this
Utility model is not limited or is limited by the type and characteristic of substrate W.As an example, as substrate W, crystalline substance can be used
Piece.
More specifically, carrier head ontology 101 includes: body part 110, connect and revolves with drive shaft (not shown)
Turn；Base portion 120 connect and rotates together with body part 110.
110 upper end of body part is incorporated into drive shaft not shown in the figure and carries out rotation driving.It is practical at this as reference
In novel embodiment, only it is illustrated although enumerating body part 110 with the example that a main body is formed, according to circumstances,
Can in conjunction with 2 or more main body and constitute ontology.
Base portion 120 is configured to arrange relative to body part 110 on the same axis, with the shape rotated together with body part 110
Formula connection combines, and rotates together with body part 110.
Diaphragm 140 is configured to be installed in below carrier head ontology 101, and substrate W is stressed on grinding pad.
As an example, diaphragm 140 has structure shown in Fig. 3.That is, diaphragm 140 includes: bottom plate 141, with elasticity
Flexible material (for example, polyurethane) formation；Side (not shown), from the edge termination bending of bottom plate 141, to upside
Vertical direction extends to be formed, and is formed with flexible materials；The next door 143 of multiple annular states, at the center and side of bottom plate 141
Between, it is incorporated into base portion 120；Between diaphragm 140 and base portion 120, it is formed with the multiple pressure chambers divided by next door 143
C1~C5.
In multiple pressure chamber C1~C5, the pressure sensor for measuring pressure respectively can be provided.Each pressure chamber C1~
The pressure of C5 can individually be adjusted according to the control of pressure control portion 150.
Snap ring 130 is installed in carrier head ontology 101, and the disengaging of substrate W is constrained in chemical-mechanical polishing process.
More specifically, snap ring 130 includes: snap ring main body 131, in the lateral surface setting given clearance of diaphragm 140
Separate configuration；Guide hump 138 protrudes to be formed in the inner face of snap ring main body 131.
Preferably, snap ring main body 131 includes the first ring element 132 of annular state, is laminated in 132 lower part of the first ring element
Second ring element 134 of annular state, to be enclosed in the base for being located at 140 bottom plate of diaphragm, 141 downside in chemical-mechanical polishing process
The annular state of plate W surrounding is formed.According to circumstances, snap ring main body can also be only made of a ring element.
As an example, the first ring element 132 can be formed with conductive material, and the second ring element 134 is with non-conductive
Property component is formed, and contacts grinding pad in chemical-mechanical polishing process.For example, the second ring element 134 can be by engineering plastics
Or the materials such as resin are formed.
Snap ring 130 drives up or down by the pressure of the pressurizing chamber (not shown) for the annular state for being located at upside
It is dynamic.Specifically, by means of integrally moved up and down with snap ring 130 lower side member, be located at lower side member on the upside of and under
The flexible ring of the upper member of state configuration, the contact surface surrounding for surrounding lower side member and upper member is contacted in side member
Component and form pressurizing chamber, according to the pressure supplied from pressure control portion to pressurizing chamber, adjust lower side member and upper member it
Between interval, the plus-pressure that pressurizes to grinding pad surface of control snap ring 130.
In addition, the 130s below snap ring main body 131, is formed with the through slot 137a being formed through along radial direction.
More specifically, through slot 137a is below the second ring element 134, with radial direction ingredient breakthrough form
At in chemical-mechanical polishing process, so that the lapping liquid being supplied on grinding pad 11 is discharged by through slot 137a.
Preferably, multiple through slot 137a are formed spaced apart in the circumferential directionly along the second ring element 134, by means of this,
The advantageous effects that lapping liquid is equably discharged along the circumferencial direction of snap ring 130 can be obtained.At this point, the number of through slot 137a
And interval can diversely be changed according to desired condition and design pattern.
It is highly preferred that the gap formed between diaphragm 140 and snap ring main body 131, by means of connecting path 137b with
Through slot 137a connection.
Wherein, so-called connecting path 137b is connected to through slot 137a, is defined as connecting path 137b and through slot 137a
Spatially interconnect.
More specifically, one end of connecting path 137b is connected to through slot 137a, and the other end of connecting path 137b connects
It is connected to gap.
Connecting path 137b can be formed according to desired condition and design pattern with the structure of multiplicity.Show as one
Example, connecting path 137b extend to be formed to upper direction in the inner peripheral surface of snap ring main body 131.
