SG11201510255QA - Testing apparatus for wafer level ic testing - Google Patents
Testing apparatus for wafer level ic testingInfo
- Publication number
- SG11201510255QA SG11201510255QA SG11201510255QA SG11201510255QA SG11201510255QA SG 11201510255Q A SG11201510255Q A SG 11201510255QA SG 11201510255Q A SG11201510255Q A SG 11201510255QA SG 11201510255Q A SG11201510255Q A SG 11201510255QA SG 11201510255Q A SG11201510255Q A SG 11201510255QA
- Authority
- SG
- Singapore
- Prior art keywords
- testing
- wafer level
- testing apparatus
- wafer
- level
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361845042P | 2013-07-11 | 2013-07-11 | |
US201462019300P | 2014-06-30 | 2014-06-30 | |
PCT/US2014/046249 WO2015006625A2 (en) | 2013-07-11 | 2014-07-10 | Testing apparatus and method for microcircuit and wafer level ic testing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201510255QA true SG11201510255QA (en) | 2016-01-28 |
Family
ID=52276617
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201707975VA SG10201707975VA (en) | 2013-07-11 | 2014-07-10 | Testing apparatus and method for microcircuit and wafer level ic testing |
SG11201510255QA SG11201510255QA (en) | 2013-07-11 | 2014-07-10 | Testing apparatus for wafer level ic testing |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201707975VA SG10201707975VA (en) | 2013-07-11 | 2014-07-10 | Testing apparatus and method for microcircuit and wafer level ic testing |
Country Status (9)
Country | Link |
---|---|
US (1) | US9696347B2 (zh) |
EP (1) | EP3019879A4 (zh) |
CN (1) | CN105358991B (zh) |
HK (1) | HK1215604A1 (zh) |
MY (1) | MY174175A (zh) |
PH (1) | PH12016500056A1 (zh) |
SG (2) | SG10201707975VA (zh) |
TW (1) | TWI640789B (zh) |
WO (1) | WO2015006625A2 (zh) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI521212B (zh) * | 2014-03-10 | 2016-02-11 | A method and a method of assembling a vertical probe device, and a vertical probe device | |
TWI651539B (zh) * | 2014-03-10 | 2019-02-21 | 美商瓊斯科技國際公司 | 晶圓級積體電路探針陣列及建構方法 |
CN107533084A (zh) * | 2015-03-13 | 2018-01-02 | 泰克诺探头公司 | 具有在相应引导孔内改进的滑动运动且在不同的操作条件下将探针恰当地保持在测试头内的带垂直探针的测试头 |
TWI704352B (zh) | 2015-03-13 | 2020-09-11 | 義大利商探針科技公司 | 測試頭之接觸探針 |
WO2016156002A1 (en) | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Contact probe and corresponding testing head with vertical probes, particularly for high frequency applications |
US10274515B1 (en) * | 2015-08-07 | 2019-04-30 | Johnstech International Corporation | Waveguide integrated testing |
US10067164B2 (en) | 2015-08-24 | 2018-09-04 | Johnstech International Corporation | Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings |
TWI564569B (zh) * | 2015-09-21 | 2017-01-01 | 旺矽科技股份有限公司 | 探針結構及其製造方法 |
JP6407128B2 (ja) | 2015-11-18 | 2018-10-17 | 三菱電機株式会社 | 半導体装置の評価装置および半導体装置の評価方法 |
TWI576591B (zh) * | 2016-02-03 | 2017-04-01 | 京元電子股份有限公司 | 探針卡組裝結構與其組裝方法、以及由該探針卡組裝結構取出斷針的方法 |
