SG11201506667WA - A system and method for performing a wet etching process - Google Patents

A system and method for performing a wet etching process

Info

Publication number
SG11201506667WA
SG11201506667WA SG11201506667WA SG11201506667WA SG11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA SG 11201506667W A SG11201506667W A SG 11201506667WA
Authority
SG
Singapore
Prior art keywords
etching process
wet etching
wet
etching
Prior art date
Application number
SG11201506667WA
Inventor
Laura Mauer
Elena Lawrence
John Taddei
Ramey Youssef
Original Assignee
Veeco Prec Surface Proc Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Prec Surface Proc Llc filed Critical Veeco Prec Surface Proc Llc
Publication of SG11201506667WA publication Critical patent/SG11201506667WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Architecture (AREA)
  • Software Systems (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
SG11201506667WA 2013-02-28 2014-02-14 A system and method for performing a wet etching process SG11201506667WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/780,657 US9698062B2 (en) 2013-02-28 2013-02-28 System and method for performing a wet etching process
PCT/US2014/016479 WO2014133792A1 (en) 2013-02-28 2014-02-14 A system and method for performing a wet etching process

Publications (1)

Publication Number Publication Date
SG11201506667WA true SG11201506667WA (en) 2015-09-29

Family

ID=51388548

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201506667WA SG11201506667WA (en) 2013-02-28 2014-02-14 A system and method for performing a wet etching process

Country Status (7)