In the embodiments of the present invention, the example that connecting path 137b is formed in 131 inner peripheral surface of snap ring main body is enumerated
It is illustrated, but according to circumstances, is also possible to connecting path to penetrate through the structure of snap ring body interior and be formed.
Preferably, the medial end of the lower end of connecting path 137b and through slot 137a are (in the second ring element 134
The end that circumferential surface exposes) it is formed overlapping one another, through slot 137a and connecting path 137b are formed under the second ring element 134
The slot of face and the continuously coupled substantially " L " font state of inner peripheral surface.
At this point, connecting path 137b can be with the flute profile state vertical along the vertical direction in the inner peripheral surface of the second ring element 134
It is formed, or to be formed relative to the inclined flute profile state of up and down direction (referring to Fig. 7).
It is highly preferred that the medial end of the lower end of connecting path 137b and through slot 137a are formed completely overlappedly
(when second ring element 134 from following, the lower end of connecting path 137b is configured at shape in the region of through slot 137a
At), by means of this, can obtain prevents from causing because the lower end of connecting path 137b is exposed to below the second ring element 134
Contact area variation (the second ring element 134 relative to grinding pad 11 contact area change) cause 11 flatness of grinding pad low
Under advantageous effects.
That is, the soft grinding pad 11 of direct rotating contact below the second ring element 134, in 134 inner circumferential of the second ring element
If the lower end for the connecting path 137b that face is formed inside (adjacent second ring element inner circumferential below the second ring element 134
Position below face) expose, then below the second ring element 134, form the position (first area, under connecting path of slot
End), the position (second area) of not formed slot coexist, the contact to grinding pad 11 is not realized in first area, only second
Realize the contact (pressurization) to grinding pad 11 in region.Therefore, grinding pad 11 below the second ring element 134 in, only with it is outer
Position (second area) is pressurized below circumferential surface is adjacent, therefore, because the firstth area along radial direction of the second ring element 134
Pressurization difference in areas in domain and second area, the flatness of grinding pad 11 are difficult to keep certain.Conversely, because through slot 137a exists
It is fully formed below second ring element 134 along radial direction, stated differently, since the region for forming through slot 137a is whole
Grinding pad 11 is not contacted, thus keeps certain (first area and the secondth area along the contact area of 134 radial direction of the second ring element
Pressurization area in domain keeps certain).
As described above, the through slot 137a fully formed below the second ring element 134 along radial direction, based on not
The flatness this point for influencing grinding pad 11, overlappingly forms the lower end of connecting path 137b on the region through slot 137a,
By means of this, it can prevent the lower end due to connecting path 137b from contacting caused by exposing below the second ring element 134
Area change (the second ring element changes the contact area of grinding pad), thus can obtain and keep 11 flatness of grinding pad uniform
Advantageous effects.
According to circumstances, connecting path can also partly be connected to (lower end of connecting path and through slot with through slot
The overlapping of medial end a part) formed, but preferably, the lower end of connecting path and the medial end maximum limit of through slot
Degree ground is overlappingly formed, so as to which grinding caused by exposing the lower end due to connecting path below the second ring element is equal
Once low realize minimized.
As described above, connecting path 137b is formed in 134 inner peripheral surface of the second ring element, so that in the second ring element 134
The connecting path 137b that circumferential surface is formed is connected to the gap formed between 140 lateral surface of diaphragm and 130 inner peripheral surface of snap ring, by
In this, between 130 inner peripheral surface of 140 lateral surface of diaphragm and snap ring, equipped with the expansion being made of connecting path 137b and gap
Cleaning solution access path.
As described above, the utility model, between 130 inner peripheral surface of 140 lateral surface of diaphragm and snap ring, being formed has expansion
The cleaning solution access path of width (gap width+connecting path width) enables cleaning solution to sufficiently flow into diaphragm 140 and card
Between ring 130, by means of this, it can obtain and effectively remove in the advantageous of diaphragm 140 and the remaining lapping liquid in gap of snap ring 130
Effect.
