SG11201508466QA - Apparatus and method for plating and/or polishing wafer - Google Patents

Apparatus and method for plating and/or polishing wafer

Info

Publication number
SG11201508466QA
SG11201508466QA SG11201508466QA SG11201508466QA SG11201508466QA SG 11201508466Q A SG11201508466Q A SG 11201508466QA SG 11201508466Q A SG11201508466Q A SG 11201508466QA SG 11201508466Q A SG11201508466Q A SG 11201508466QA SG 11201508466Q A SG11201508466Q A SG 11201508466QA
Authority
SG
Singapore
Prior art keywords
plating
polishing wafer
polishing
wafer
Prior art date
Application number
SG11201508466QA
Inventor
Jian Wang
Yinuo Jin
Hongchao Yang
Hui Wang
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201508466QA publication Critical patent/SG11201508466QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • C25F3/30—Polishing of semiconducting materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG11201508466QA 2013-05-09 2013-05-09 Apparatus and method for plating and/or polishing wafer SG11201508466QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2013/075410 WO2014179968A1 (en) 2013-05-09 2013-05-09 Apparatus and method for plating and/or polishing wafer

Publications (1)

Publication Number Publication Date
SG11201508466QA true SG11201508466QA (en) 2015-11-27

Family

ID=51866631

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508466QA SG11201508466QA (en) 2013-05-09 2013-05-09 Apparatus and method for plating and/or polishing wafer

Country Status (6)

Country Link
US (1) US10227705B2 (en)
JP (1) JP6186499B2 (en)
KR (1) KR102043811B1 (en)
CN (1) CN105210181B (en)
SG (1) SG11201508466QA (en)
WO (1) WO2014179968A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109537041B (en) * 2018-10-18 2020-10-09 昆明理工大学 Polishing method of surface nano Cu and Cu alloy for electron back scattering diffraction test
CN111326477B (en) * 2018-12-14 2022-12-09 中芯集成电路（宁波）有限公司 Electroplating method
JP7422586B2 (en) * 2020-03-30 2024-01-26 東京エレクトロン株式会社 Substrate processing equipment and substrate processing method
CN113231924B (en) * 2021-05-08 2022-08-16 深圳市蓝海永兴实业有限公司 Precise hardware processing equipment and processing method thereof
CN116926649A (en) * 2022-03-31 2023-10-24 盛美半导体设备(上海)股份有限公司 Electroplating equipment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2903284B2 (en) 1993-04-26 1999-06-07 東京エレクトロン株式会社 Processing device and processing method
WO2000033356A2 (en) 1998-11-28 2000-06-08 Acm Research, Inc Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
JP2001131797A (en) * 1999-11-11 2001-05-15 Shinjiro Suganuma Semiconductor manufacturing method, and its device
US6527920B1 (en) * 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
JP3568455B2 (en) * 2000-06-14 2004-09-22 大日本スクリーン製造株式会社 Substrate plating equipment
EP1446514A4 (en) * 2001-11-13 2007-11-28 Acm Res Inc Electropolishing assembly and methods for electropolishing conductive layers
US7029567B2 (en) 2001-12-21 2006-04-18 Asm Nutool, Inc. Electrochemical edge and bevel cleaning process and system
JP2003311538A (en) * 2002-04-23 2003-11-05 Sony Corp Polishing method, polishing apparatus and method for producing semiconductor device
US20070131561A1 (en) * 2003-12-17 2007-06-14 Acm Research, Inc. Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
JP2007291419A (en) * 2006-04-21 2007-11-08 Nec Electronics Corp Plating treatment device
JP4803592B2 (en) 2006-06-16 2011-10-26 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
JP4940066B2 (en) * 2006-10-23 2012-05-30 東京エレクトロン株式会社 Cleaning apparatus, cleaning method, and computer-readable storage medium
KR20110097225A (en) * 2010-02-25 2011-08-31 주식회사 케이씨텍 Apparatus for plate substrate
JP6027523B2 (en) * 2013-12-05 2016-11-16 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and recording medium recording substrate processing program
JP5815827B2 (en) * 2014-10-10 2015-11-17 東京エレクトロン株式会社 Plating processing apparatus, plating processing method, and storage medium

Also Published As

Publication number Publication date
WO2014179968A1 (en) 2014-11-13
KR20160003699A (en) 2016-01-11
JP2016522860A (en) 2016-08-04
KR102043811B1 (en) 2019-11-12
CN105210181A (en) 2015-12-30
CN105210181B (en) 2017-12-01
US20160115613A1 (en) 2016-04-28
JP6186499B2 (en) 2017-08-23
US10227705B2 (en) 2019-03-12

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