SG11201407952SA - Wafer level integrated circuit contactor and method of construction - Google Patents

Wafer level integrated circuit contactor and method of construction

Info

Publication number
SG11201407952SA
SG11201407952SA SG11201407952SA SG11201407952SA SG11201407952SA SG 11201407952S A SG11201407952S A SG 11201407952SA SG 11201407952S A SG11201407952S A SG 11201407952SA SG 11201407952S A SG11201407952S A SG 11201407952SA SG 11201407952S A SG11201407952S A SG 11201407952SA
Authority
SG
Singapore
Prior art keywords
international
lllll
llll
wafer level
minneapolis
Prior art date
Application number
SG11201407952SA
Other languages
English (en)
Inventor
Jathan Edwards
Charles Marks
Brian Halvorson
Original Assignee
Johnstech Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnstech Int Corp filed Critical Johnstech Int Corp
Publication of SG11201407952SA publication Critical patent/SG11201407952SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201407952SA 2012-06-20 2013-06-19 Wafer level integrated circuit contactor and method of construction SG11201407952SA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261662124P 2012-06-20 2012-06-20
US201361760928P 2013-02-05 2013-02-05
PCT/US2013/046604 WO2013192322A2 (en) 2012-06-20 2013-06-19 Wafer level integrated circuit contactor and method of construction

Publications (1)

Publication Number Publication Date
SG11201407952SA true SG11201407952SA (en) 2015-01-29

Family

ID=49769686

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407952SA SG11201407952SA (en) 2012-06-20 2013-06-19 Wafer level integrated circuit contactor and method of construction

Country Status (12)

Country Link
US (2) US9261537B2 (ko)
EP (1) EP2864799B1 (ko)
JP (1) JP6175498B2 (ko)
KR (1) KR102069145B1 (ko)
CN (2) CN107271737B (ko)
HK (1) HK1207424A1 (ko)
IL (1) IL236156A0 (ko)
MY (1) MY181866A (ko)
PH (1) PH12014502745A1 (ko)
SG (1) SG11201407952SA (ko)
TW (2) TWI648542B (ko)
WO (1) WO2013192322A2 (ko)

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US9261537B2 (en) 2009-04-21 2016-02-16 Johnstech International Corporation Wafer level integrated circuit contactor and method of construction
SG10201707975VA (en) * 2013-07-11 2017-10-30 Johnstech Int Corp Testing apparatus and method for microcircuit and wafer level ic testing
TWI651539B (zh) * 2014-03-10 2019-02-21 美商瓊斯科技國際公司 晶圓級積體電路探針陣列及建構方法
US9733304B2 (en) * 2014-09-24 2017-08-15 Micron Technology, Inc. Semiconductor device test apparatuses
US10067164B2 (en) 2015-08-24 2018-09-04 Johnstech International Corporation Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings
IT201600084921A1 (it) * 2016-08-11 2018-02-11 Technoprobe Spa Sonda di contatto e relativa testa di misura di un’apparecchiatura di test di dispositivi elettronici
JP6881972B2 (ja) * 2016-12-27 2021-06-02 株式会社エンプラス 電気接触子及び電気部品用ソケット
TWI617812B (zh) * 2017-02-16 2018-03-11 豪威科技股份有限公司 用於細間距封裝測試之測試座
JP6872960B2 (ja) * 2017-04-21 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
US20190018060A1 (en) * 2017-07-17 2019-01-17 Jose E. Lopzed Self cleaning Vertical sliding Electrical Contact Device for Semiconductor contacts
SG10201807617PA (en) * 2017-09-05 2019-04-29 Tan Natali Kelvin contact finger for high current testing
US10725069B1 (en) 2017-09-19 2020-07-28 Johnstech International Corporation Integrated circuit contactor for testing ICs and method of construction
CN110018334B (zh) * 2018-01-10 2021-06-11 中华精测科技股份有限公司 探针卡装置及其矩形探针
TWI683108B (zh) * 2018-01-10 2020-01-21 中華精測科技股份有限公司 探針卡裝置及其矩形探針
WO2019190676A1 (en) * 2018-03-30 2019-10-03 Applied Materials, Inc. Integrating 3d printing into multi-process fabrication schemes
KR102025766B1 (ko) * 2018-07-06 2019-09-26 주식회사 마이크로컨텍솔루션 반도체 칩 테스트 소켓
USD942290S1 (en) 2019-07-12 2022-02-01 Johnstech International Corporation Tip for integrated circuit test pin
KR102191701B1 (ko) * 2019-08-22 2020-12-17 주식회사 이노글로벌 부분 교체가 가능한 테스트 소켓
KR102466454B1 (ko) * 2019-08-29 2022-11-14 주식회사 아이에스시 검사용 소켓
US11561243B2 (en) * 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
KR102132662B1 (ko) * 2019-09-16 2020-07-13 주식회사 마이크로컨텍솔루션 반도체 칩 테스트 소켓
KR102212872B1 (ko) * 2020-01-23 2021-02-05 (주)티에스이 신호 전송 커넥터 및 그 제조방법
KR102455150B1 (ko) * 2020-02-10 2022-10-18 주식회사 아이에스시 피검사 디바이스 검사용 테스트 소켓
TWI729822B (zh) * 2020-05-22 2021-06-01 美商第一檢測有限公司 環境控制設備及晶片測試系統
MY197431A (en) 2020-06-11 2023-06-17 Jf Microtechnology Sdn Bhd Short interconnect assembly with strip elastomer
US11674977B2 (en) 2020-06-11 2023-06-13 Jf Microtechnology Sdn. Bhd Short interconnect assembly with strip elastomer
CN112180244B (zh) * 2020-12-01 2021-02-12 四川斯艾普电子科技有限公司 一种载板式裸芯片功放模块测试装置
TWI759159B (zh) * 2021-03-26 2022-03-21 經登企業股份有限公司 磁性感測器及限位裝置
US20230184826A1 (en) * 2021-11-03 2023-06-15 Johnstech International Corporation Housing with vertical backstop

