SG11201702778YA - Method for bonding substrates - Google Patents
Method for bonding substratesInfo
- Publication number
- SG11201702778YA SG11201702778YA SG11201702778YA SG11201702778YA SG11201702778YA SG 11201702778Y A SG11201702778Y A SG 11201702778YA SG 11201702778Y A SG11201702778Y A SG 11201702778YA SG 11201702778Y A SG11201702778Y A SG 11201702778YA SG 11201702778Y A SG11201702778Y A SG 11201702778YA
- Authority
- SG
- Singapore
- Prior art keywords
- bonding substrates
- substrates
- bonding
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Bipolar Transistors (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Combinations Of Printed Boards (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2016/053270 WO2017140348A1 (de) | 2016-02-16 | 2016-02-16 | Verfahren zum bonden von substraten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201702778YA true SG11201702778YA (en) | 2017-09-28 |
Family
ID=55404708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201702778YA SG11201702778YA (en) | 2016-02-16 | 2016-02-16 | Method for bonding substrates |
Country Status (8)
| Country | Link |
|---|---|
| US (7) | US10109487B2 (de) |
| EP (2) | EP3382744A1 (de) |
| JP (1) | JP6789930B2 (de) |
| KR (5) | KR102397577B1 (de) |
| CN (7) | CN114334624A (de) |
| SG (1) | SG11201702778YA (de) |
| TW (2) | TWI771288B (de) |
| WO (1) | WO2017140348A1 (de) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4036956A1 (de) | 2016-03-22 | 2022-08-03 | EV Group E. Thallner GmbH | Vorrichtung zum bonden von substraten |
| TW202305871A (zh) * | 2016-11-16 | 2023-02-01 | 日商尼康股份有限公司 | 保持構件、接合裝置、及接合方法 |
| US11791299B2 (en) | 2017-11-30 | 2023-10-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Redistribution layer (RDL) layouts for integrated circuits |
| US11056356B1 (en) * | 2017-09-01 | 2021-07-06 | Intel Corporation | Fluid viscosity control during wafer bonding |
| US10497667B2 (en) | 2017-09-26 | 2019-12-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for bond wave propagation control |
| AT15801U3 (de) * | 2017-09-29 | 2019-03-15 | Ev Group E Thallner Gmbh | Verfahren und Vorrichtung zur Vermessung einer Bondwelle |
| DE102018130073A1 (de) * | 2017-11-30 | 2019-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Halbleiter-Bauelement und Verfahren zu dessen Herstellung |
| TWI828760B (zh) * | 2018-10-25 | 2024-01-11 | 日商尼康股份有限公司 | 基板貼合裝置、參數計算裝置、基板貼合方法及參數計算方法 |
| SG11201911800XA (en) * | 2019-01-18 | 2020-08-28 | Ev Group E Thallner Gmbh | Measuring device and method for determining the course of a bonding wave |
| KR102664425B1 (ko) * | 2019-03-18 | 2024-05-14 | 삼성디스플레이 주식회사 | 합착 장치 및 이를 이용한 기판의 합착 방법 |
| CN110289222B (zh) * | 2019-05-08 | 2021-11-16 | 武汉新芯集成电路制造有限公司 | 一种键合设备、键合波的检测方法及系统 |
| KR102566141B1 (ko) | 2019-07-02 | 2023-08-11 | 삼성전자주식회사 | 웨이퍼 본딩 방법 및 웨이퍼 본딩 장치 |
| KR20210039661A (ko) * | 2019-10-02 | 2021-04-12 | 삼성전자주식회사 | 기판 본딩 장치 |
| CN115668060A (zh) * | 2020-05-26 | 2023-01-31 | Asml荷兰有限公司 | 用于优化采样方案的方法和相关设备 |
| CN112038220B (zh) * | 2020-08-31 | 2023-02-03 | 上海华力集成电路制造有限公司 | 晶圆键合工艺中改善晶圆边缘形变的方法 |
| WO2022181655A1 (ja) * | 2021-02-26 | 2022-09-01 | ボンドテック株式会社 | 接合方法、基板接合装置および基板接合システム |
| KR102573094B1 (ko) * | 2021-05-11 | 2023-09-01 | 정라파엘 | 다이 본딩 방법 |
| KR102575887B1 (ko) * | 2021-05-11 | 2023-09-08 | 정라파엘 | 본딩 방법 |