Country Link
US (1) US9698062B2 (en)
JP (2) JP2016515300A (en)
KR (1) KR20150122661A (en)
CN (1) CN105209402B (en)
SG (1) SG11201506667WA (en)
TW (1) TWI613719B (en)
WO (1) WO2014133792A1 (en)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9079210B2 (en) * 2013-07-22 2015-07-14 Infineon Technologies Ag Methods for etching a workpiece, an apparatus configured to etch a workpiece, and a non-transitory computer readable medium
US10504758B2 (en) * 2014-02-14 2019-12-10 Taiwan Semiconductor Manufacturing Company Ltd. Nozzle having real time inspection functions
KR20160045299A (en) * 2014-10-17 2016-04-27 도쿄엘렉트론가부시키가이샤 Substrate processing apparatus, linked processing system and substrate processing method
TWI697593B (en) * 2014-10-31 2020-07-01 美商維克儀器公司 A system and method for performing a wet etching process
US9870928B2 (en) * 2014-10-31 2018-01-16 Veeco Precision Surface Processing Llc System and method for updating an arm scan profile through a graphical user interface
AT518466A3 (en) * 2014-10-31 2019-07-15 Veeco Precision Surface Proc Llc System and method for performing a wet etching process
KR20160101760A (en) * 2015-02-17 2016-08-26 주식회사 엠엠테크 apparatus for slimming glass
US20170221783A1 (en) * 2016-01-28 2017-08-03 Leonard TEDESCHI Self-aware production wafers
US10443943B2 (en) 2016-03-29 2019-10-15 Veeco Precision Surface Processing Llc Apparatus and method to control properties of fluid discharge via refrigerative exhaust
TWI738757B (en) * 2016-04-05 2021-09-11 美商維克儀器公司 An apparatus and method to control etch rate through adaptive spiking of chemistry
WO2017192994A1 (en) * 2016-05-06 2017-11-09 Applied Materials, Inc. Wafer profiling for etching system
US10250258B2 (en) * 2016-09-28 2019-04-02 Nxp B.V. Device and method for detecting semiconductor substrate thickness
JP6673173B2 (en) * 2016-12-12 2020-03-25 三菱電機株式会社 Method for manufacturing semiconductor device
WO2018160461A1 (en) * 2017-03-03 2018-09-07 Veeco Precision Surface Processing Llc An apparatus and method for wafer thinning in advanced packaging applications
KR101977386B1 (en) * 2017-06-30 2019-05-13 무진전자 주식회사 Apparatus for etching wafer and method for using the same
CN107369638B (en) * 2017-07-12 2020-11-27 上海华力微电子有限公司 Etching control system, control method thereof and etching machine
US10049904B1 (en) * 2017-08-03 2018-08-14 Applied Materials, Inc. Method and system for moving a substrate
JP6525044B1 (en) * 2017-12-13 2019-06-05 オムロン株式会社 Monitoring system, learning apparatus, learning method, monitoring apparatus and monitoring method
CN108220962A (en) * 2017-12-29 2018-06-29 深圳市华星光电技术有限公司 Control the device and method of wet etching terminal
US11398379B2 (en) * 2018-03-20 2022-07-26 Tokyo Electron Limited Platform and method of operating for integrated end-to-end self-aligned multi-patterning process
TW202000993A (en) 2018-06-20 2020-01-01 美商維克精密表面處理股份有限公司 An apparatus and method for the minimization of undercut during a UBM etch process
US11069583B2 (en) 2018-06-20 2021-07-20 Veeco Instruments Inc. Apparatus and method for the minimization of undercut during a UBM etch process
JP7184547B2 (en) * 2018-06-27 2022-12-06 株式会社Ｓｃｒｅｅｎホールディングス Correction method, substrate processing apparatus, and substrate processing system
KR102304793B1 (en) 2018-11-08 2021-09-27 한양대학교 산학협력단 Manufacturing method of two-terminal thyristor memory device
CN109891566B (en) * 2019-01-29 2021-01-29 长江存储科技有限责任公司 Intelligent customizable wet processing system
JP7166966B2 (en) * 2019-03-15 2022-11-08 株式会社Ｓｃｒｅｅｎホールディングス Processing condition selection method, substrate processing method, substrate product manufacturing method, processing condition selection device, computer program, and storage medium
JP7036085B2 (en) * 2019-04-17 2022-03-15 信越半導体株式会社 Etching method for silicon wafer
TWI704093B (en) * 2019-05-09 2020-09-11 辛耘企業股份有限公司 Treatment liquid container
CN110349856B (en) * 2019-06-28 2021-04-27 Tcl华星光电技术有限公司 Wet etching method and apparatus
KR102705854B1 (en) * 2019-07-23 2024-09-11 에스케이하이닉스 주식회사 Analyzing System for Semiconductor Device and Method of Analyzing the Semiconductor Device
JP7296300B2 (en) * 2019-10-29 2023-06-22 倉敷紡績株式会社 Substrate etching method
WO2021096712A1 (en) * 2019-11-15 2021-05-20 Veeco Instruments Inc. An apparatus and method for the minimization of undercut during a ubm etch process
JP7448673B2 (en) * 2020-02-18 2024-03-12 ポスコホールディングス インコーポレーティッド Process control system and its operating method
TWI770785B (en) * 2021-01-22 2022-07-11 南亞科技股份有限公司 Semiconductor manufacturing system, measuring device and semiconductor manufacturing method
CN113050564B (en) * 2021-03-12 2022-04-26 中国科学院近代物理研究所 Nuclear track membrane etching line self-feedback linkage production control device
US12004307B2 (en) 2021-06-09 2024-06-04 International Business Machines Corporation Short or near short etch rework
CN114063479B (en) * 2021-11-12 2024-01-23 华科电子股份有限公司 Radio frequency power supply control method and system applied to multi-output module of etching machine
DE102021131839B4 (en) * 2021-12-02 2023-11-23 Hueck Rheinische Gmbh Method for producing a pressing tool with deep structuring
CN114628268B (en) * 2022-05-12 2022-07-29 广东气派科技有限公司 Overtime-proof chip product corrosion ball inspection process
CN116504682B (en) * 2023-06-20 2024-04-02 深圳市鲁光电子科技有限公司 Etching device for silicon carbide MOSFET preparation
CN116666198B (en) * 2023-07-26 2024-01-12 恒超源洗净科技(深圳)有限公司 Full-automatic ultrasonic cleaning method and system for semiconductor device
CN117174621B (en) * 2023-10-30 2023-12-26 江苏卓玉智能科技有限公司 Flow control method and system for wafer etching process
CN118486616B (en) * 2024-07-11 2024-09-27 江苏浦丹光电技术有限公司 Etching device for processing optical modulator chip