That is, previous, the gap of diaphragm 140 and snap ring 130 is formed with very narrow width (for example, 0.5 ㎜), thus even if
To the gap jet cleaning liquid of diaphragm 140 and snap ring 130, cleaning solution is also unable to fully flow into gap but reflux comes out, thus
There are problems that being difficult to effectively remove the remaining lapping liquid in gap in diaphragm 140 and snap ring 130.But the utility model exists
The cleaning with the width (gap width+connecting path width) expanded than original gap is formed between diaphragm 140 and snap ring 130
Liquid access path can supply sufficient cleaning solution to the gap of diaphragm 140 and snap ring 130 by means of this, thus can obtain
(cleaning) is effectively removed in the advantageous effects of diaphragm 140 and the remaining lapping liquid in gap of snap ring 130.
Guide hump 138 protrudes to be formed in the inner face of snap ring main body 131, to be partly blocked in diaphragm 140 and snap ring
The gap formed between main body 131.At this point, being formed with cleaning solution between 140 lateral surface of diaphragm and snap ring main body 131 passes through stream
Road (DP of Fig. 4), the cleaning solution have the width less than clearance G by flow path, pass through for cleaning solution.
That is, guide hump 138 remains cleaning solution temporarily in the inner face of snap ring main body 131 with being ready for use on.Preferably, draw
Pilot plays 138 and is formed on the top of connecting path 137b.
As reference, in the present invention, so-called guide hump 138 keeps cleaning solution temporary in the inner face of snap ring main body 131
When remain, it can be understood as, be not expelled directly out the cleaning solution supplied to 131 inner face of snap ring main body but temporarily stagnant, Ke Yili
The time that solution is detained on 131 inner face of snap ring main body for delay cleaning solution.
As described above, the utility model remains the cleaning solution supplied to 131 inner face of snap ring main body temporarily, by means of
This, can obtain the advantageous effects improved based on cleaning solution to the cleaning efficiency of gap (gap between diaphragm and snap ring main body) G.
That is, the gap of previous diaphragm and snap ring is formed with very narrow width, thus even if from the jet cleaning of gap lower part
Liquid, cleaning solution is also unable to fully flow into gap and reflux is returned, and accordingly, there exist be difficult to effectively remove to remain on diaphragm and snap ring
The problem of lapping liquid in gap.
But the utility model supplies cleaning solution from the top of clearance G, by means of the cleaning solution that is fallen along clearance G
Cleaned, accordingly, sufficient cleaning solution can be supplied to clearance G, thus can be effectively removed (cleaning) remain on every
The advantageous effects of the lapping liquid S of the clearance G of film 140 and snap ring 130.
Further, in the present invention, by means of keeping the cleaning solution for being supplied to gap (inner face of snap ring main body) G temporary
When remain, the lateral surface of cleaning solution contact diaphragm 140 and the time of 131 inner face of snap ring main body can be increased, thus can be obtained
Improve the cleaning effect of cleaning solution and the advantageous effects of cleaning efficiency.
In addition, the utility model remains the cleaning solution for being supplied to 131 inner face of snap ring main body temporarily, it, can by means of this
To guide state supply of the cleaning solution in clearance G to be commodiously unfolded, thus, it is possible to obtain making to occur not clean in clearance G
The situation in region (not carrying out the region of the cleaning by means of cleaning solution) minimizes, further increases the advantageous effect of cleaning efficiency
Fruit.That is, dischargeing lower part while falling along clearance G to the cleaning solution that clearance G is supplied.But it is supplied in multiple cleaning solutions
Portion's (not shown) is answered to separate in the structure of configuration along the circumferencial direction of snap ring 130, only from each cleaning solution supply department
The place of 200 supply cleaning solutions, cleaning solution fall and realize cleaning, and therefore, the region between each cleaning solution supply department exists not
The problem of supplying cleaning solution, in other words, the region between each cleaning solution supply department exists without by means of the clear of cleaning solution
The problem of washing.But in the present invention, so that the cleaning solution supplied to clearance G by means of guide hump 138 and commodiously
Distribution, by means of this, can obtain makes the situation that non-cleaning area occurs in clearance G minimize, further increase cleaning efficiency
Advantageous effects.
In addition, the cleaning solution that the utility model flows into clearance G is hindered in guide hump 138 for the first time, cover later
Guide hump 138 and fallen along clearance G, by means of this, cleaning solution can contact the inner face and diaphragm of snap ring main body 131 simultaneously
140 lateral surface, therefore, in other words, the inner face of snap ring main body 131 and the lateral surface of diaphragm 140 can be cleaned liquid simultaneously
Cleaning, thus more effective removal (cleaning) can be obtained and remain on the lapping liquid S of diaphragm 140 and 131 clearance G of snap ring main body and different
The advantageous effects of object.
