CN201856158U - 晶圆研磨定位环以及化学机械研磨设备 - Google Patents
晶圆研磨定位环以及化学机械研磨设备 Download PDFInfo
- Publication number
- CN201856158U CN201856158U CN2010202644890U CN201020264489U CN201856158U CN 201856158 U CN201856158 U CN 201856158U CN 2010202644890 U CN2010202644890 U CN 2010202644890U CN 201020264489 U CN201020264489 U CN 201020264489U CN 201856158 U CN201856158 U CN 201856158U
- Authority
- CN
- China
- Prior art keywords
- grinding
- locating ring
- wafer
- ring body
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202644890U CN201856158U (zh) | 2010-07-20 | 2010-07-20 | 晶圆研磨定位环以及化学机械研磨设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202644890U CN201856158U (zh) | 2010-07-20 | 2010-07-20 | 晶圆研磨定位环以及化学机械研磨设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201856158U true CN201856158U (zh) | 2011-06-08 |
Family
ID=44101975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010202644890U Expired - Fee Related CN201856158U (zh) | 2010-07-20 | 2010-07-20 | 晶圆研磨定位环以及化学机械研磨设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201856158U (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105881246A (zh) * | 2014-12-19 | 2016-08-24 | 浙江金徕镀膜有限公司 | 基板处理装置 |
CN106233431A (zh) * | 2014-04-22 | 2016-12-14 | 应用材料公司 | 内表面具有刻面的固定环 |
CN108922847A (zh) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | 一种用于晶圆生产加工的表面研磨装置 |
CN110802507A (zh) * | 2019-11-11 | 2020-02-18 | 上海华力微电子有限公司 | 研磨头和化学机械研磨设备 |
CN112548846A (zh) * | 2019-09-25 | 2021-03-26 | 夏泰鑫半导体(青岛)有限公司 | 用于化学机械研磨之固定环 |
CN113579995A (zh) * | 2021-08-09 | 2021-11-02 | 北京烁科精微电子装备有限公司 | 晶圆保持件及研磨机 |
CN114473862A (zh) * | 2020-10-26 | 2022-05-13 | 昆明物理研究所 | 一种适用于碲镉汞外延薄膜表面的抛光夹具 |
US11453099B2 (en) | 2015-05-29 | 2022-09-27 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
US12033865B2 (en) | 2023-05-17 | 2024-07-09 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
-
2010
- 2010-07-20 CN CN2010202644890U patent/CN201856158U/zh not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11056350B2 (en) | 2014-04-22 | 2021-07-06 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
CN106233431A (zh) * | 2014-04-22 | 2016-12-14 | 应用材料公司 | 内表面具有刻面的固定环 |
US11682561B2 (en) | 2014-04-22 | 2023-06-20 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
CN105881246B (zh) * | 2014-12-19 | 2018-06-08 | 浙江金徕镀膜有限公司 | 基板处理装置 |
CN105881246A (zh) * | 2014-12-19 | 2016-08-24 | 浙江金徕镀膜有限公司 | 基板处理装置 |
US11453099B2 (en) | 2015-05-29 | 2022-09-27 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
CN108922847A (zh) * | 2018-09-12 | 2018-11-30 | 江苏英锐半导体有限公司 | 一种用于晶圆生产加工的表面研磨装置 |
CN112548846A (zh) * | 2019-09-25 | 2021-03-26 | 夏泰鑫半导体(青岛)有限公司 | 用于化学机械研磨之固定环 |
CN110802507A (zh) * | 2019-11-11 | 2020-02-18 | 上海华力微电子有限公司 | 研磨头和化学机械研磨设备 |
CN114473862A (zh) * | 2020-10-26 | 2022-05-13 | 昆明物理研究所 | 一种适用于碲镉汞外延薄膜表面的抛光夹具 |
CN114473862B (zh) * | 2020-10-26 | 2023-01-24 | 昆明物理研究所 | 一种适用于碲镉汞外延薄膜表面的抛光夹具 |
CN113579995A (zh) * | 2021-08-09 | 2021-11-02 | 北京烁科精微电子装备有限公司 | 晶圆保持件及研磨机 |
US12033865B2 (en) | 2023-05-17 | 2024-07-09 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201856158U (zh) | 晶圆研磨定位环以及化学机械研磨设备 | |
US11682561B2 (en) | Retaining ring having inner surfaces with facets | |
CN203622170U (zh) | 一种化学机械研磨组件 | |
US10040167B2 (en) | Polishing pad, polishing system and polishing method | |
CN201346739Y (zh) | 开槽的固定环 | |
US20050126708A1 (en) | Retaining ring with slurry transport grooves | |
TWI740989B (zh) | 用於cmp的保持環 | |
CN108177044B (zh) | 一种集成电路用单晶硅片边缘倒角方法 | |
CN102630194A (zh) | 用于适应性抛光的方法和设备 | |
CN202592202U (zh) | 带有研磨液供应功能的研磨头及研磨装置 | |
CN103506940A (zh) | 化学机械抛光晶圆承载器 | |
CN203245737U (zh) | 多功能研磨液供应结构及研磨装置 | |
CN102814725B (zh) | 一种化学机械研磨方法 | |
CN201841472U (zh) | 研磨液手臂以及化学机械研磨设备 | |
TWI650202B (zh) | 研磨墊、研磨墊的製造方法及研磨方法 | |
CN210499749U (zh) | 一种化学机械抛光装置 | |
CN202462207U (zh) | 研磨垫及研磨装置 | |
CN201151081Y (zh) | 导引环结构 | |
CN103128650A (zh) | 一种化学机械研磨方法 | |
CN102773789A (zh) | 化学机械抛光设备及方法 | |
CN109590897A (zh) | 研磨垫以及研磨方法 | |
CN103252712A (zh) | 晶片研磨磁加载夹持装置 | |
CN202200170U (zh) | 研磨头及化学机械研磨设备 | |
CN203622204U (zh) | 研磨垫调整器 | |
CN204248633U (zh) | 一种化学机械研磨设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130321 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130321 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110608 Termination date: 20180720 |