SG11201508728YA - Silver-bismuth powder, conductive paste and conductive film - Google Patents

Silver-bismuth powder, conductive paste and conductive film

Info

Publication number
SG11201508728YA
SG11201508728YA SG11201508728YA SG11201508728YA SG11201508728YA SG 11201508728Y A SG11201508728Y A SG 11201508728YA SG 11201508728Y A SG11201508728Y A SG 11201508728YA SG 11201508728Y A SG11201508728Y A SG 11201508728YA SG 11201508728Y A SG11201508728Y A SG 11201508728YA
Authority
SG
Singapore
Prior art keywords
silver
conductive
bismuth powder
conductive film
conductive paste
Prior art date
Application number
SG11201508728YA
Other languages
English (en)
Inventor
Kozo Ogi
Kenichi Inoue
Atsushi Ebara
Akihiro Asano
Hideyuki Fujimoto
Takahiro Yamada
Original Assignee
Dowa Electronics Materials Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co filed Critical Dowa Electronics Materials Co
Publication of SG11201508728YA publication Critical patent/SG11201508728YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
SG11201508728YA 2013-04-25 2014-03-27 Silver-bismuth powder, conductive paste and conductive film SG11201508728YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013092094A JP6184731B2 (ja) 2013-04-25 2013-04-25 銀−ビスマス粉末、導電性ペースト及び導電膜
PCT/JP2014/059016 WO2014174984A1 (ja) 2013-04-25 2014-03-27 銀－ビスマス粉末、導電性ペースト及び導電膜

Publications (1)

Publication Number Publication Date
SG11201508728YA true SG11201508728YA (en) 2015-12-30

Family

ID=51791566

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508728YA SG11201508728YA (en) 2013-04-25 2014-03-27 Silver-bismuth powder, conductive paste and conductive film

Country Status (7)

Country Link
US (1) US10458004B2 (ja)
JP (1) JP6184731B2 (ja)
KR (1) KR102236907B1 (ja)
CN (1) CN105142824B (ja)
SG (1) SG11201508728YA (ja)
TW (1) TWI635051B (ja)
WO (1) WO2014174984A1 (ja)

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TW201511296A (zh) 2013-06-20 2015-03-16 Plant PV 用於矽太陽能電池之核-殼型鎳粒子金屬化層
US20150060742A1 (en) * 2013-09-03 2015-03-05 E I Du Pont De Nemours And Company Conductive paste used for a solar cell electrode
JP6355949B2 (ja) * 2014-03-31 2018-07-11 株式会社タムラ製作所 金属接合材料
CN104525940A (zh) * 2014-12-31 2015-04-22 中国地质大学（武汉） 一种铋微米颗粒及其制备方法
JP6368288B2 (ja) * 2015-08-07 2018-08-01 福田金属箔粉工業株式会社 フレーク状銀粒子の集合体及び該銀粒子の集合体を含有するペースト
WO2017035103A1 (en) 2015-08-25 2017-03-02 Plant Pv, Inc Core-shell, oxidation-resistant particles for low temperature conductive applications
WO2017035102A1 (en) 2015-08-26 2017-03-02 Plant Pv, Inc Silver-bismuth non-contact metallization pastes for silicon solar cells
WO2017091782A1 (en) * 2015-11-24 2017-06-01 Plant Pv, Inc Fired multilayer stacks for use in integrated circuits and solar cells
US10000645B2 (en) 2015-11-24 2018-06-19 PLANT PV, Inc. Methods of forming solar cells with fired multilayer film stacks
JP6811080B2 (ja) * 2016-02-03 2021-01-13 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6899275B2 (ja) * 2016-08-10 2021-07-07 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
JP6796448B2 (ja) * 2016-10-20 2020-12-09 Ｄｏｗａエレクトロニクス株式会社 導電性ペーストおよびその製造方法、ならびに太陽電池セル
JP2020520114A (ja) * 2017-05-10 2020-07-02 日立化成株式会社 屋根材シリコン太陽電池アレイのための多層金属膜積層スタック
JP7090511B2 (ja) * 2017-09-29 2022-06-24 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
KR102284981B1 (ko) * 2018-10-17 2021-08-03 창저우 퓨전 뉴 머티리얼 씨오. 엘티디. 나노텍스쳐링 기판 함유 태양 전지의 전극 형성용 조성물, 이로부터 제조된 전극 및 이로부터 제조된 전극을 포함하는 태양 전지
CN110385442A (zh) * 2019-09-05 2019-10-29 宁波广新纳米材料有限公司 一种太阳能电池银浆用超细银铋合金粉的生产方法
CN110899714A (zh) * 2019-11-14 2020-03-24 江苏博迁新材料股份有限公司 一种电子浆料用超细银锡二元合金粉的生产方法
CN114171237A (zh) * 2021-12-23 2022-03-11 上海宝银电子材料有限公司 一种真空玻璃用导电浆料及其制备方法
CN115367796B (zh) * 2022-08-19 2023-11-17 陕西国际商贸学院 一种银铋氧系纳米粉末的制备方法