Guide hump 138 can be can make the cleaning solution for flowing into 131 inner face of snap ring main body (gap) temporarily remaining more
Spline structure is formed.
Preferably, guide hump 138 is formed in the inner face of snap ring main body 131 with annular state.As described above, by means of with ring
Form forms guide hump 138, and can obtain makes the advantageous effects of the uniform stagnation of cleaning solution in entire clearance G region.
As an example, in the inner face of snap ring main body 131, a guide hump 138 can be only formed with.According to feelings
Condition can also separatedly form multiple guide humps in the inner face of snap ring main body along the vertical direction.
Different from this, as shown in figure 12, it is convex that multiple guidance can also be separatedly formed along the circumferencial direction of snap ring main body 131
138 are played, or along the inner face of snap ring main body 131, guide hump (being not shown on figure) is formed continuously in the form of spiral (spiral).
Preferably, it can be formed with upper angled face 138a in guide hump 138, the upper angled face 138a will be supplied
To the cleaning solution on the gap top formed between diaphragm 140 and snap ring main body 131, guided towards the lateral surface of diaphragm 140.
As an example, if referring to Fig. 4, upper angled face 138a can be formed with curved-surface shape.Different from this,
Can be as shown in Figures 5 to 7, upper angled face 138a is formed with plane configuration.
Furthermore it is possible to be formed with lower beveled 138b in guide hump 138, the lower beveled 138b will be supplied to
The cleaning solution of the gap lower part formed between diaphragm 140 and snap ring main body 131 is guided towards the lateral surface of diaphragm 140.
As an example, lower beveled 138b can be formed with curved-surface shape.(referring to Fig. 4) is different from this, such as Fig. 5
To shown in Fig. 7, lower beveled 138b can also be formed with plane configuration.
It is highly preferred that being formed together in guide hump 138: upper angled face 138a, will be supplied to diaphragm 140 with
The cleaning solution on the gap top formed between snap ring main body 131 is guided towards the lateral surface of diaphragm 140；Lower beveled 138b,
Its cleaning solution that will be supplied to the gap lower part formed between diaphragm 140 and snap ring main body 131, towards the outside of diaphragm 140
Face guidance.As an example, if referring to Fig. 7, guide hump 138' can be formed in have upper angled face 138a and
The triangular cross-section form of lower beveled 138b.As another example, if referring to Fig. 6, guide hump 138 " can be formed
It obtains in the trapezoidal cross-section form with upper angled face 138a and lower beveled 138b.
It can by means of this as described above, forming upper angled face 138a and lower beveled 138b in guide hump 138
Guided with the lateral surface that will flow into the cleaning solution in gap towards diaphragm 140, increase the lateral surface of cleaning solution contact diaphragm 140 when
Between, thus the advantageous effects for improving the cleaning effect based on cleaning solution and cleaning efficiency can be obtained.
In addition, snap ring 130 includes: flat part FZ if referring to Fig.1 0 to Figure 12, in the formation of snap ring main body 131, and hold
Carrier head ontology 101 contacts；Non-flat forms portion NFZ is not contacted in the formation of snap ring main body 131 with carrier head ontology 101.
That is, being incorporated into the position of carrier head ontology 101 in snap ring main body 131, it is formed with flat part FZ and non-flat forms portion
NFZ.At this point, flat part FZ is contacted with carrier head ontology 101, non-flat forms portion NFZ is not contacted with carrier head ontology 101 and (is separated).
As reference, in the present invention, so-called flat part FZ is defined as with the processing of high processing precise degree (flatness)
And it can flatly be adjacent to by the position of contact surface (for example, below carrier head ontology 101), so-called non-flat forms portion NFZ, definition
To be processed with lower processing precise degree (for example, the degree for feeling harsh feeling) to be difficult to be adjacent to completely by the degree of contact surface
Position.
In snap ring main body 131, position that flat part FZ and non-flat forms portion NFZ are formed according to desired condition and can be set
It counts specification and diversely changes.As an example, flat part FZ and non-flat forms portion NFZ is in the formation of the upper surface of snap ring main body 131.
According to circumstances, flat part and non-flat forms portion can also be formed in the extension for extending to snap ring body side, or in other positions
Form flat part and non-flat forms portion.
