SG11201509897WA - Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method - Google Patents
Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing methodInfo
- Publication number
- SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA SG 11201509897W A SG11201509897W A SG 11201509897WA
- Authority
- SG
- Singapore
- Prior art keywords
- coated substrate
- reflectivemask
- reflectivefilm
- multilayer
- semiconductor device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013202494 | 2013-09-27 | ||
| PCT/JP2014/074993 WO2015046095A1 (ja) | 2013-09-27 | 2014-09-22 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201509897WA true SG11201509897WA (en) | 2016-04-28 |
Family
ID=52743232
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201509897WA SG11201509897WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
| SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
| SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201805079YA SG10201805079YA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
| SG10201911502WA SG10201911502WA (en) | 2013-09-27 | 2014-09-22 | Conductive film coated substrate, multilayer reflective film coated substrate, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9746762B2 (ko) |
| JP (3) | JP5729847B2 (ko) |
| KR (3) | KR102127907B1 (ko) |
| SG (3) | SG11201509897WA (ko) |
| TW (3) | TWI530754B (ko) |
| WO (1) | WO2015046095A1 (ko) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6314019B2 (ja) * | 2014-03-31 | 2018-04-18 | ニッタ・ハース株式会社 | 半導体基板の研磨方法 |
| JP6069609B2 (ja) * | 2015-03-26 | 2017-02-01 | 株式会社リガク | 二重湾曲ｘ線集光素子およびその構成体、二重湾曲ｘ線分光素子およびその構成体の製造方法 |
| US10606166B2 (en) * | 2015-06-17 | 2020-03-31 | Hoya Corporation | Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device |
| JP6873758B2 (ja) * | 2016-03-28 | 2021-05-19 | Hoya株式会社 | 基板の製造方法、多層反射膜付き基板の製造方法、マスクブランクの製造方法、及び転写用マスクの製造方法 |
| US11048159B2 (en) * | 2016-03-31 | 2021-06-29 | Hoya Corporation | Method for manufacturing reflective mask blank, reflective mask blank, method for manufacturing reflective mask, reflective mask, and method for manufacturing semiconductor device |
| US9870612B2 (en) * | 2016-06-06 | 2018-01-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for repairing a mask |
| WO2018074512A1 (ja) * | 2016-10-21 | 2018-04-26 | Hoya株式会社 | 反射型マスクブランク、反射型マスクの製造方法、及び半導体装置の製造方法 |
| WO2018135467A1 (ja) * | 2017-01-17 | 2018-07-26 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
| US11281089B2 (en) * | 2017-02-27 | 2022-03-22 | Hoya Corporation | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
| CN110785704A (zh) * | 2017-07-05 | 2020-02-11 | 凸版印刷株式会社 | 反射型光掩模坯以及反射型光掩模 |
| JP7361027B2 (ja) | 2018-05-25 | 2023-10-13 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
| JP7492456B2 (ja) * | 2018-11-07 | 2024-05-29 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスクの製造方法、及び半導体装置の製造方法 |
| JP7250511B2 (ja) | 2018-12-27 | 2023-04-03 | Hoya株式会社 | 反射型マスクブランク、反射型マスク、及び半導体装置の製造方法 |
| DE102019100839A1 (de) * | 2019-01-14 | 2020-07-16 | Advanced Mask Technology Center Gmbh & Co. Kg | Fotomaskenanordnung mit reflektierender fotomaske und verfahren zum herstellen einer reflektierenden fotomaske |
| JP7263872B2 (ja) | 2019-03-25 | 2023-04-25 | 株式会社デンソー | ドリルの製造方法 |
| JP7350571B2 (ja) * | 2019-08-30 | 2023-09-26 | Hoya株式会社 | 導電膜付基板、反射型マスクブランク及び反射型マスク、並びに半導体デバイスの製造方法 |
| JP7271760B2 (ja) * | 2020-03-27 | 2023-05-11 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体デバイスの製造方法 |