KR101882209B1 (ko) * | 2016-03-23 | 2018-07-27 | 리노공업주식회사 | 동축 테스트소켓 조립체 |
US10598696B2 (en) * | 2016-03-28 | 2020-03-24 | Intel Corporation | Probe pins with etched tips for electrical die test |
WO2017208690A1 (ja) * | 2016-05-31 | 2017-12-07 | 日本電産リード株式会社 | 接触導電治具、及び検査装置 |
WO2018093109A2 (en) * | 2016-11-21 | 2018-05-24 | Leeno Industrial Inc. | Probe for testing device |
KR102015798B1 (ko) * | 2016-11-21 | 2019-08-29 | 리노공업주식회사 | 검사장치용 프로브 |
IT201700017037A1 (it) | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura per applicazioni ad alta frequenza |
IT201700021400A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura a sonde verticali con migliorate proprietà in frequenza |
CN108241078B (zh) * | 2017-05-18 | 2020-06-02 | 苏州韬盛电子科技有限公司 | 垂直探针卡 |
TWI641839B (zh) * | 2017-08-18 | 2018-11-21 | 中華精測科技股份有限公司 | 偵測裝置 |
KR101962644B1 (ko) * | 2017-08-23 | 2019-03-28 | 리노공업주식회사 | 검사프로브 및 이를 사용한 검사장치 |
US10725091B2 (en) * | 2017-08-28 | 2020-07-28 | Teradyne, Inc. | Automated test system having multiple stages |
WO2019116512A1 (ja) * | 2017-12-14 | 2019-06-20 | オムロン株式会社 | ソケット、検査治具、検査ユニットおよび検査装置 |
TWI638168B (zh) * | 2018-04-03 | 2018-10-11 | 中華精測科技股份有限公司 | 探針卡裝置及探針座 |
EP3918349A1 (en) * | 2018-09-11 | 2021-12-08 | Magicmotorsport Srl | Probe for tools for carrying out tests on electrical and/or electronic circuits and assembly comprising the probe |
US10734296B2 (en) * | 2018-12-28 | 2020-08-04 | Micron Technology, Inc. | Electrical device with test pads encased within the packaging material |
TWI724482B (zh) * | 2019-08-01 | 2021-04-11 | 迅得機械股份有限公司 | 探針模組 |
IT201900024889A1 (it) * | 2019-12-19 | 2021-06-19 | Technoprobe Spa | Sonda di contatto per applicazioni ad alta frequenza con migliorata portata di corrente |
TWI762320B (zh) * | 2020-05-26 | 2022-04-21 | 中華精測科技股份有限公司 | 彈簧探針 |
CN111983424A (zh) * | 2020-07-30 | 2020-11-24 | 华润赛美科微电子(深圳)有限公司 | 测试治具及测试设备 |
US11293976B1 (en) * | 2020-09-25 | 2022-04-05 | Essai, Inc. | Integrated circuit device test tooling with dual angle cavities |
CN112630539B (zh) * | 2020-12-14 | 2024-03-29 | 深圳市燕麦科技股份有限公司 | 一种用于fpc性能测试的测试针模以及测试装置 |
CN113058883B (zh) * | 2021-03-25 | 2023-09-12 | 中国电子科技集团公司第三十八研究所 | 一种多工位集成联动式自动化检测机构 |
KR102597311B1 (ko) * | 2021-08-24 | 2023-11-02 | 윌테크놀러지(주) | 미세피치 대응이 가능한 프로브 카드 |
CN114200278B (zh) * | 2021-11-29 | 2022-12-27 | 强一半导体(苏州)有限公司 | 一种薄膜探针卡及其探针头 |
WO2024062560A1 (ja) * | 2022-09-21 | 2024-03-28 | 日本電子材料株式会社 | プローブカード用プローブ |
Family Cites Families (20)
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US5066907A (en) | 1990-02-06 | 1991-11-19 | Cerprobe Corporation | Probe system for device and circuit testing |
US5632631A (en) | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
KR0135244B1 (en) * | 1994-07-12 | 1998-04-25 | Hyundai Electronics Ind | Probe card |
JPH11344510A (ja) * | 1998-06-02 | 1999-12-14 | Advantest Corp | プローブカード、プローブ及び半導体試験装置 |
