JP4921913B2 - Substrate cleaning method - Google Patents

Description

  The present invention relates to a substrate cleaning method, and more particularly to a substrate cleaning method before or after exposure by an immersion exposure apparatus in a lithography process of a semiconductor device manufacturing process.

  By exposure of a fine pattern using an immersion exposure apparatus in semiconductor lithography technology, the front and back surfaces of the substrate to be processed may be wetted by the immersion liquid. When the substrate surface is wet, if there is no step of removing water droplets on the substrate surface, the water droplets are dried on the substrate surface, and a water droplet drying trace (watermark) remains on the substrate surface.

  FIGS. 9A and 9B are cross-sectional views of a manufacturing process of a semiconductor device according to a conventional example. In the lithography process, an antireflection film 92, a resist 93, and an immersion protection film 94 are applied on the substrate surface in the order of proximity to the substrate 91 as shown in FIG. In some cases, a transfer film 95, an SOG (Spin On Glass) film 96, a resist 93, and an immersion protection film 94 are applied in the order closer to the substrate 91 as shown in FIG.

  However, in FIGS. 9A and 9B, when the residual water droplet 97 on the immersion protection film 94 is dried, the water droplet 97 passes through the immersion protection film 94 and reaches the resist 93. The water droplets reaching the resist 93 disturb the distribution of the acid generator and Quencher film in the resist 93, and undergo a post exposure bake (post exposure bake: PEB) process, an immersion protective film peeling process, and a developing process. When a pattern is formed, there are cases where the pattern dimension deviates from a desired dimension, the cross-sectional shape becomes a saddle shape, or the pattern is not formed at all in the range of the water droplet trace. Thereby, the yield in manufacturing the semiconductor device is greatly deteriorated.

  In addition, when the back surface of the substrate is wet, dirt on the back surface, edge, and bevel portion of the substrate travels through the water droplets, and contaminants adhere to the baker in the PEB process, which accumulates due to an increase in the number of substrates to be processed. Defects may be generated by the contaminants adhering to the surface of another substrate, which may reduce the yield.

  Therefore, in order to improve the yield in the lithography process using immersion exposure, it is necessary to clean the front and back surfaces of the substrate after the immersion exposure to remove water droplets and contaminants on the front and back surfaces of the substrate.

  As a technique for cleaning a substrate in the manufacturing process of a semiconductor device, there is a cleaning device in a semiconductor front-end process, but since a cleaning unit of the cleaning device is large and expensive, it can be mounted on a conventional exposure apparatus or coating and developing apparatus. Have difficulty. Therefore, the following method is considered.

  FIG. 10 is a view of a developing unit mounted on a conventional coating and developing apparatus as viewed from above. As shown in FIG. 10, the cleaning liquid 103 is discharged from the nozzle 102 onto the substrate 101 by using a rinsing method after development, and the cleaning liquid is scattered outside the substrate by spinning the substrate at 1000 to 2000 revolutions per second (104). The substrate is cleaned by a drying method. In this case, hundreds to thousands of minute water droplet traces remained on the front and back surfaces of the substrate, resulting in defects on the substrate, and the defects could not be reduced despite the cleaning.

  Further, in the rinsing process after development, a scan rinsing method in which the cleaning liquid is scattered from the central portion on the substrate to the outside while discharging the cleaning liquid at a constant speed is applied to the cleaning of the substrate. In the above-described method of rotating the substrate at 1000 rpm or more to disperse the cleaning liquid, hundreds to thousands of minute water droplet traces remain on the front and back surfaces of the substrate as in the case of FIG. As a result.

  Accordingly, as shown in FIG. 11, the cleaning liquid was cleaned at a rotation speed of 500 rotations or less per second so that the cleaning liquid does not scatter, but the cleaning liquid 103 discharged from the nozzle 102 stays on the rotating substrate 101 and stays on the substrate. When the staying cleaning liquid collides with the newly discharged cleaning liquid (105), the flow of the cleaning liquid is disturbed and water droplet traces remain on the substrate (106).

Patent Document 1 discloses a configuration in which the substrate surface is cleaned by scanning outward from the center of the substrate when cleaning the substrate.
JP 2004-335542 A

  An object of the present invention is to provide a substrate cleaning method capable of cleaning at low cost and without leaving water droplets on a substrate to be processed.