As described above, being incorporated into the position of carrier head ontology 101 in snap ring main body 131, flat part FZ and non-flat forms are formed
Portion NFZ can obtain the processing efficiency for improving snap ring 130, the advantageous effects for improving precision by means of this.
That is, snap ring 130 can install additional up or down relative to body part 110 and base portion 120, below snap ring 130
In order to equably pressurize to grinding pad 11, the mounting surface for being fixedly installed in the snap ring 130 of carrier head ontology 101 should be able to be added with height
The processing of work precision.
But if the processing precise degree for being adjacent to the mounting surface (for example, above) of the snap ring 130 of carrier head ontology 101 is low,
Then the mounting surface of snap ring 130 can not be adjacent to ontology 100, and existing leads to that the depth of parallelism below snap ring 130 with grinding pad 11 occurs
The problem of deviation (posture of snap ring tilts).In addition, the shape below snap ring 130 with the parallel misalignment of grinding pad 11 occurs
Under state, exist even if applying uniform plus-pressure to the top of snap ring 130, it also can not be fully to grinding below snap ring 130
The problem of 11 uniform pressurization of pad.
Therefore, snap ring 130 following for the uniform pressurization of grinding pad 11, pacify by the snap ring 130 for being installed on carrier head ontology 101
Dress face should be able to have high processing precise degree (high flat degree), but due to needing to process the whole of snap ring 130 with high processing precise degree
A mounting surface has that the production efficiency of snap ring 130 is low, manufacturing cost rises.
But the utility model is formed in the mounting surface (above for example) for being adjacent to the snap ring 130 of carrier head ontology 101 and is put down
Smooth portion FZ, moreover, being formed has the non-flat forms portion NFZ of the flatness (processing precise degree) lower than flat part FZ can by means of this
To obtain the processing efficiency for improving snap ring 130, the advantageous effects for improving precision.
Importantly, being only adjacent to carrying in the upper surface of snap ring main body 131 entire area with the processing of high processing precise degree
The flat part region FZ a part below first 100, the non-flat forms portion NFZ not contacted below carrier head 100 can be with lower processing
Precision processing, thus the processability and assemblability for improving snap ring 130 can be obtained, productivity and yield are improved, manufacture is saved
The advantageous effects of cost.
Preferably, non-flat forms portion NFZ is configured to occupy in the upper surface of snap ring main body 131 entire area bigger than flat part FZ
Area.For example, non-flat forms portion NFZ is configured to form 60% or more of 131 all the above area of snap ring main body.As described above,
Non-flat forms portion NFZ is formed with the area broader than flat part FZ, by means of this, Precision Machining position can be reduced, thus can be with
Acquisition further increases the processability of snap ring 130 and the advantageous effects of assemblability.
The form and structure of flat part FZ and non-flat forms portion NFZ can according to desired condition and design specification and diversely
Change, the utility model are not limited or are limited by the form and structure of flat part FZ and non-flat forms portion NFZ.
As an example, referring to Fig.1 1, non-flat forms portion NFZ along snap ring main body 131 circumferencial direction, with continuous ring
Form is formed.
At this point, flat part FZ can be along the radial direction of snap ring main body 131, in non-flat forms portion, shape is distinguished in the two sides of NFZ
At.According to circumstances, it is also possible to the radial direction along snap ring main body, only forms flat part in the side in non-flat forms portion.
Moreover, being formed with the flat surface UZ being adjacent to for flat part FZ below carrier head ontology 101.At this point, flat part
FZ and flat surface UZ forms to have the high flat degree that can be adjacent to completely.
As another example, if referring to Fig.1 2, non-flat forms portion NFZ along snap ring main body 131 circumferencial direction, with continuous
Annular state formed, and separatedly formed along 131 radial direction of snap ring main body multiple.At this point, between each non-flat forms portion NFZ,
Alternatively form flat part FZ.
As reference, in the embodiments of the present invention for preceding addressing diagram, non-flat forms portion NFZ is enumerated with continuous ring
The morphogenetic example of shape is illustrated, but according to another embodiment of the utility model, is also possible to the circle along snap ring main body
Circumferential direction separatedly forms multiple non-flat forms portions.
