SG11201703670PA - Machining apparatus for workpiece - Google Patents
Machining apparatus for workpieceInfo
- Publication number
- SG11201703670PA SG11201703670PA SG11201703670PA SG11201703670PA SG11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- machining apparatus
- machining
- Prior art date
Links
- 238000003754 machining Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014233585A JP6269450B2 (ja) | 2014-11-18 | 2014-11-18 | ワークの加工装置 |
PCT/JP2015/005308 WO2016079923A1 (ja) | 2014-11-18 | 2015-10-21 | ワークの加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201703670PA true SG11201703670PA (en) | 2017-06-29 |
Family
ID=56013503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201703670PA SG11201703670PA (en) | 2014-11-18 | 2015-10-21 | Machining apparatus for workpiece |
Country Status (8)
Country | Link |
---|---|
US (1) | US10166649B2 (ko) |
JP (1) | JP6269450B2 (ko) |
KR (1) | KR102283204B1 (ko) |
CN (1) | CN107073683B (ko) |
DE (1) | DE112015004875T5 (ko) |
SG (1) | SG11201703670PA (ko) |
TW (1) | TWI603394B (ko) |
WO (1) | WO2016079923A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6707831B2 (ja) * | 2015-10-09 | 2020-06-10 | 株式会社Sumco | 研削装置および研削方法 |
JP6443370B2 (ja) * | 2016-03-18 | 2018-12-26 | 信越半導体株式会社 | 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法 |
JP6589762B2 (ja) * | 2016-07-13 | 2019-10-16 | 株式会社Sumco | 両面研磨装置 |
JP6829467B2 (ja) * | 2017-04-05 | 2021-02-10 | スピードファム株式会社 | 両面研磨装置 |
CN108326727B (zh) * | 2018-04-12 | 2024-08-23 | 新乡日升数控轴承装备股份有限公司 | 用于双面研磨机的尺寸控制系统及安全研磨检测方法 |
US11060605B2 (en) * | 2018-07-09 | 2021-07-13 | Textron Innovations Inc. | Spherical mounted cylindrical roller bearing system |
KR102248009B1 (ko) * | 2019-09-30 | 2021-05-03 | 에스케이실트론 주식회사 | 웨이퍼 래핑 장치 및 그 제어 방법 |
KR102123938B1 (ko) * | 2019-12-31 | 2020-06-23 | 김병호 | 연마대상부재의 스크래치 방지가 가능한 양면연마장치 |
CN116372682B (zh) * | 2023-06-05 | 2023-08-11 | 成都新利精密刀具有限公司 | 一种圆形刀片双面打磨的行星齿轮系打磨装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0448925Y2 (ko) * | 1986-06-02 | 1992-11-18 | ||
JPH02106269A (ja) * | 1988-10-12 | 1990-04-18 | Toshiba Mach Co Ltd | 異状装填検知器を有する研磨機 |
TW467792B (en) * | 1999-03-11 | 2001-12-11 | Ebara Corp | Polishing apparatus including attitude controller for turntable and/or wafer carrier |
JP2001096455A (ja) * | 1999-09-28 | 2001-04-10 | Ebara Corp | 研磨装置 |
CN100380600C (zh) * | 2002-03-28 | 2008-04-09 | 信越半导体株式会社 | 晶片的两面研磨装置及两面研磨方法 |
JP4492155B2 (ja) | 2004-02-27 | 2010-06-30 | 信越半導体株式会社 | 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法 |
CN101934491B (zh) * | 2004-11-01 | 2012-07-25 | 株式会社荏原制作所 | 抛光设备 |
CN100481341C (zh) * | 2005-02-25 | 2009-04-22 | 信越半导体股份有限公司 | 双面研磨装置用载具、使用该载具的双面研磨机及双面研磨方法 |
JP4799313B2 (ja) * | 2006-08-09 | 2011-10-26 | スピードファム株式会社 | 両面研磨装置および両面研磨装置におけるワークとキャリアとの重なり検知方法 |
TW201000693A (en) * | 2008-06-05 | 2010-01-01 | Sumco Corp | Epitaxial silicon wafer and method for producing the same |
JP5151800B2 (ja) * | 2008-08-20 | 2013-02-27 | 信越半導体株式会社 | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
US8699001B2 (en) * | 2009-08-20 | 2014-04-15 | Nikon Corporation | Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method |
JP2012111001A (ja) * | 2010-11-25 | 2012-06-14 | Nikon Corp | ワークキャリア及び該ワークキャリアを備えた研磨装置 |
JP5630414B2 (ja) * | 2011-10-04 | 2014-11-26 | 信越半導体株式会社 | ウェーハの加工方法 |
JP6015683B2 (ja) * | 2014-01-29 | 2016-10-26 | 信越半導体株式会社 | ワークの加工装置およびワークの加工方法 |
-
2014
- 2014-11-18 JP JP2014233585A patent/JP6269450B2/ja active Active
-
2015
- 2015-10-21 KR KR1020177012865A patent/KR102283204B1/ko active IP Right Grant
- 2015-10-21 DE DE112015004875.8T patent/DE112015004875T5/de active Pending
- 2015-10-21 SG SG11201703670PA patent/SG11201703670PA/en unknown
- 2015-10-21 CN CN201580060154.2A patent/CN107073683B/zh active Active
- 2015-10-21 WO PCT/JP2015/005308 patent/WO2016079923A1/ja active Application Filing
- 2015-10-21 US US15/523,817 patent/US10166649B2/en active Active
- 2015-10-23 TW TW104134836A patent/TWI603394B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN107073683B (zh) | 2018-10-30 |
US20170312878A1 (en) | 2017-11-02 |
KR20170084084A (ko) | 2017-07-19 |
TWI603394B (zh) | 2017-10-21 |
JP6269450B2 (ja) | 2018-01-31 |
US10166649B2 (en) | 2019-01-01 |
WO2016079923A1 (ja) | 2016-05-26 |
KR102283204B1 (ko) | 2021-07-29 |
CN107073683A (zh) | 2017-08-18 |
TW201626450A (zh) | 2016-07-16 |
DE112015004875T5 (de) | 2017-07-27 |
JP2016097450A (ja) | 2016-05-30 |
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