A substrate cleaning method according to an aspect of the present invention is a substrate cleaning method in which a cleaning liquid is discharged from a nozzle above a substrate to be processed and the substrate is cleaned while rotating the substrate, and the cleaning liquid is applied to the substrate from the nozzle. While discharging, the nozzle is scanned from the center of the substrate to the outside of the substrate, and in the substrate cleaning method for dissipating the cleaning solution to the outside of the substrate, in a state where the cleaning solution staying on the substrate exists, when the cleaning liquid discharged from the nozzle is in contact with the substrate surface, the cleaning liquid discharged from the nozzle, so as not to collide with the cleaning liquid staying on the substrate, of the cleaning solution flow rate, the substrate The number of rotations, the scanning speed of the nozzle and the scanning start position are controlled.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate cleaning method which can be wash | cleaned cheaply and easily, without leaving the water droplet on a to-be-processed substrate can be provided.

  Hereinafter, embodiments will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram illustrating a substrate cleaning method according to the first embodiment. This substrate cleaning method is performed under the control of a control device (not shown) in the substrate cleaning apparatus. As shown in FIG. 1, in a process of cleaning a substrate 11 to be processed such as a semiconductor wafer, a cleaning liquid 13 is discharged from a nozzle 12 above the substrate to be processed 11, and the substrate 11 is cleaned and dried while rotating the substrate 11.

  In this step, as shown in FIG. 2, while discharging the cleaning liquid 13 from the nozzle 12 to the substrate 11, the nozzle 12 is scanned from the center of the substrate to the outside of the substrate, and the cleaning liquid 13 is absorbed while adsorbing the residual water droplets 14 on the substrate. Dissipate outside the substrate 11. As a result, the substrate 11 is washed and dried without leaving water droplets on the substrate 11.

  Here, when the cleaning liquid 13 discharged from the nozzle 12 dissipates while moving on the substrate 11 in accordance with the rotation of the substrate 11, the cleaning liquid 13 staying on the rotating substrate 11 collides with the cleaning liquid 13 discharged from the nozzle 12. In order to avoid this, the flow rate of the cleaning liquid 13, the number of rotations of the substrate 11, the scan (scanning) speed of the nozzle 12 and the scan start position are controlled. As a result, the substrate 11 is washed and dried without leaving water droplets on the substrate 11.

  First, in a lithography process for forming a fine pattern in a semiconductor device manufacturing process, an anti-reflection film ARC29A (Nissan Chemical Co., Ltd.) is applied to a substrate to be processed with a coating and developing apparatus at a thickness of 77 nm and baked at 205 ° C. for 60 seconds. And the substrate was cooled. Thereafter, a resist AR2014J (manufactured by JSR) was applied at a thickness of 150 nm, baked at 115 ° C. for 60 seconds, and the substrate was cooled. Then, a protective film TCX015 (manufactured by JSR) was applied at a thickness of 90 nm and at 90 ° C. Bake for 60 seconds. This substrate was transported to an ArF immersion exposure apparatus connected inline with the coating and developing apparatus via an interface unit, and immersion exposure was performed.

  After immersion exposure, five water droplets with a diameter of 0.5 mm and one water droplet with a diameter of 1 mm remain on the surface of the substrate, and two water droplets with a diameter of 2 mm on the back surface of the substrate at a position 2 mm from the outer periphery of the substrate. Three 1 mm water droplets remained at a position 1 mm from the outer periphery of the substrate. This substrate was transported to a cleaning unit installed in the coating and developing apparatus within 90 seconds until water droplets on the front and back surfaces of the substrate did not dry out and disappear.

  When the static contact angle of the protective film is 78 degrees, the cleaning liquid is ultrapure water, and the flow rate of the cleaning liquid is set to 0.5 L / min, the cleaning liquid discharged from the nozzle causes a water jump phenomenon on the substrate. Since the radius of the region causing the water jump phenomenon (water jump radius) is 8 mm, the scan start position Rs0 of the nozzle is a position 5 mm from the center represented by a relationship proportional to the water jump radius Rj (Rs0∝Rj). To do.

  The nozzle scan speed Vs is expressed by a proportional relationship (Vs∝Rj × nrev) of the product of the water jump radius Rj and the rotation speed nrev per unit time of the wafer (substrate), and when the rotation speed of the substrate is 100 rpm. The substrate surface may be cleaned while scanning the nozzle at a constant speed with Vs = 8.3 mm / sec. In this case, the cleaning liquid was scattered to the outside of the substrate along a locus (31) as shown in FIG. In this step, cleaning and drying were performed with no water mark on the substrate surface.

  Each parameter in this case is determined as follows. The relationship between the water jump radius Rj (= Rj (Q)) and the flow rate Q is as shown in FIG. 4, and the water jump radius Rj is almost equal to the flow rate Q when not discharged to the center of the rotating substrate as in this embodiment. Do not depend. Further, as shown in FIG. 5, the water jump radius Rj is determined almost regardless of the rotation speed nrev, and as shown in FIG. 6, the scan initial position Rs0 and the water jump radius Rj are in a relationship of Rs0 = βRj (β˜1). have.

