SG10201807617PA - Kelvin contact finger for high current testing - Google Patents

Kelvin contact finger for high current testing

Info

Publication number
SG10201807617PA
SG10201807617PA SG10201807617PA SG10201807617PA SG10201807617PA SG 10201807617P A SG10201807617P A SG 10201807617PA SG 10201807617P A SG10201807617P A SG 10201807617PA SG 10201807617P A SG10201807617P A SG 10201807617PA SG 10201807617P A SG10201807617P A SG 10201807617PA
Authority
SG
Singapore
Prior art keywords
contact finger
sense
pin
contact fingers
disposed
Prior art date
Application number
SG10201807617PA
Inventor
Tan Natali
Tan Melisa
Original Assignee
Tan Natali
Tan Melisa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tan Natali, Tan Melisa filed Critical Tan Natali
Publication of SG10201807617PA publication Critical patent/SG10201807617PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06783—Measuring probes containing liquids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

KELVIN CONTACT FINGER FOR HIGH-CURRENT TESTING A Kelvin socket 10 comprising a housing 1 having a recess, a plurality of socket pin slots or partitions 11 resided in the recess, and a cooling medium pass 7; a plurality of self-cooling force contact fingers 2 arranged into an array and disposed into the plurality of socket pin slots or partitions 11 of the housing 1; wherein each of the plurality of self- cooling force contact fingers 2 has a force contact finger pin 21 and a heat sink base 22 being attached to a portion away from tip of the force contact finger pin 21 for dissipating heat from the force contact finger pin 21 ; an elastomer 3 disposed on the self-cooling force contact fingers 2; a plurality of sense contact fingers 4 having a plurality of sense contact finger pins 41, and being arranged into an array; wherein each of the plurality of sense contact fingers has a sense contact finger pin 41; wherein the plurality of sense contact fingers 5 are disposed into the elastomer 3, resulting in that the plurality of sense contact finger pins 41 are arranged in adjacent parallelly to the force contact finger pins 21 ; and a cover 5 disposed upon the sense contact fingers 4. FIG 1
SG10201807617PA 2017-09-05 2018-09-05 Kelvin contact finger for high current testing SG10201807617PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201707216S 2017-09-05

Publications (1)

Publication Number Publication Date
SG10201807617PA true SG10201807617PA (en) 2019-04-29

Family

ID=65517022

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201807617PA SG10201807617PA (en) 2017-09-05 2018-09-05 Kelvin contact finger for high current testing

Country Status (2)

Country Link
US (1) US10545174B2 (en)
SG (1) SG10201807617PA (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) * 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
KR102654545B1 (en) * 2023-12-12 2024-04-04 주식회사 프로이천 Floating block

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001159641A (en) 1999-12-02 2001-06-12 Hitachi Cable Ltd Semiconductor process evaluating device
KR100678480B1 (en) 2005-07-25 2007-02-02 삼성전자주식회사 A probe card, a test apparatus having the probe card and, test method using the test apparatus
JP6092509B2 (en) 2011-10-17 2017-03-08 東京エレクトロン株式会社 Contact terminal support and probe card
MY175570A (en) 2012-03-20 2020-07-01 Jf Microtechnology Sdn Bhd Multiple rigid contact solution for ic testing
CN107271737B (en) * 2012-06-20 2020-01-10 约翰国际有限公司 Wafer level integrated circuit contactor and method of construction
US9274141B1 (en) * 2013-01-22 2016-03-01 Johnstech International Corporation Low resistance low wear test pin for test contactor
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link

Also Published As

Publication number Publication date
US20190072583A1 (en) 2019-03-07
US10545174B2 (en) 2020-01-28

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