SG11201607632YA - Substrate processing apparatus and pipe cleaning method for substrate processing apparatus - Google Patents

Substrate processing apparatus and pipe cleaning method for substrate processing apparatus

Info

Publication number
SG11201607632YA
SG11201607632YA SG11201607632YA SG11201607632YA SG11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA SG 11201607632Y A SG11201607632Y A SG 11201607632YA
Authority
SG
Singapore
Prior art keywords
processing apparatus
substrate processing
cleaning method
pipe cleaning
pipe
Prior art date
Application number
SG11201607632YA
Other languages
English (en)
Inventor
Junji Kunisawa
Toru Maruyama
Masayoshi Imai
Koji Maeda
Mitsuru Miyazaki
Teruaki Hombo
Fujihiko Toyomasu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201607632YA publication Critical patent/SG11201607632YA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201607632YA 2014-03-27 2015-03-17 Substrate processing apparatus and pipe cleaning method for substrate processing apparatus SG11201607632YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014066998A JP6159282B2 (ja) 2014-03-27 2014-03-27 基板処理装置、および基板処理装置の配管洗浄方法
PCT/JP2015/057938 WO2015146724A1 (ja) 2014-03-27 2015-03-17 基板処理装置、および基板処理装置の配管洗浄方法

Publications (1)

Publication Number Publication Date
SG11201607632YA true SG11201607632YA (en) 2016-10-28

Family

ID=54195246

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607632YA SG11201607632YA (en) 2014-03-27 2015-03-17 Substrate processing apparatus and pipe cleaning method for substrate processing apparatus

Country Status (7)

Country Link
US (1) US10438818B2 (enExample)
JP (1) JP6159282B2 (enExample)
KR (2) KR20210080609A (enExample)
CN (1) CN106165067B (enExample)
SG (1) SG11201607632YA (enExample)
TW (1) TWI649780B (enExample)
WO (1) WO2015146724A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101776016B1 (ko) 2015-10-21 2017-09-07 세메스 주식회사 배관 세정 방법 및 기판 처리 장치
JP2017177303A (ja) * 2016-03-31 2017-10-05 株式会社荏原製作所 基板研磨装置、その洗浄方法および基板研磨装置への液体供給装置
CN110073471B (zh) * 2016-12-16 2023-06-09 株式会社荏原制作所 清洗单元
JP7564822B2 (ja) 2019-12-11 2024-10-09 株式会社荏原製作所 基板洗浄システムおよび基板洗浄方法
US12186785B2 (en) * 2020-10-23 2025-01-07 Sumco Corporation Method of cleaning pipe of single-wafer processing wafer cleaning apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4537640A (en) * 1977-08-30 1985-08-27 Schering Aktiengesellschaft Rinsing of articles to remove an adhering substance
JPS6369588A (ja) 1986-09-09 1988-03-29 Mitsubishi Electric Corp 半導体洗浄槽への純水供給システム
JPH0647105B2 (ja) * 1989-12-19 1994-06-22 株式会社荏原総合研究所 純水又は超純水の精製方法及び装置
JPH04139822A (ja) 1990-10-01 1992-05-13 Nec Corp 半導体装置の洗浄装置
JP2533460Y2 (ja) * 1991-12-13 1997-04-23 大日本スクリーン製造株式会社 基板洗浄装置
JP3433215B2 (ja) 1993-03-29 2003-08-04 芝浦メカトロニクス株式会社 洗浄装置
US5542441A (en) * 1994-08-03 1996-08-06 Yieldup International Apparatus for delivering ultra-low particle counts in semiconductor manufacturing
JPH1099855A (ja) * 1996-08-05 1998-04-21 Sony Corp 限外濾過機能を備える超純水供給プラント、および超純水の供給方法
JP2008246319A (ja) * 2007-03-29 2008-10-16 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5511190B2 (ja) 2008-01-23 2014-06-04 株式会社荏原製作所 基板処理装置の運転方法
TWI550760B (zh) * 2008-06-04 2016-09-21 荏原製作所股份有限公司 基板處理裝置、基板處理方法、基板保持機構及基板保持方法
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
JP5422143B2 (ja) * 2008-06-04 2014-02-19 株式会社荏原製作所 基板把持機構
CA2746773A1 (en) * 2011-07-18 2013-01-18 Fiber Connections Inc. Field terminated fiber optic and electrical connection device
JP6212253B2 (ja) * 2012-11-15 2017-10-11 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP6104836B2 (ja) * 2014-03-13 2017-03-29 東京エレクトロン株式会社 分離再生装置および基板処理装置

Also Published As

Publication number Publication date
US10438818B2 (en) 2019-10-08
KR102282729B1 (ko) 2021-07-29
JP6159282B2 (ja) 2017-07-05
JP2015191972A (ja) 2015-11-02
KR20160138145A (ko) 2016-12-02
CN106165067B (zh) 2019-12-13
CN106165067A (zh) 2016-11-23
WO2015146724A1 (ja) 2015-10-01
TWI649780B (zh) 2019-02-01
TW201543540A (zh) 2015-11-16
US20170117165A1 (en) 2017-04-27
KR20210080609A (ko) 2021-06-30

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