SG11201506667WA - A system and method for performing a wet etching process - Google Patents
A system and method for performing a wet etching processInfo
- Publication number
- SG11201506667WA SG11201506667WA SG11201506667WA SG11201506667WA SG11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA
- Authority
- SG
- Singapore
- Prior art keywords
- etching process
- wet etching
- wet
- etching
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Computation (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Architecture (AREA)
- Software Systems (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/780,657 US9698062B2 (en) | 2013-02-28 | 2013-02-28 | System and method for performing a wet etching process |
PCT/US2014/016479 WO2014133792A1 (en) | 2013-02-28 | 2014-02-14 | A system and method for performing a wet etching process |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201506667WA true SG11201506667WA (en) | 2015-09-29 |
Family
ID=51388548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201506667WA SG11201506667WA (en) | 2013-02-28 | 2014-02-14 | A system and method for performing a wet etching process |
Country Status (7)
Country | Link |
---|---|
US (1) | US9698062B2 (en) |
JP (2) | JP2016515300A (en) |
KR (1) | KR20150122661A (en) |
CN (1) | CN105209402B (en) |
SG (1) | SG11201506667WA (en) |
TW (1) | TWI613719B (en) |
WO (1) | WO2014133792A1 (en) |
Families Citing this family (43)
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US9079210B2 (en) * | 2013-07-22 | 2015-07-14 | Infineon Technologies Ag | Methods for etching a workpiece, an apparatus configured to etch a workpiece, and a non-transitory computer readable medium |
US10504758B2 (en) * | 2014-02-14 | 2019-12-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Nozzle having real time inspection functions |
KR20160045299A (en) * | 2014-10-17 | 2016-04-27 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus, linked processing system and substrate processing method |
TWI697593B (en) * | 2014-10-31 | 2020-07-01 | 美商維克儀器公司 | A system and method for performing a wet etching process |
US9870928B2 (en) * | 2014-10-31 | 2018-01-16 | Veeco Precision Surface Processing Llc | System and method for updating an arm scan profile through a graphical user interface |
AT518466A3 (en) * | 2014-10-31 | 2019-07-15 | Veeco Precision Surface Proc Llc | System and method for performing a wet etching process |
KR20160101760A (en) * | 2015-02-17 | 2016-08-26 | 주식회사 엠엠테크 | apparatus for slimming glass |
US20170221783A1 (en) * | 2016-01-28 | 2017-08-03 | Leonard TEDESCHI | Self-aware production wafers |
US10443943B2 (en) | 2016-03-29 | 2019-10-15 | Veeco Precision Surface Processing Llc | Apparatus and method to control properties of fluid discharge via refrigerative exhaust |
TWI738757B (en) * | 2016-04-05 | 2021-09-11 | 美商維克儀器公司 | An apparatus and method to control etch rate through adaptive spiking of chemistry |
WO2017192994A1 (en) * | 2016-05-06 | 2017-11-09 | Applied Materials, Inc. | Wafer profiling for etching system |
US10250258B2 (en) * | 2016-09-28 | 2019-04-02 | Nxp B.V. | Device and method for detecting semiconductor substrate thickness |
JP6673173B2 (en) * | 2016-12-12 | 2020-03-25 | 三菱電機株式会社 | Method for manufacturing semiconductor device |
WO2018160461A1 (en) * | 2017-03-03 | 2018-09-07 | Veeco Precision Surface Processing Llc | An apparatus and method for wafer thinning in advanced packaging applications |
KR101977386B1 (en) * | 2017-06-30 | 2019-05-13 | 무진전자 주식회사 | Apparatus for etching wafer and method for using the same |