It is in the present invention, so-called to form non-flat forms portion NFZ in the upper surface of snap ring main body 131 as reference, it is defined as
By non-flat forms portion NFZ by the upper surface of snap ring main body 131 be recessed or protrude in the form of formed or with snap ring main body 131 above
Horizontal form formation is included entirely within.
As an example, if referring to Fig.1 0, non-flat forms portion NFZ the upper surface of snap ring main body 131 canyon topography at.Root
According to another embodiment of the utility model, it is also possible to be horizontally formed non-flat forms portion with snap ring body upper, in carrier head ontology
Below form corresponding with non-flat forms portion receiving portion.
In addition, carrier head ontology 101 is linked with snap ring main body 131 by means of binder bolt B if referring to Fig.1 3.Even
Knot bolt B can be linked with common screw mode of connection, and the utility model is not limited by the structure and number of binder bolt B
System limits.
Preferably, in non-flat forms portion, NFZ is hollowly formed with guiding groove, and below carrier head ontology 101, protrusion is formed
There is the guide hump 103 for being contained in guiding groove.
As described above, form guiding groove in non-flat forms portion NFZ, so that be contained in that carrier head ontology 101 protrudes below draws
Pilot plays 103, by means of this, can obtain and improve the combination stability of carrier head ontology 101 and snap ring 130, inhibits snap ring 130
The advantageous effects along the circumferential direction moved relative to carrier head ontology 101.
In addition, snap ring 130 can be constrained relative to carrier head ontology 101 by means of binder bolt and guide hump 103
Laterally travelling, thus the advantageous effects of more effective deformation and the unexpected travelling for inhibiting snap ring 130 can be obtained.
Furthermore, by means of making guide hump 103 be contained in guiding groove, absorption can be obtained by binder bolt
The advantageous effects of the precisive plane degree of the deformation, holding snap ring 130 that occur when being linked to snap ring 130.
It is formed with protruding length H2 it is highly preferred that the depth H 1 of guiding groove is greater than guide hump 103.As described above, by
Length H2 is protruded in making the depth H 1 of guiding groove be formed larger than guide hump 103, guide hump 103 and snap ring can be prevented
130 contact, because raising processing efficiency can be obtained without processing below guide hump 103 with high processing precise degree
And the advantageous effects of productivity.
On the other hand, Figure 14 is the figure for illustrating the carrier head of another embodiment of the utility model.Moreover, for it is preceding
It states and constitutes identical and be equivalent to identical part, imparting is same or equivalent in identical reference numeral, omits to it specifically
It is bright.
In the utility model embodiment for preceding addressing diagram, the guidance of recess is formed in non-flat forms portion NFZ although enumerating
Slot, the example that the guide hump protruded below carrier head ontology 101 is contained in guiding groove are illustrated, but according to circumstances,
It is also possible to form the guide hump of protrusion in non-flat forms portion.
More specifically, if referring to Fig.1 4, below carrier head 100, recess is formed with holding tank 103', non-flat
Smooth portion NFZ, protrusion are formed with the guide hump 136' for being contained in holding tank 103'.
Guide hump 136' is contained in holding tank 103', constrains 130 phase of snap ring together with binder bolt (3 B referring to Fig.1)
Transverse direction travelling for carrier head ontology 101.
As described above, the preferred embodiment referring to the utility model is illustrated, but as long as being relevant art field
Skilled practitioner just it will be appreciated that in the range of the thought of the utility model recorded without departing from claims and field,
It diversely can revise and change the utility model.
Claims (38)
1. a kind of carrier head, as the carrier head that substrate is stressed on to grinding pad in chemical-mechanical polishing process, feature
It is, comprising:
Carrier head ontology；
Diaphragm, is installed in below the carrier head ontology, and the substrate is stressed on the grinding pad；
Snap ring comprising the snap ring main body that separatedly configures in the lateral surface of the diaphragm, the snap ring main body inner face it is convex
The guide hump formed out is incorporated into the carrier head ontology, constrains the side of the substrate.
2. carrier head according to claim 1, which is characterized in that
The guide hump is formed along the circumferencial direction of the snap ring main body with continuous annular state.
3. carrier head according to claim 1, which is characterized in that
Multiple guide humps are separatedly formed along the circumferencial direction of the snap ring main body.
4. carrier head according to claim 1, which is characterized in that
Multiple guide humps are separatedly formed along the vertical direction in the inner face of the snap ring main body.