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846643A (en) * 1981-09-12 1983-03-18 Mitsubishi Electric Corp Treating method for wafer
JPH07145484A (en) * 1993-11-19 1995-06-06 Ebara Corp Production of silicon dioxide film and device therefor
JPH11220005A (en) * 1997-11-26 1999-08-10 Dainippon Screen Mfg Co Ltd Wafer processing system
JPH11251289A (en) * 1998-02-27 1999-09-17 Dainippon Screen Mfg Co Ltd Apparatus and method for treating substrate
TW380284B (en) * 1998-09-09 2000-01-21 Promos Technologies Inc Method for improving etching uniformity during a wet etching process
JP2002134466A (en) * 2000-10-25 2002-05-10 Sony Corp Method of manufacturing semiconductor device
US20060191637A1 (en) * 2001-06-21 2006-08-31 John Zajac Etching Apparatus and Process with Thickness and Uniformity Control
US20030084918A1 (en) * 2001-11-07 2003-05-08 Kim Yong Bae Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes
US7128803B2 (en) * 2002-06-28 2006-10-31 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools
JP2004335923A (en) * 2003-05-12 2004-11-25 Sony Corp Etching method and etching device
CN1842900A (en) * 2003-07-31 2006-10-04 Fsi国际公司 Controlled growth of highly uniform, oxide layers, especially ultrathin layers
DE102004054566B4 (en) * 2004-11-11 2008-04-30 Siltronic Ag Method and device for leveling a semiconductor wafer and semiconductor wafer with improved flatness
US8882787B2 (en) * 2005-03-02 2014-11-11 St. Jude Medical, Cardiology Division, Inc. Tissue anchor apparatus
US20070122920A1 (en) 2005-11-29 2007-05-31 Bornstein William B Method for improved control of critical dimensions of etched structures on semiconductor wafers
JP4921913B2 (en) * 2006-10-02 2012-04-25 株式会社東芝 Substrate cleaning method
JP2008177329A (en) * 2007-01-18 2008-07-31 Mitsubishi Electric Corp Wet etching method
EP2229243A4 (en) 2007-12-07 2012-11-21 Fontana Technology Method and composition for cleaning wafers
US7972969B2 (en) * 2008-03-06 2011-07-05 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for thinning a substrate
JP5458525B2 (en) * 2008-08-05 2014-04-02 株式会社Ｓｕｍｃｏ Manufacturing method of SOI wafer
US8691664B2 (en) * 2009-04-20 2014-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Backside process for a substrate
JP2011071415A (en) * 2009-09-28 2011-04-07 Covalent Materials Corp Method of manufacturing silicon wafer
GB2478590A (en) * 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
KR101233687B1 (en) * 2010-10-28 2013-02-15 삼성디스플레이 주식회사 Apparatus of etching a glass substrate
US8455984B2 (en) * 2010-11-15 2013-06-04 Nanya Technology Corp. Integrated circuit structure and method of forming the same
US20120285483A1 (en) * 2011-05-12 2012-11-15 Li-Chung Liu Method of cleaning a wafer
CN102923962B (en) * 2012-10-26 2015-06-17 航天科工惯性技术有限公司 Method for etching pendulous reed level bridge of accelerometer

Also Published As

Publication number Publication date
CN105209402A (en) 2015-12-30
TWI613719B (en) 2018-02-01
JP2016515300A (en) 2016-05-26
KR20150122661A (en) 2015-11-02
US9698062B2 (en) 2017-07-04
CN105209402B (en) 2018-07-24
US20140242731A1 (en) 2014-08-28
TW201501192A (en) 2015-01-01
WO2014133792A1 (en) 2014-09-04
JP2019153803A (en) 2019-09-12

Similar Documents

Publication Publication Date Title
SG11201506667WA (en) A system and method for performing a wet etching process
KR102246213B9 (en) Processing system and method for providing a heated etching solution
IL246391A0 (en) System and method for a nail manipulation
IL314772A (en) A system and method for dialog
ZA201507835B (en) A method and apparatus for identifying and communicating locations
EP2959413A4 (en) Compliance method for a cyber- physical system
GB201320145D0 (en) Localised RCA-based amplification method using a padlock-probe
GB201316102D0 (en) A method and apparatus
SG11201507057TA (en) A system and a process for water descaling
GB201306835D0 (en) Method and system for creating a unique identifier
HK1221536A1 (en) Method and system for recognizing faces
PL2953728T4 (en) Method for operating a surface treatment system
PT3068505T (en) A gaming system and method
SG11201601261SA (en) Etching method
TWI562952B (en) Method and apparatus for manufacturing sheet
SG11201600696PA (en) Etching method
PL3071918T3 (en) Method for direction limitation and system for direction limitation
EP3051435A4 (en) Method and system for obtaining a knowledge point implicit relationship
SG2013072152A (en) A method and device for executing an enterprise process
GB201311786D0 (en) Method and apparatus for performing a FFT computation
GB201306765D0 (en) Method and apparatus for manufacturing a can end
AP2016009314A0 (en) Pattern recognition system and method
HUE042526T2 (en) System and method for operating a system
SG11201506582TA (en) System and process for making cyclohexylbenzene
GB201316429D0 (en) A system and method for co-ordering