CN107369638B (en) * | 2017-07-12 | 2020-11-27 | 上海华力微电子有限公司 | Etching control system, control method thereof and etching machine |
US10049904B1 (en) * | 2017-08-03 | 2018-08-14 | Applied Materials, Inc. | Method and system for moving a substrate |
JP6525044B1 (en) * | 2017-12-13 | 2019-06-05 | オムロン株式会社 | Monitoring system, learning apparatus, learning method, monitoring apparatus and monitoring method |
CN108220962A (en) * | 2017-12-29 | 2018-06-29 | 深圳市华星光电技术有限公司 | Control the device and method of wet etching terminal |
US11398379B2 (en) * | 2018-03-20 | 2022-07-26 | Tokyo Electron Limited | Platform and method of operating for integrated end-to-end self-aligned multi-patterning process |
TW202000993A (en) | 2018-06-20 | 2020-01-01 | 美商維克精密表面處理股份有限公司 | An apparatus and method for the minimization of undercut during a UBM etch process |
US11069583B2 (en) | 2018-06-20 | 2021-07-20 | Veeco Instruments Inc. | Apparatus and method for the minimization of undercut during a UBM etch process |
JP7184547B2 (en) * | 2018-06-27 | 2022-12-06 | 株式会社Screenホールディングス | Correction method, substrate processing apparatus, and substrate processing system |
KR102304793B1 (en) | 2018-11-08 | 2021-09-27 | 한양대학교 산학협력단 | Manufacturing method of two-terminal thyristor memory device |
CN109891566B (en) * | 2019-01-29 | 2021-01-29 | 长江存储科技有限责任公司 | Intelligent customizable wet processing system |
JP7166966B2 (en) * | 2019-03-15 | 2022-11-08 | 株式会社Screenホールディングス | Processing condition selection method, substrate processing method, substrate product manufacturing method, processing condition selection device, computer program, and storage medium |
JP7036085B2 (en) * | 2019-04-17 | 2022-03-15 | 信越半導体株式会社 | Etching method for silicon wafer |
TWI704093B (en) * | 2019-05-09 | 2020-09-11 | 辛耘企業股份有限公司 | Treatment liquid container |
CN110349856B (en) * | 2019-06-28 | 2021-04-27 | Tcl华星光电技术有限公司 | Wet etching method and apparatus |
KR102705854B1 (en) * | 2019-07-23 | 2024-09-11 | 에스케이하이닉스 주식회사 | Analyzing System for Semiconductor Device and Method of Analyzing the Semiconductor Device |
JP7296300B2 (en) * | 2019-10-29 | 2023-06-22 | 倉敷紡績株式会社 | Substrate etching method |
WO2021096712A1 (en) * | 2019-11-15 | 2021-05-20 | Veeco Instruments Inc. | An apparatus and method for the minimization of undercut during a ubm etch process |
JP7448673B2 (en) * | 2020-02-18 | 2024-03-12 | ポスコホールディングス インコーポレーティッド | Process control system and its operating method |
TWI770785B (en) * | 2021-01-22 | 2022-07-11 | 南亞科技股份有限公司 | Semiconductor manufacturing system, measuring device and semiconductor manufacturing method |
CN113050564B (en) * | 2021-03-12 | 2022-04-26 | 中国科学院近代物理研究所 | Nuclear track membrane etching line self-feedback linkage production control device |
US12004307B2 (en) | 2021-06-09 | 2024-06-04 | International Business Machines Corporation | Short or near short etch rework |
CN114063479B (en) * | 2021-11-12 | 2024-01-23 | 华科电子股份有限公司 | Radio frequency power supply control method and system applied to multi-output module of etching machine |
DE102021131839B4 (en) * | 2021-12-02 | 2023-11-23 | Hueck Rheinische Gmbh | Method for producing a pressing tool with deep structuring |
CN114628268B (en) * | 2022-05-12 | 2022-07-29 | 广东气派科技有限公司 | Overtime-proof chip product corrosion ball inspection process |
CN116504682B (en) * | 2023-06-20 | 2024-04-02 | 深圳市鲁光电子科技有限公司 | Etching device for silicon carbide MOSFET preparation |