| KR102464780B1 (ko) * | 2020-09-02 | 2022-11-09 | 주식회사 에스앤에스텍 | 도전막을 구비하는 블랭크마스크 및 이를 이용하여 제작된 포토마스크 |
| JP7260078B2 (ja) * | 2021-02-16 | 2023-04-18 | Ａｇｃ株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランク、ｅｕｖリソグラフィ用反射型マスク、およびそれらの製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0785463A (ja) * | 1993-09-20 | 1995-03-31 | A G Technol Kk | 磁気ディスク |
| JP2002288823A (ja) * | 2002-03-14 | 2002-10-04 | Nippon Sheet Glass Co Ltd | 情報記録媒体用基板の製造方法 |
| JP2004199846A (ja) | 2002-10-23 | 2004-07-15 | Nippon Sheet Glass Co Ltd | 磁気記録媒体用ガラス基板及びその製造方法 |
| JP2007272995A (ja) | 2006-03-31 | 2007-10-18 | Hoya Corp | 磁気ディスク装置および非磁性基板の良否判定方法、磁気ディスク、並びに磁気ディスク装置 |
| JP4978626B2 (ja) | 2006-12-15 | 2012-07-18 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板 |
| MY170436A (en) | 2008-06-30 | 2019-07-31 | Hoya Corp | Substrate for magnetic disk and magnetic disk |
| JP5481299B2 (ja) | 2010-07-22 | 2014-04-23 | 矢崎総業株式会社 | 導通検査治具の動作制御構造 |
| JP5533395B2 (ja) | 2010-07-26 | 2014-06-25 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクの製造方法 |
| DE112012000658T5 (de) | 2011-02-04 | 2013-11-07 | Asahi Glass Company, Limited | Substrat mit leitendem Film, Substrat mit Mehrschicht-Reflexionsfilm und Reflexionsmaskenrohling für eine EUV-Lithographie |
| JP6125772B2 (ja) | 2011-09-28 | 2017-05-10 | Hoya株式会社 | 反射型マスクブランク、反射型マスクおよび反射型マスクの製造方法 |
| JP5950535B2 (ja) * | 2011-10-25 | 2016-07-13 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| JP5949777B2 (ja) | 2011-10-28 | 2016-07-13 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクの製造方法 |
| JP5538637B2 (ja) | 2012-03-30 | 2014-07-02 | Ｈｏｙａ株式会社 | マスクブランク用基板、多層反射膜付き基板、透過型マスクブランク、反射型マスクブランク、透過型マスク、反射型マスク及び半導体装置の製造方法 |
-
2014
- 2014-09-22 SG SG11201509897WA patent/SG11201509897WA/en unknown
- 2014-09-22 WO PCT/JP2014/074993 patent/WO2015046095A1/ja active Application Filing
- 2014-09-22 KR KR1020207012491A patent/KR102127907B1/ko active IP Right Grant
- 2014-09-22 KR KR1020177030201A patent/KR102107799B1/ko active IP Right Grant
- 2014-09-22 US US14/896,411 patent/US9746762B2/en active Active
- 2014-09-22 KR KR1020157035761A patent/KR101877896B1/ko active IP Right Grant
- 2014-09-22 SG SG10201805079YA patent/SG10201805079YA/en unknown
- 2014-09-22 SG SG10201911502WA patent/SG10201911502WA/en unknown
- 2014-09-25 JP JP2014194957A patent/JP5729847B2/ja active Active
- 2014-09-26 TW TW103133627A patent/TWI530754B/zh active
- 2014-09-26 TW TW105103579A patent/TWI626503B/zh active
- 2014-09-26 TW TW107112766A patent/TWI652542B/zh active
-
2015
- 2015-04-03 JP JP2015076651A patent/JP6465720B2/ja active Active
-
2017
- 2017-07-21 US US15/655,932 patent/US10209614B2/en active Active
-
2018
- 2018-12-28 US US16/235,334 patent/US10527927B2/en active Active
-
2019
- 2019-01-08 JP JP2019001198A patent/JP6630005B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US10527927B2 (en) | 2020-01-07 |
| TWI530754B (zh) | 2016-04-21 |
| TWI652542B (zh) | 2019-03-01 |
| TWI626503B (zh) | 2018-06-11 |
| SG10201911502WA (en) | 2020-02-27 |
| KR102107799B1 (ko) | 2020-05-07 |
| WO2015046095A1 (ja) | 2015-04-02 |
| US20190155141A1 (en) | 2019-05-23 |
| TW201516556A (zh) | 2015-05-01 |
| KR20170120718A (ko) | 2017-10-31 |
| KR20200047800A (ko) | 2020-05-07 |
| JP2015156034A (ja) | 2015-08-27 |
| TW201617728A (zh) | 2016-05-16 |
| JP2019056939A (ja) | 2019-04-11 |
| JP6465720B2 (ja) | 2019-02-06 |
| KR101877896B1 (ko) | 2018-07-12 |
| JP6630005B2 (ja) | 2020-01-15 |
| KR102127907B1 (ko) | 2020-06-29 |