| WO2024046577A1 (de) * | 2022-09-02 | 2024-03-07 | Ev Group E. Thallner Gmbh | Verfahren und vorrichtung zum beeinflussen einer bondwelle beim bonden |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2839147B1 (fr) * | 2002-04-30 | 2004-07-09 | Soitec Silicon On Insulator | Dispositif et procede de controle automatique de l'etat de surface de plaque par mesure de vitesse de collage |
| JP4014481B2 (ja) | 2002-04-30 | 2007-11-28 | 東レエンジニアリング株式会社 | ボンディング方法およびその装置 |
| US6989314B2 (en) * | 2003-02-12 | 2006-01-24 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Semiconductor structure and method of making same |
| US7479441B2 (en) * | 2005-10-14 | 2009-01-20 | Silicon Genesis Corporation | Method and apparatus for flag-less water bonding tool |
| US20070090479A1 (en) * | 2005-10-20 | 2007-04-26 | Chien-Hua Chen | Controlling bond fronts in wafer-scale packaging |
| US7601271B2 (en) * | 2005-11-28 | 2009-10-13 | S.O.I.Tec Silicon On Insulator Technologies | Process and equipment for bonding by molecular adhesion |
| FR2912839B1 (fr) * | 2007-02-16 | 2009-05-15 | Soitec Silicon On Insulator | Amelioration de la qualite de l'interface de collage par nettoyage froid et collage a chaud |
| US7682933B1 (en) | 2007-09-26 | 2010-03-23 | The United States Of America As Represented By The Secretary Of The Air Force | Wafer alignment and bonding |
| FR2931014B1 (fr) * | 2008-05-06 | 2010-09-03 | Soitec Silicon On Insulator | Procede d'assemblage de plaques par adhesion moleculaire |
| JP5493290B2 (ja) * | 2008-05-07 | 2014-05-14 | パナソニック株式会社 | 電子部品パッケージ |
| US20110168317A1 (en) | 2010-01-12 | 2011-07-14 | Fujifilm Corporation | Controlled Bond Wave Over Patterned Wafer |
| JP2011205074A (ja) | 2010-03-03 | 2011-10-13 | Toshiba Corp | 半導体製造装置 |
| JP5571988B2 (ja) * | 2010-03-26 | 2014-08-13 | パナソニック株式会社 | 接合方法 |
| JP5549339B2 (ja) | 2010-04-12 | 2014-07-16 | 株式会社ニコン | 基板相対位置検出方法、積層デバイス製造方法および検出装置 |
| FR2961630B1 (fr) * | 2010-06-22 | 2013-03-29 | Soitec Silicon On Insulator Technologies | Appareil de fabrication de dispositifs semi-conducteurs |
| FR2962594B1 (fr) * | 2010-07-07 | 2012-08-31 | Soitec Silicon On Insulator | Procede de collage par adhesion moleculaire avec compensation de desalignement radial |
| FR2965398B1 (fr) | 2010-09-23 | 2012-10-12 | Soitec Silicon On Insulator | Procédé de collage par adhésion moléculaire avec réduction de desalignement de type overlay |
| EP2463892B1 (de) | 2010-12-13 | 2013-04-03 | EV Group E. Thallner GmbH | Einrichtung, Vorrichtung und Verfahren zur Ermittlung von Ausrichtungsfehlern |
| WO2012079597A1 (de) | 2010-12-14 | 2012-06-21 | Ev Group E. Thallner Gmbh | Aufnahmeeinrichtung zur aufnahme und halterung eines wafers |
| KR101849443B1 (ko) | 2010-12-20 | 2018-04-16 | 에베 그룹 에. 탈너 게엠베하 | 웨이퍼의 장착을 위한 수용 수단 |
| JP2012156163A (ja) | 2011-01-21 | 2012-08-16 | Toshiba Corp | 半導体製造装置 |
| JP2012191307A (ja) | 2011-03-09 | 2012-10-04 | Toshiba Corp | 無線通信システム、通信方法及びプログラム |
| JP2012191037A (ja) | 2011-03-11 | 2012-10-04 | Shibaura Mechatronics Corp | 基板貼り合わせ装置および基板貼り合わせ方法 |
| KR20150108428A (ko) | 2011-04-11 | 2015-09-25 | 에베 그룹 에. 탈너 게엠베하 | 가요성의 캐리어 마운트 및 캐리어 기판을 분리하기 위한 장치 및 방법 |
| WO2013023708A1 (de) * | 2011-08-12 | 2013-02-21 | Ev Group E. Thallner Gmbh | Vorrichtung und verfahren zum bonden von substraten |
| JP5606429B2 (ja) * | 2011-12-08 | 2014-10-15 | 東京エレクトロン株式会社 | 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム |
| KR102355643B1 (ko) | 2011-12-22 | 2022-01-25 | 에베 그룹 에. 탈너 게엠베하 | 가요성 기판 홀더, 제1 기판을 분리하기 위한 장치 및 방법 |
| JP2013258377A (ja) * | 2012-06-14 | 2013-12-26 | Sony Corp | 半導体装置の製造装置および半導体装置の製造方法 |
| CN103367374B (zh) * | 2012-04-02 | 2017-06-09 | 索尼公司 | 固体摄像装置及其制造方法、半导体器件的制造装置和方法、电子设备 |
| JP5624594B2 (ja) * | 2012-09-24 | 2014-11-12 | 株式会社東芝 | 表示装置の製造装置及び表示装置の製造方法 |
| JP6501447B2 (ja) | 2013-03-26 | 2019-04-17 | 芝浦メカトロニクス株式会社 | 貼合装置および貼合基板の製造方法 |
| EP3404698B1 (de) * | 2013-05-29 | 2023-08-16 | EV Group E. Thallner GmbH | Verfahren zum bonden von substraten |
| US9646860B2 (en) * | 2013-08-09 | 2017-05-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Alignment systems and wafer bonding systems and methods |
| EP3103135B1 (de) | 2014-02-03 | 2021-05-12 | Ev Group E. Thallner GmbH | Verfahren und vorrichtung zum bonden von substraten |
| US9576827B2 (en) * | 2014-06-06 | 2017-02-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for wafer level bonding |
| FR3022178B1 (fr) * | 2014-06-12 | 2018-02-16 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de collage direct |
| DE102016108247A1 (de) | 2016-05-03 | 2017-11-09 | SMR Patents S.à.r.l. | Reinigungssystem für eine Kameralinse |
-
2016
- 2016-02-16 CN CN202210003747.7A patent/CN114334624A/zh active Pending
- 2016-02-16 KR KR1020217016980A patent/KR102397577B1/ko active IP Right Grant
- 2016-02-16 EP EP18166536.5A patent/EP3382744A1/de active Pending
- 2016-02-16 KR KR1020227005034A patent/KR20220025929A/ko not_active IP Right Cessation
- 2016-02-16 US US15/514,182 patent/US10109487B2/en active Active
- 2016-02-16 KR KR1020237030669A patent/KR20230133405A/ko not_active Application Discontinuation
- 2016-02-16 CN CN201680003082.2A patent/CN108028180B/zh active Active
- 2016-02-16 CN CN202210003795.6A patent/CN114334626A/zh active Pending
- 2016-02-16 WO PCT/EP2016/053270 patent/WO2017140348A1/de active Application Filing
- 2016-02-16 KR KR1020217031633A patent/KR102365284B1/ko active IP Right Grant
- 2016-02-16 CN CN202210003748.1A patent/CN114334625A/zh active Pending
- 2016-02-16 KR KR1020177009117A patent/KR102263285B1/ko active IP Right Grant
- 2016-02-16 JP JP2017517645A patent/JP6789930B2/ja active Active
- 2016-02-16 EP EP16705484.0A patent/EP3227907B1/de active Active
- 2016-02-16 CN CN202210003793.7A patent/CN114300347A/zh active Pending
- 2016-02-16 CN CN202210003792.2A patent/CN114300346A/zh active Pending
- 2016-02-16 SG SG11201702778YA patent/SG11201702778YA/en unknown
- 2016-02-16 CN CN202210003742.4A patent/CN114334623A/zh active Pending
-
2017
- 2017-02-16 TW TW106105155A patent/TWI771288B/zh active
- 2017-02-16 TW TW111122517A patent/TWI814450B/zh active
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2018
- 2018-09-06 US US16/123,494 patent/US10504730B2/en active Active
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2019
- 2019-10-29 US US16/667,102 patent/US10636662B2/en active Active
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2020
- 2020-03-17 US US16/821,139 patent/US10748770B2/en active Active
- 2020-07-08 US US16/923,530 patent/US10861699B2/en active Active
- 2020-11-04 US US17/088,654 patent/US11251045B2/en active Active
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2022
- 2022-01-04 US US17/567,942 patent/US11527410B2/en active Active
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