EP4059047A4 - An apparatus and method for the minimization of undercut during a ubm etch process - Google Patents
An apparatus and method for the minimization of undercut during a ubm etch processInfo
- Publication number
- EP4059047A4 EP4059047A4 EP20887509.6A EP20887509A EP4059047A4 EP 4059047 A4 EP4059047 A4 EP 4059047A4 EP 20887509 A EP20887509 A EP 20887509A EP 4059047 A4 EP4059047 A4 EP 4059047A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- minimization
- etch process
- undercut during
- ubm
- ubm etch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/685,640 US11069583B2 (en) | 2018-06-20 | 2019-11-15 | Apparatus and method for the minimization of undercut during a UBM etch process |
PCT/US2020/058479 WO2021096712A1 (en) | 2019-11-15 | 2020-11-02 | An apparatus and method for the minimization of undercut during a ubm etch process |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4059047A1 EP4059047A1 (en) | 2022-09-21 |
EP4059047A4 true EP4059047A4 (en) | 2024-01-03 |
Family
ID=75912522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20887509.6A Pending EP4059047A4 (en) | 2019-11-15 | 2020-11-02 | An apparatus and method for the minimization of undercut during a ubm etch process |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP4059047A4 (en) |
TW (1) | TW202135187A (en) |
WO (1) | WO2021096712A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040208359A1 (en) * | 2001-11-07 | 2004-10-21 | Davar Pishva | Image highlight correction using illumination specific hsv color coordinate |
US20090046922A1 (en) * | 2005-07-04 | 2009-02-19 | Toru Yoshikawa | Surface Inspecting Apparatus |
US20120114220A1 (en) * | 2010-11-05 | 2012-05-10 | Hseb Dresden Gmbh | Inspection method |
US20140242731A1 (en) * | 2013-02-28 | 2014-08-28 | Solid State Equipment Llc | System and method for performing a wet etching process |
US20180061032A1 (en) * | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
-
2020
- 2020-11-02 WO PCT/US2020/058479 patent/WO2021096712A1/en unknown
- 2020-11-02 EP EP20887509.6A patent/EP4059047A4/en active Pending
- 2020-11-06 TW TW109138896A patent/TW202135187A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040208359A1 (en) * | 2001-11-07 | 2004-10-21 | Davar Pishva | Image highlight correction using illumination specific hsv color coordinate |
US20090046922A1 (en) * | 2005-07-04 | 2009-02-19 | Toru Yoshikawa | Surface Inspecting Apparatus |
US20120114220A1 (en) * | 2010-11-05 | 2012-05-10 | Hseb Dresden Gmbh | Inspection method |
US20140242731A1 (en) * | 2013-02-28 | 2014-08-28 | Solid State Equipment Llc | System and method for performing a wet etching process |
US20180061032A1 (en) * | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
Non-Patent Citations (2)
Title |
---|
CHALUPA ADAM ET AL: "Using High-Speed Video Analysis for Defect Investigation and Process Improvement", 2019 30TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), IEEE, 6 May 2019 (2019-05-06), pages 1 - 4, XP033592203, DOI: 10.1109/ASMC.2019.8791795 * |
See also references of WO2021096712A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP4059047A1 (en) | 2022-09-21 |
WO2021096712A1 (en) | 2021-05-20 |
TW202135187A (en) | 2021-09-16 |
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Legal Events
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
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Effective date: 20220613 |
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DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Free format text: PREVIOUS MAIN CLASS: H01L0021670000 Ipc: H01L0021660000 |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20231204 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/485 20060101ALN20231128BHEP Ipc: H01L 21/3213 20060101ALN20231128BHEP Ipc: H01L 21/67 20060101ALI20231128BHEP Ipc: H01L 21/66 20060101AFI20231128BHEP |