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US5098311A (en) * 1989-06-12 1992-03-24 Ohio Associated Enterprises, Inc. Hermaphroditic interconnect system
EP0462706A1 (en) * 1990-06-11 1991-12-27 ITT INDUSTRIES, INC. (a Delaware corporation) Contact assembly
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
JP2648120B2 (ja) * 1995-02-08 1997-08-27 山一電機株式会社 表面接触形接続器
US6046597A (en) 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
TW293938B (en) * 1995-11-09 1996-12-21 Formfactor Inc Probe card assembly and kit, and methods of using same
US5949244A (en) * 1996-01-03 1999-09-07 Miley; David M. Low tolerance probe card and probe ring systems
US5947749A (en) * 1996-07-02 1999-09-07 Johnstech International Corporation Electrical interconnect contact system
US6181149B1 (en) 1996-09-26 2001-01-30 Delaware Capital Formation, Inc. Grid array package test contactor
US6734690B1 (en) * 2000-04-29 2004-05-11 Hewlett-Packard Development Company, L.P. Back pressure test fixture to allow probing of integrated circuit package signals
JP3798651B2 (ja) * 2001-05-31 2006-07-19 株式会社エンプラス 電気部品用ソケット
JP4000151B2 (ja) * 2003-02-10 2007-10-31 株式会社日本マイクロニクス 電気的接続装置
US7170306B2 (en) * 2003-03-12 2007-01-30 Celerity Research, Inc. Connecting a probe card and an interposer using a compliant connector
JP2005129428A (ja) * 2003-10-27 2005-05-19 Sumitomo Electric Ind Ltd 竹の子状コンタクトの製造方法、その方法により製造されたコンタクトおよびそのコンタクトを備える検査装置または電子機器
US7176702B2 (en) * 2004-04-07 2007-02-13 Micron Technology, Inc. Contact system for wafer level testing
JP4487261B2 (ja) * 2005-09-09 2010-06-23 エルピーダメモリ株式会社 Ｉｃソケット
SG131790A1 (en) * 2005-10-14 2007-05-28 Tan Yin Leong Probe for testing integrated circuit devices
US20070103179A1 (en) * 2005-11-10 2007-05-10 Silicon Integrated Systems Corp. Socket base adaptable to a load board for testing ic
US7695286B2 (en) * 2007-09-18 2010-04-13 Delaware Capital Formation, Inc. Semiconductor electromechanical contact
US8536889B2 (en) * 2009-03-10 2013-09-17 Johnstech International Corporation Electrically conductive pins for microcircuit tester
US9261537B2 (en) 2009-04-21 2016-02-16 Johnstech International Corporation Wafer level integrated circuit contactor and method of construction
US9007082B2 (en) * 2010-09-07 2015-04-14 Johnstech International Corporation Electrically conductive pins for microcircuit tester
TWI534432B (zh) * 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳

Also Published As

Publication number Publication date
HK1207424A1 (en) 2016-01-29
PH12014502745B1 (en) 2015-02-02
KR20150040858A (ko) 2015-04-15
MY181866A (en) 2021-01-11
TW201405130A (zh) 2014-02-01
KR102069145B1 (ko) 2020-02-11
EP2864799B1 (en) 2021-04-14
US9261537B2 (en) 2016-02-16
JP6175498B2 (ja) 2017-08-09
US9817026B2 (en) 2017-11-14
EP2864799A2 (en) 2015-04-29
TW201809685A (zh) 2018-03-16
JP2015523567A (ja) 2015-08-13
TWI648542B (zh) 2019-01-21
US20160161528A1 (en) 2016-06-09
CN107271737A (zh) 2017-10-20
PH12014502745A1 (en) 2015-02-02
WO2013192322A2 (en) 2013-12-27
US20130342233A1 (en) 2013-12-26
CN107271737B (zh) 2020-01-10
EP2864799A4 (en) 2016-07-27
CN104395763A (zh) 2015-03-04
WO2013192322A3 (en) 2014-02-20
IL236156A0 (en) 2015-01-29
TWI589883B (zh) 2017-07-01
CN104395763B (zh) 2017-09-01

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