CN116666198B (en) * | 2023-07-26 | 2024-01-12 | 恒超源洗净科技(深圳)有限公司 | Full-automatic ultrasonic cleaning method and system for semiconductor device |
CN117174621B (en) * | 2023-10-30 | 2023-12-26 | 江苏卓玉智能科技有限公司 | Flow control method and system for wafer etching process |
CN118486616B (en) * | 2024-07-11 | 2024-09-27 | 江苏浦丹光电技术有限公司 | Etching device for processing optical modulator chip |
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JPS5846643A (en) * | 1981-09-12 | 1983-03-18 | Mitsubishi Electric Corp | Treating method for wafer |
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TW380284B (en) * | 1998-09-09 | 2000-01-21 | Promos Technologies Inc | Method for improving etching uniformity during a wet etching process |
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JP2004335923A (en) * | 2003-05-12 | 2004-11-25 | Sony Corp | Etching method and etching device |
CN1842900A (en) * | 2003-07-31 | 2006-10-04 | Fsi国际公司 | Controlled growth of highly uniform, oxide layers, especially ultrathin layers |
DE102004054566B4 (en) * | 2004-11-11 | 2008-04-30 | Siltronic Ag | Method and device for leveling a semiconductor wafer and semiconductor wafer with improved flatness |
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JP2008177329A (en) * | 2007-01-18 | 2008-07-31 | Mitsubishi Electric Corp | Wet etching method |
EP2229243A4 (en) | 2007-12-07 | 2012-11-21 | Fontana Technology | Method and composition for cleaning wafers |
US7972969B2 (en) * | 2008-03-06 | 2011-07-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for thinning a substrate |
JP5458525B2 (en) * | 2008-08-05 | 2014-04-02 | 株式会社Sumco | Manufacturing method of SOI wafer |
US8691664B2 (en) * | 2009-04-20 | 2014-04-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Backside process for a substrate |
JP2011071415A (en) * | 2009-09-28 | 2011-04-07 | Covalent Materials Corp | Method of manufacturing silicon wafer |
GB2478590A (en) * | 2010-03-12 | 2011-09-14 | Precitec Optronik Gmbh | Apparatus and method for monitoring a thickness of a silicon wafer |
KR101233687B1 (en) * | 2010-10-28 | 2013-02-15 | 삼성디스플레이 주식회사 | Apparatus of etching a glass substrate |
US8455984B2 (en) * | 2010-11-15 | 2013-06-04 | Nanya Technology Corp. | Integrated circuit structure and method of forming the same |
US20120285483A1 (en) * | 2011-05-12 | 2012-11-15 | Li-Chung Liu | Method of cleaning a wafer |
CN102923962B (en) * | 2012-10-26 | 2015-06-17 | 航天科工惯性技术有限公司 | Method for etching pendulous reed level bridge of accelerometer |
-
2013
- 2013-02-28 US US13/780,657 patent/US9698062B2/en active Active
-
2014
- 2014-02-14 CN CN201480013838.2A patent/CN105209402B/en not_active Expired - Fee Related
- 2014-02-14 SG SG11201506667WA patent/SG11201506667WA/en unknown
- 2014-02-14 KR KR1020157023130A patent/KR20150122661A/en not_active Application Discontinuation
- 2014-02-14 WO PCT/US2014/016479 patent/WO2014133792A1/en active Application Filing
- 2014-02-14 JP JP2015560205A patent/JP2016515300A/en active Pending
- 2014-02-18 TW TW103105331A patent/TWI613719B/en active
-
2019
- 2019-04-26 JP JP2019085304A patent/JP2019153803A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN105209402A (en) | 2015-12-30 |
TWI613719B (en) | 2018-02-01 |
JP2016515300A (en) | 2016-05-26 |
KR20150122661A (en) | 2015-11-02 |
US9698062B2 (en) | 2017-07-04 |
CN105209402B (en) | 2018-07-24 |
US20140242731A1 (en) | 2014-08-28 |
TW201501192A (en) | 2015-01-01 |
WO2014133792A1 (en) | 2014-09-04 |
JP2019153803A (en) | 2019-09-12 |
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