5. carrier head according to claim 1, which is characterized in that
It is formed with upper angled face in the guide hump, the upper angled face will be supplied in the diaphragm and the snap ring
The cleaning solution on the top in the gap formed between main body is guided towards the lateral surface of the diaphragm.
6. carrier head according to claim 5, which is characterized in that
The upper angled face is formed with curved-surface shape.
7. carrier head according to claim 5, which is characterized in that
The upper angled face is formed with plane configuration.
8. carrier head according to claim 1, which is characterized in that
It is formed with lower beveled in the guide hump, the lower beveled will be supplied in the diaphragm and the snap ring
The cleaning solution of the lower part in the gap formed between main body is guided towards the lateral surface of the diaphragm.
9. carrier head according to claim 8, which is characterized in that
The lower beveled is formed with plane configuration.
10. carrier head according to claim 1, which is characterized in that
It is formed in the guide hump:
Upper angled face will be supplied to the cleaning on the top in the gap formed between the diaphragm and the snap ring main body
Liquid is guided towards the lateral surface of the diaphragm；
Lower beveled will be supplied to the cleaning of the lower part in the gap formed between the diaphragm and the snap ring main body
Liquid is guided towards the lateral surface of the diaphragm.
11. carrier head according to claim 10, which is characterized in that
The guide hump is formed with triangular cross-section form.
12. carrier head according to claim 10, which is characterized in that
The guide hump has trapezoidal cross-section form.
13. carrier head according to claim 1 characterized by comprising
Through slot is formed through below the snap ring main body along radial direction.
14. carrier head according to claim 13 characterized by comprising
Connecting path, one end are connected to the through slot, and the other end is connected between the diaphragm and the snap ring main body
The gap of formation.
15. carrier head according to claim 14, which is characterized in that
The connecting path is formed in the inner peripheral surface of the snap ring main body,
And the lower end of the connecting path with the snap ring main body inner peripheral surface expose the through slot medial end that
This is overlappingly formed.
16. carrier head according to claim 14, which is characterized in that
The guide hump is formed on the top of the connecting path.
17. carrier head according to claim 1, which is characterized in that
The snap ring includes:
Flat part is formed in the snap ring main body, with the carrier head body contacts；
Non-flat forms portion is formed in the snap ring main body, not with the carrier head body contacts.
18. carrier head according to claim 17, which is characterized in that
The flat part and the non-flat forms portion are in the formation of the upper surface of described snap ring main body.
19. carrier head according to claim 18, which is characterized in that
The non-flat forms portion occupies the area bigger than the flat part in the upper surface of snap ring main body entire area.
20. carrier head according to claim 18, which is characterized in that
The non-flat forms portion the upper surface of snap ring main body canyon topography at.
21. carrier head according to claim 20 characterized by comprising
Guiding groove is recessed to be formed in the non-flat forms portion；
Guide hump protrudes below the carrier head ontology, is contained in the guiding groove.
22. carrier head according to claim 21, which is characterized in that
The depth of the guiding groove is formed larger than the protrusion length of the guide hump.
23. carrier head according to claim 17, which is characterized in that
Below the carrier head ontology, it is formed with the flat surface being adjacent to the flat part.
24. carrier head according to claim 17, which is characterized in that
The non-flat forms portion is formed with having the flatness for being lower than the flat part.
25. carrier head according to claim 17, which is characterized in that
Further include binder bolt, links the carrier head ontology and the snap ring main body.
26. carrier head according to claim 18, which is characterized in that
Including protruding the guide hump to be formed in the non-flat forms portion,
Below the carrier head ontology, it is formed with the holding tank for accommodating the guide hump.
27. carrier head according to claim 1, which is characterized in that
The snap ring main body includes:
First ring element is incorporated into the carrier head ontology；
Second ring element is configured at the lower part of first ring element.
28. a kind of snap ring of chemical-mechanical polishing device carrier head, as being installed in chemical-mechanical polishing process
Substrate is stressed on into the carrier head of grinding pad and constrains the snap ring that the substrate is detached from characterized by comprising
Snap ring main body is separatedly configured in the lateral surface for the diaphragm being installed in below the carrier head；
Guide hump protrudes to be formed in the inner face of the snap ring main body.
29. the snap ring of chemical-mechanical polishing device carrier head according to claim 28, which is characterized in that
The guide hump is formed along the circumferencial direction of the snap ring main body with continuous annular state.