  The scan speed Vs is determined as follows. As shown in FIG. 7, it is necessary to increase the scanning speed Vs when the rotation speed nrev of the substrate is high, and it is necessary to decrease the scanning speed Vs when the rotation speed nrev is low.

  Next, the cleaning of the back surface of the substrate was performed simultaneously with the cleaning of the substrate surface by discharging the cleaning liquid from the back surface cleaning nozzle installed at a position 30 mm from the outer periphery of the substrate toward the back surface of the substrate at a flow rate of 0.5 L / min. .

  All the water droplets present on the back surface of the substrate were removed by the main cleaning, and the substrate was transported to the PEB process with no contamination on the back surface. In the PEB process, after baking at 115 ° C. for 60 seconds, the substrate was cooled and transported to the development process. In the developing step, 2.38 wt% tetramethylammonium hydroxide aqueous solution (TMAH) was used as a developing solution and developed for 60 seconds. Through the above process, a 55 nm line & space pattern was formed without defects.

  In the first embodiment, the cleaning of the substrate after the immersion exposure in the lithography process in the manufacturing process of the semiconductor device has been described. However, the cleaning is not limited to the cleaning after the exposure or the lithography process.

(Second Embodiment)
In the second embodiment, the same material as that in the first embodiment is laminated and formed on the same substrate, and immersion exposure is performed using an ArF immersion exposure apparatus.

  After immersion exposure, water droplets remained on the front and back surfaces of the substrate as in the first embodiment. Since the same protective film as that of the first embodiment is formed by coating, the static contact angle of the protective film is 78 degrees, the cleaning liquid is ultrapure water, and the flow rate of the cleaning liquid is 0.25 L / min. Since the water jump radius is 6 mm, the scan start position Rs0 is set to a position 4 mm from the center, which is a position expressed by a relationship proportional to the water jump radius Rj (Rs0∝Rj).

  The scan speed Vs is expressed by a proportional relationship (Vs∝Rj × nrev) with the product of the water jump radius Rj and the wafer rotation speed nrev. The substrate surface may be cleaned while scanning the nozzle. In this case, the cleaning liquid was scattered on the outside of the substrate along a locus (81) as shown in FIG. In this step, cleaning and drying were performed with no water mark on the substrate surface.

  Next, in the cleaning of the back surface of the substrate, the cleaning liquid is discharged toward the back surface of the substrate at a flow rate of 0.5 L / min from the nozzle for back surface cleaning disposed at a position of 30 mm from the outer periphery of the substrate as in the first embodiment. The substrate surface was cleaned at the same time.

  All water droplets present on the backside of the substrate are removed by this cleaning, and the substrate is transferred to the PEB process with no contamination on the backside. Through the same process as in the first embodiment, a 55 nm line & space pattern is formed. It was formed without defects.

(Third embodiment)
In the first embodiment, the cleaning process is performed after the immersion exposure. In the third embodiment, a method for performing the cleaning process before the immersion exposure will be described.

  Similarly to the first embodiment, an antireflection film ARC29A (Nissan Chemical Co., Ltd.) was applied to a substrate to be processed with a thickness of 80 nm by a coating and developing apparatus, baked at 205 ° C. for 60 seconds, and the substrate was cooled. Thereafter, a resist AR2014J (manufactured by JSR) was applied at a thickness of 150 nm, baked at 115 ° C. for 60 seconds, and the substrate was cooled. Then, a protective film TCX026 (manufactured by JSR) was applied at a thickness of 90 nm and at 90 ° C. Bake for 60 seconds. This board | substrate was conveyed to the washing | cleaning unit.

  Since a protective film similar to that of the first embodiment is applied and formed, when the static contact angle of the protective film is 78 degrees, the cleaning liquid is ultrapure water, and the flow rate of the cleaning liquid is set to 0.5 L / min. The cleaning liquid discharged from the nozzle causes a water jump phenomenon on the substrate. Since the radius of the region in which the water jump phenomenon occurs (the water jump radius) is 8 mm, the scan start position Rs0 is a position that is a position expressed by a relationship proportional to the water jump radius Rj (Rs0∝Rj) and a position 5 mm from the center. To do.

  The scanning speed Vs is expressed by a proportional relationship (Vs∝Rj × nrev) with the product of the water jump radius Rj and the wafer rotation speed nrev. When the rotation speed of the substrate is 150 rpm, Vs = 12.45 mm / sec, The substrate surface may be cleaned while scanning the nozzle at high speed. In this case, the cleaning liquid was scattered to the outside of the substrate along a locus (31) as shown in FIG.