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WO1991015018A1 (fr) * 1990-03-19 1991-10-03 Asahi Kasei Kogyo Kabushiki Kaisha Pate pour la cuisson a haute temperature
US5302557A (en) * 1991-12-03 1994-04-12 E. I. Du Pont De Nemours And Company Automotive glass thick film conductor paste
JPH08127829A (ja) * 1994-10-28 1996-05-21 Matsushita Electric Works Ltd 電気接点材料及びその製造方法
ATE525730T1 (de) * 2000-10-25 2011-10-15 Harima Chemicals Inc Elektroleitfähige metallpaste und verfahren zu ihrer herstellung
EP1266975A1 (de) 2001-06-12 2002-12-18 ESEC Trading SA Bleifreies Lötmittel
CN1240862C (zh) * 2003-12-05 2006-02-08 昆明贵金属研究所 铜基合金导电粉末材料
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
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JP2010123681A (ja) * 2008-11-18 2010-06-03 Hitachi Metals Ltd 配線基板用金属球
JP5242521B2 (ja) * 2009-08-17 2013-07-24 株式会社タムラ製作所 はんだ接合剤組成物
WO2011078918A2 (en) 2009-11-05 2011-06-30 Ormet Circuits, Inc. Preparation of metallurgic network compositions and methods of use thereof
JP5754090B2 (ja) * 2010-06-29 2015-07-22 旭硝子株式会社 ガラスフリット、およびこれを用いた導電性ペースト、電子デバイス
JP5724088B2 (ja) * 2010-12-15 2015-05-27 株式会社弘輝 金属フィラー及びこれを含む鉛フリーはんだ
JP6028727B2 (ja) * 2011-05-18 2016-11-16 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
WO2012160921A1 (ja) 2011-05-26 2012-11-29 株式会社 村田製作所 導電性ペースト及び太陽電池
JP6047276B2 (ja) * 2011-06-30 2017-07-05 三井金属鉱業株式会社 焼結型導電性ペースト用銀粉
US8993159B2 (en) 2012-12-13 2015-03-31 24M Technologies, Inc. Semi-solid electrodes having high rate capability

Also Published As

Publication number Publication date
KR20160003766A (ko) 2016-01-11
US10458004B2 (en) 2019-10-29
WO2014174984A1 (ja) 2014-10-30
CN105142824B (zh) 2018-05-25
CN105142824A (zh) 2015-12-09
US20160040271A1 (en) 2016-02-11
TW201442961A (zh) 2014-11-16
JP6184731B2 (ja) 2017-08-23
JP2014214340A (ja) 2014-11-17
TWI635051B (zh) 2018-09-11
KR102236907B1 (ko) 2021-04-06

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