SG11201506667WA - A system and method for performing a wet etching process - Google Patents

A system and method for performing a wet etching process

Info

Publication number
SG11201506667WA
SG11201506667WA SG11201506667WA SG11201506667WA SG11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA
Authority
SG
Singapore
Prior art keywords
etching process
wet etching
wet
etching
Prior art date
Application number
SG11201506667WA
Other languages
English (en)
Inventor
Laura Mauer
Elena Lawrence
John Taddei
Ramey Youssef
Original Assignee
Veeco Prec Surface Proc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Prec Surface Proc Llc filed Critical Veeco Prec Surface Proc Llc
Publication of SG11201506667WA publication Critical patent/SG11201506667WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Architecture (AREA)
  • Software Systems (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
SG11201506667WA 2013-02-28 2014-02-14 A system and method for performing a wet etching process SG11201506667WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/780,657 US9698062B2 (en) 2013-02-28 2013-02-28 System and method for performing a wet etching process
PCT/US2014/016479 WO2014133792A1 (en) 2013-02-28 2014-02-14 A system and method for performing a wet etching process

Publications (1)

Publication Number Publication Date
SG11201506667WA true SG11201506667WA (en) 2015-09-29

Family

ID=51388548

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201506667WA SG11201506667WA (en) 2013-02-28 2014-02-14 A system and method for performing a wet etching process

Country Status (7)

Country Link
US (1) US9698062B2 (zh)
JP (2) JP2016515300A (zh)
KR (1) KR20150122661A (zh)
CN (1) CN105209402B (zh)
SG (1) SG11201506667WA (zh)
TW (1) TWI613719B (zh)
WO (1) WO2014133792A1 (zh)

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US10026660B2 (en) * 2014-10-31 2018-07-17 Veeco Precision Surface Processing Llc Method of etching the back of a wafer to expose TSVs
AT518466A3 (de) * 2014-10-31 2019-07-15 Veeco Precision Surface Proc Llc System und Verfahren zum Ausführen eines Nass-Ätzprozesses
US9870928B2 (en) * 2014-10-31 2018-01-16 Veeco Precision Surface Processing Llc System and method for updating an arm scan profile through a graphical user interface
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US20170221783A1 (en) * 2016-01-28 2017-08-03 Leonard TEDESCHI Self-aware production wafers
US10443943B2 (en) 2016-03-29 2019-10-15 Veeco Precision Surface Processing Llc Apparatus and method to control properties of fluid discharge via refrigerative exhaust
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TW202000993A (zh) * 2018-06-20 2020-01-01 美商維克精密表面處理股份有限公司 凸塊底層金屬蝕刻製程期間使底切最小化之裝置及方法
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KR102304793B1 (ko) 2018-11-08 2021-09-27 한양대학교 산학협력단 2단자 사이리스터 메모리 소자의 제조방법
WO2020154896A1 (en) * 2019-01-29 2020-08-06 Yangtze Memory Technologies Co., Ltd. Intelligent customizable wet processing system
JP7166966B2 (ja) * 2019-03-15 2022-11-08 株式会社Ｓｃｒｅｅｎホールディングス 処理条件選択方法、基板処理方法、基板製品製造方法、処理条件選択装置、コンピュータープログラム、および、記憶媒体
JP7036085B2 (ja) * 2019-04-17 2022-03-15 信越半導体株式会社 シリコンウェーハのエッチング方法
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CN110349856B (zh) * 2019-06-28 2021-04-27 Tcl华星光电技术有限公司 湿式蚀刻方法及装置
KR102705854B1 (ko) * 2019-07-23 2024-09-11 에스케이하이닉스 주식회사 반도체 소자의 분석 시스템 및 방법
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Also Published As

Publication number Publication date
CN105209402B (zh) 2018-07-24
KR20150122661A (ko) 2015-11-02
TW201501192A (zh) 2015-01-01
US9698062B2 (en) 2017-07-04
TWI613719B (zh) 2018-02-01
WO2014133792A1 (en) 2014-09-04
US20140242731A1 (en) 2014-08-28
JP2016515300A (ja) 2016-05-26
JP2019153803A (ja) 2019-09-12
CN105209402A (zh) 2015-12-30

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