  By performing the main cleaning, contamination from the baker can be prevented. That is, although the sublimation product when the protective film is baked by the baking process adheres to the baker, it is scattered on the protective film and adheres to the substrate surface, but contamination from the baker can be prevented.

  The substrate is transported to an ArF immersion exposure apparatus connected in-line with the coating and developing apparatus via an interface unit, subjected to immersion exposure, and cleaned after immersion exposure as in the first embodiment. Washing and drying were performed with no traces of water droplets on the front and back surfaces. Subsequently, a PEB process, a protective film peeling, and a development process were performed to form a 55 nm line & space pattern without defects.

  In the present embodiment, the case where there is an immersion protective film has been described, but there may be a case where there is no protective film and the outermost surface at the time of immersion exposure is a resist. In this case, the contamination that can be removed by washing with water is that the resist sublimate in the baking process adheres to the baker, scatters on the resist, and adheres to the substrate surface.

(Fourth embodiment)
The fourth embodiment has the same configuration as that of the first embodiment, but the nozzle scan speed Vs is represented by a proportional relationship (Vs∝ωnz) with the angular velocity ωnz of the substrate at the nozzle position. This is a method of cleaning while accelerating toward the outer periphery of the substrate.

  If the static contact angle of the protective film is 78 degrees, the cleaning liquid is ultrapure water, and the flow rate of the cleaning liquid is set to 0.5 L / min, the jumping radius of the cleaning liquid discharged from the nozzle is 8 mm, so the scan start position Rs0 Is a position 5 mm from the center represented by the proportionality (Rs0∝Rj) with the water jump radius Rj.

  The nozzle scanning speed Vs starts at Vs = 20 mm / sec at an angular speed of 30 mm from the outer periphery of the substrate, and the substrate surface may be cleaned while accelerating the nozzle scanning speed. In this case, the cleaning liquid was scattered to the outside of the substrate along a locus (31) as shown in FIG.

  In addition, this invention is not limited only to said each embodiment, In the range which does not change a summary, it can deform | transform suitably and can implement.

The figure which shows the board | substrate cleaning method which concerns on 1st Embodiment. The figure which shows the board | substrate cleaning method which concerns on 1st Embodiment. The figure which shows the locus | trajectory of the washing | cleaning liquid which concerns on 1st Embodiment. The figure which shows the relationship between the jump radius and flow volume which concern on 1st Embodiment. The figure which shows the relationship between the water jump radius and rotation speed which concern on 1st Embodiment. The figure which shows the relationship between the scan initial position which concerns on 1st Embodiment, and a water jump radius. The figure which shows the relationship between the scanning speed and rotation speed which concern on 1st Embodiment. The figure which shows the locus | trajectory of the washing | cleaning liquid which concerns on 1st Embodiment. Sectional drawing of the manufacturing process of the semiconductor device which concerns on a prior art example. The figure which looked at the image development unit mounted in the coating and developing apparatus which concerns on a prior art example from the upper direction. The figure which looked at the image development unit mounted in the coating and developing apparatus which concerns on a prior art example from the upper direction.

Explanation of symbols

  11 ... Substrate to be treated 12 ... Nozzle 13 ... Cleaning solution 14 ... Residual water droplets

Claims (5)

A substrate cleaning method for discharging a cleaning liquid from a nozzle above a substrate to be processed and cleaning the substrate while rotating the substrate, and discharging the cleaning liquid from the nozzle to the substrate while the nozzle is positioned at the center of the substrate. In the substrate cleaning method of scanning from the outside of the substrate to dissipate the cleaning liquid to the outside of the substrate,
The cleaning liquid discharged from the nozzle stays on the substrate when the cleaning liquid discharged from the nozzle comes into contact with the substrate surface in a state where the cleaning liquid stays on the substrate exists . said not to collide with the cleaning liquid, the flow rate of the cleaning solution, the rotational speed of the substrate, the substrate cleaning method characterized by controlling the scanning speed and the scanning start position of the nozzle.   The scanning speed of the nozzle is proportional to the product of the radius of a region where the cleaning liquid discharged from the nozzle causes a water jump phenomenon on the substrate and the number of rotations per unit time of the substrate. The substrate cleaning method according to claim 1.   The scanning start position of the nozzle is a position expressed in a proportional relationship with a radius of a region where the cleaning liquid ejected from the nozzle causes a water jump phenomenon on the substrate. Substrate cleaning method.   The substrate cleaning method according to claim 1, wherein a flow rate of the cleaning liquid is determined by a radius of a region where the cleaning liquid discharged from the nozzle causes a water jump phenomenon on the substrate.   The substrate cleaning method according to claim 1, wherein a cleaning liquid is discharged from another nozzle to the back surface of the substrate.

Images