30. the snap ring of chemical-mechanical polishing device carrier head according to claim 28, which is characterized in that
Multiple guide humps are separatedly formed along the circumferencial direction of the snap ring main body.
31. the snap ring of chemical-mechanical polishing device carrier head according to claim 28, which is characterized in that
Multiple guide humps are separatedly formed along the vertical direction in the inner face of the snap ring main body.
32. the snap ring of chemical-mechanical polishing device carrier head according to claim 28, which is characterized in that
It is formed with upper angled face in the guide hump, the upper angled face will be supplied in the diaphragm and the snap ring
The cleaning solution on the top in the gap formed between main body is guided towards the lateral surface of the diaphragm.
33. the snap ring of chemical-mechanical polishing device carrier head according to claim 32, which is characterized in that
The upper angled face is formed with curved-surface shape or plane configuration.
34. the snap ring of chemical-mechanical polishing device carrier head according to claim 28, which is characterized in that
It is formed with lower beveled in the guide hump, the lower beveled will be supplied in the diaphragm and the snap ring
The cleaning solution of the lower part in the gap formed between main body is guided towards the lateral surface of the diaphragm.
35. the snap ring of chemical-mechanical polishing device carrier head according to claim 34, which is characterized in that
The lower beveled is formed with curved-surface shape or plane configuration.
36. the snap ring of chemical-mechanical polishing device carrier head according to claim 28, which is characterized in that
It is formed in the guide hump:
Upper angled face will be supplied to the cleaning on the top in the gap formed between the diaphragm and the snap ring main body
Liquid is guided towards the lateral surface of the diaphragm；
Lower beveled will be supplied to the cleaning of the lower part in the gap formed between the diaphragm and the snap ring main body
Liquid is guided towards the lateral surface of the diaphragm.
37. the snap ring of chemical-mechanical polishing device carrier head according to claim 36, which is characterized in that
The guide hump has triangular cross-section form or trapezoidal cross-section form.
38. the snap ring of chemical-mechanical polishing device carrier head according to claim 28, which is characterized in that
The snap ring main body includes:
First ring element is incorporated into the carrier head；
Second ring element is configured at the lower part of first ring element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0149205 | 2018-11-28 | ||
| KR20180149205 | 2018-11-28 |
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| CN209615159U true CN209615159U (en) | 2019-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822188431.1U Active CN209615159U (en) | 2018-11-28 | 2018-12-25 | The snap ring of chemical-mechanical polishing device carrier head and the carrier head for having it |
Country Status (2)
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| KR (1) | KR102323727B1 (en) |
| CN (1) | CN209615159U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015498A (en) * | 2019-12-27 | 2020-04-17 | 福建北电新材料科技有限公司 | Wafer polishing apparatus and method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW436378B (en) * | 1999-02-05 | 2001-05-28 | Mitsubishi Materials Corp | Wafer polishing apparatus and method for making a wafer |
| JP3507794B2 (en) * | 2000-12-25 | 2004-03-15 | 日本電気株式会社 | Method for manufacturing semiconductor device |
| KR100764040B1 (en) * | 2006-05-11 | 2007-10-12 | 주식회사 윌비에스엔티 | Retainer ring of chemical mechanical polishing apparatus |
| US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
| US9227297B2 (en) * | 2013-03-20 | 2016-01-05 | Applied Materials, Inc. | Retaining ring with attachable segments |
| KR101365726B1 (en) * | 2013-10-31 | 2014-02-20 | 유승열 | Manufacturing method for retainer ring of chemical mechanical polishing apparatus and manufacturing mold thereof |
| US9368371B2 (en) * | 2014-04-22 | 2016-06-14 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
| KR102368790B1 (en) * | 2017-04-28 | 2022-03-02 | 주식회사 케이씨텍 | Retainer ring in carrier head for chemical mechanical polishing apparatus and carrier head having the same |
-
2018
- 2018-12-25 CN CN201822188431.1U patent/CN209615159U/en active Active
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2019
- 2019-11-26 KR KR1020190153295A patent/KR102323727B1/en active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015498A (en) * | 2019-12-27 | 2020-04-17 | 福建北电新材料科技有限公司 | Wafer polishing apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102323727B1 (en) | 2021-11-11 |
| KR20200064000A (en) | 2020-06-05 |
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