CN202462207U - 研磨垫及研磨装置 - Google Patents
研磨垫及研磨装置 Download PDFInfo
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- CN202462207U CN202462207U CN2011205710988U CN201120571098U CN202462207U CN 202462207 U CN202462207 U CN 202462207U CN 2011205710988 U CN2011205710988 U CN 2011205710988U CN 201120571098 U CN201120571098 U CN 201120571098U CN 202462207 U CN202462207 U CN 202462207U
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CN2011205710988U CN202462207U (zh) | 2011-12-31 | 2011-12-31 | 研磨垫及研磨装置 |
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CN2011205710988U CN202462207U (zh) | 2011-12-31 | 2011-12-31 | 研磨垫及研磨装置 |
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CN202462207U true CN202462207U (zh) | 2012-10-03 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105983898A (zh) * | 2015-02-13 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | 晶圆表面氧化层的研磨方法 |
CN106141901A (zh) * | 2015-04-23 | 2016-11-23 | 中芯国际集成电路制造(上海)有限公司 | 晶圆表面的铜层的研磨方法 |
CN108214285A (zh) * | 2018-01-25 | 2018-06-29 | 成都时代立夫科技有限公司 | 一种化学机械抛光垫 |
TWI718663B (zh) * | 2019-09-11 | 2021-02-11 | 智勝科技股份有限公司 | 研磨墊、研磨系統及研磨方法 |
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2011
- 2011-12-31 CN CN2011205710988U patent/CN202462207U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105983898A (zh) * | 2015-02-13 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | 晶圆表面氧化层的研磨方法 |
CN106141901A (zh) * | 2015-04-23 | 2016-11-23 | 中芯国际集成电路制造(上海)有限公司 | 晶圆表面的铜层的研磨方法 |
CN108214285A (zh) * | 2018-01-25 | 2018-06-29 | 成都时代立夫科技有限公司 | 一种化学机械抛光垫 |
TWI718663B (zh) * | 2019-09-11 | 2021-02-11 | 智勝科技股份有限公司 | 研磨墊、研磨系統及研磨方法 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130424 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130424 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20181231 |
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CF01 | Termination of patent right due to non-payment of annual fee |