US6579804B1 (en) * | 1998-11-30 | 2003-06-17 | Advantest, Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6759861B2 (en) * | 2002-07-30 | 2004-07-06 | Intel Corporation | Thin film probe card contact drive system |
JP2004132971A (ja) * | 2002-09-17 | 2004-04-30 | Iwasaki Correspond Industry Co Ltd | プローブカード |
JP4704426B2 (ja) * | 2005-05-23 | 2011-06-15 | 株式会社日本マイクロニクス | 電気的接続装置、その製造方法および電気的接続装置 |
US20090168374A1 (en) * | 2008-01-02 | 2009-07-02 | Clayton James E | Thin multi-chip flex module |
US8026600B2 (en) * | 2008-01-02 | 2011-09-27 | Samsung Electronics Co., Ltd. | Controlled impedance structures for high density interconnections |
JP2010091349A (ja) * | 2008-10-06 | 2010-04-22 | Japan Electronic Materials Corp | 垂直型プローブカード |
CN201266222Y (zh) * | 2008-10-10 | 2009-07-01 | 环隆电气股份有限公司 | 测试装置 |
CN101750525B (zh) * | 2008-12-22 | 2012-07-04 | 京元电子股份有限公司 | 测试插座的制作方法及其所使用的弹性测试探针 |
US20130002285A1 (en) | 2010-03-10 | 2013-01-03 | Johnstech International Corporation | Electrically Conductive Pins For Microcircuit Tester |
IT1395561B1 (it) * | 2009-09-03 | 2012-09-28 | Applied Materials Inc | Apparato di collaudo e relativo procedimento |
TWI534432B (zh) | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | 用於微電路測試器之電氣傳導針腳 |
US9702904B2 (en) * | 2011-03-21 | 2017-07-11 | Formfactor, Inc. | Non-linear vertical leaf spring |
US8723538B2 (en) * | 2011-06-17 | 2014-05-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe head formation methods employing guide plate raising assembly mechanism |
CN107271737B (zh) * | 2012-06-20 | 2020-01-10 | 约翰国际有限公司 | 晶片级集成电路接触器及构建方法 |
JP5156973B1 (ja) * | 2012-08-24 | 2013-03-06 | 株式会社クローバーテクノロジー | 異方導電性部材 |
-
2014
- 2014-07-10 EP EP14823081.6A patent/EP3019879A4/en not_active Withdrawn
- 2014-07-10 CN CN201480039183.6A patent/CN105358991B/zh not_active Expired - Fee Related
- 2014-07-10 SG SG10201707975VA patent/SG10201707975VA/en unknown
- 2014-07-10 US US14/328,460 patent/US9696347B2/en active Active
- 2014-07-10 MY MYPI2015704785A patent/MY174175A/en unknown
- 2014-07-10 WO PCT/US2014/046249 patent/WO2015006625A2/en active Application Filing
- 2014-07-10 SG SG11201510255QA patent/SG11201510255QA/en unknown
- 2014-07-11 TW TW103123964A patent/TWI640789B/zh not_active IP Right Cessation
-
2016
- 2016-01-08 PH PH12016500056A patent/PH12016500056A1/en unknown
- 2016-03-24 HK HK16103500.9A patent/HK1215604A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
PH12016500056B1 (en) | 2016-03-28 |
PH12016500056A1 (en) | 2016-03-28 |
CN105358991B (zh) | 2019-03-19 |
US20150015287A1 (en) | 2015-01-15 |
HK1215604A1 (zh) | 2016-09-02 |
CN105358991A (zh) | 2016-02-24 |
US9696347B2 (en) | 2017-07-04 |
WO2015006625A3 (en) | 2015-03-12 |
WO2015006625A2 (en) | 2015-01-15 |
MY174175A (en) | 2020-03-12 |
TW201512678A (zh) | 2015-04-01 |
TWI640789B (zh) | 2018-11-11 |
EP3019879A4 (en) | 2017-08-16 |
SG10201707975VA (en) | 2017-10-30 |
EP3019879A2 (en) | 2016-05-18 |
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