| KR20160061913A (ko) | 2016-06-01 |
| US20160124298A1 (en) | 2016-05-05 |
| US9746762B2 (en) | 2017-08-29 |
| JP5729847B2 (ja) | 2015-06-03 |
| TW201826009A (zh) | 2018-07-16 |
| SG10201805079YA (en) | 2018-07-30 |
| US10209614B2 (en) | 2019-02-19 |
| US20170315439A1 (en) | 2017-11-02 |
| JP2015088742A (ja) | 2015-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201509897WA (en) | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method | |
| SG10201911400WA (en) | Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device | |
| SG10201605473TA (en) | Substrate for mask blank, substrate with multilayer reflective film, reflective mask blank, reflective mask, method of manufacturing for substrate for mask blank, method of manufacturing for substrate with multilayer reflective film, and method of manufacturing semiconductor device | |
| EP3018696B8 (en) | Manufacturing method for semiconductor substrate | |
| SG11201508899TA (en) | Reflective mask blank, method for manufacturing reflective mask blank, reflective mask, and method for manufacturing semiconductor device | |
| EP2942808A4 (en) | CERAMIC WIRING SUBSTRATE, SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THE CERAMIC WIRING SUBSTRATE | |
| EP3032576A4 (en) | Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic device | |
| EP2960925A4 (en) | COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | |
| SG11202005918UA (en) | Substrate with conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method | |
| EP3065165A4 (en) | Substrate-holding apparatus, exposure apparatus, and device manufacturing method | |
| EP2836056A4 (en) | METHOD FOR PRODUCING A HEAT-DISABLE PLATE | |
| EP3031789A4 (en) | Circuit substrate and semiconductor device | |
| SG11201508901XA (en) | Reflective mask blank and method for manufacturing same, reflective mask, and method for manufacturing semiconductor device | |
| SG11201601300TA (en) | Adhesive film and method for manufacturing semiconductor device | |
| EP3041046A4 (en) | Mounting substrate wafer, multilayer ceramic substrate, mounting substrate, chip module, and mounting substrate wafer manufacturing method | |
| SG11201509848PA (en) | Multilayer coating film, and method for forming multilayer coating film | |
| EP3016088A4 (en) | Substrate for organic electronic device and method for manufacturing same | |
| EP3057144A4 (en) | Method for producing substrate for semiconductor light emitting elements, method for manufacturing semiconductor light emitting element, substrate for semiconductor light emitting elements, and semiconductor light emitting element | |
| EP2980176A4 (en) | PRODUCTION METHOD FOR LAMINATED FILM, LAMINATED FILM, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE USING THE SAME | |
| SG11201505421SA (en) | Method for manufacturing mask blank substrate, method for manufacturing mask blank and method for manufacturing transfer mask | |
| SG11202002853TA (en) | Substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor device | |
| EP3067438A4 (en) | Method for forming intermediate layer formed between substrate and dlc film, method for forming dlc film, and intermediate layer formed between substrate and dlc film | |
| KR102276146B9 (ko) | 박막 트랜지스터 기판 및 이의 제조 방법 | |
| EP2965325A4 (en) | CONDUCTIVE FILM, METHOD FOR THE PRODUCTION THEREOF AND ELECTRONIC DEVICE THEREFOR | |
| SG11201510022SA (en) | Apparatus and method for taping adhesive film on semiconductor substrate |