SG11201404047QA - Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate - Google Patents

Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate

Info

Publication number
SG11201404047QA
SG11201404047QA SG11201404047QA SG11201404047QA SG11201404047QA SG 11201404047Q A SG11201404047Q A SG 11201404047QA SG 11201404047Q A SG11201404047Q A SG 11201404047QA SG 11201404047Q A SG11201404047Q A SG 11201404047QA SG 11201404047Q A SG11201404047Q A SG 11201404047QA
Authority
SG
Singapore
Prior art keywords
silicon substrate
production
polishing composition
manufacturing process
therefor
Prior art date
Application number
SG11201404047QA
Other languages
English (en)
Inventor
Shuhei Takahashi
Kohsuke Tsuchiya
Shinichiro Takami
Yoshio Mori
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG11201404047QA publication Critical patent/SG11201404047QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201404047QA 2012-01-16 2013-01-16 Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate SG11201404047QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012006371 2012-01-16
PCT/JP2013/050654 WO2013108777A1 (ja) 2012-01-16 2013-01-16 研磨用組成物、その製造方法、シリコン基板の製造方法、及びシリコン基板

Publications (1)

Publication Number Publication Date
SG11201404047QA true SG11201404047QA (en) 2014-09-26

Family

ID=48799202

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404047QA SG11201404047QA (en) 2012-01-16 2013-01-16 Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate

Country Status (7)

Country Link
US (1) US9206336B2 (ja)
JP (1) JP5873882B2 (ja)
KR (1) KR102047281B1 (ja)
DE (1) DE112013001199T5 (ja)
SG (1) SG11201404047QA (ja)
TW (1) TWI650408B (ja)
WO (1) WO2013108777A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6228032B2 (ja) * 2014-02-25 2017-11-08 株式会社フジミインコーポレーテッド 半導体基板を連続的に製造する方法
JP6160579B2 (ja) 2014-08-05 2017-07-12 信越半導体株式会社 シリコンウェーハの仕上げ研磨方法
JP6396740B2 (ja) * 2014-09-29 2018-09-26 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
JP6775453B2 (ja) * 2017-03-23 2020-10-28 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物
JP6879798B2 (ja) * 2017-03-30 2021-06-02 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP7340335B2 (ja) * 2018-01-22 2023-09-07 ニッタ・デュポン株式会社 研磨用組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10309660A (ja) * 1997-05-07 1998-11-24 Tokuyama Corp 仕上げ研磨剤
JP2000218107A (ja) 1998-11-25 2000-08-08 Ebara Corp フィルタ装置及び砥液供給装置
US6280300B1 (en) * 1998-11-25 2001-08-28 Ebara Corporation Filter apparatus
JP2001015461A (ja) 1999-06-29 2001-01-19 Toshiba Corp 研磨液および研磨方法
JP2001294417A (ja) * 2000-04-12 2001-10-23 Nippon Chem Ind Co Ltd コロイダルシリカの製造方法
JP2003136406A (ja) * 2001-10-25 2003-05-14 Speedfam Co Ltd 研磨剤リサイクル方法及び同システム
US6685757B2 (en) 2002-02-21 2004-02-03 Rodel Holdings, Inc. Polishing composition
US6929532B1 (en) * 2003-05-08 2005-08-16 Lsi Logic Corporation Method and apparatus for filtering a chemical polishing slurry of a wafer fabrication process
TWI364450B (en) 2004-08-09 2012-05-21 Kao Corp Polishing composition
KR100640583B1 (ko) * 2004-08-16 2006-10-31 삼성전자주식회사 산화세륨 연마 입자 및 그 제조 방법과 ｃｍｐ용 슬러리조성물 및 그 제조 방법과 이들을 이용한 기판 연마 방법
JP2006056774A (ja) 2004-08-16 2006-03-02 Samsung Electronics Co Ltd 酸化セリウム研磨粒子の製造方法及びそれを含む組成物
JP2006136996A (ja) 2004-10-12 2006-06-01 Kao Corp 研磨液組成物の製造方法
JP4824976B2 (ja) 2005-09-06 2011-11-30 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨方法
JP4796807B2 (ja) 2005-09-06 2011-10-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨方法
TW200717635A (en) 2005-09-06 2007-05-01 Komatsu Denshi Kinzoku Kk Polishing method for semiconductor wafer
US7775854B1 (en) * 2007-07-23 2010-08-17 Gemini, Inc. Water jet machining with abrasive recovery and filtration
JP5474400B2 (ja) * 2008-07-03 2014-04-16 株式会社フジミインコーポレーテッド 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法
JP4772156B1 (ja) 2010-07-05 2011-09-14 花王株式会社 シリコンウエハ用研磨液組成物

Also Published As

Publication number Publication date
DE112013001199T5 (de) 2014-11-20
JPWO2013108777A1 (ja) 2015-05-11
US20150056122A1 (en) 2015-02-26
TW201348417A (zh) 2013-12-01
KR20140117496A (ko) 2014-10-07
US9206336B2 (en) 2015-12-08
WO2013108777A1 (ja) 2013-07-25
TWI650408B (zh) 2019-02-11
KR102047281B1 (ko) 2019-11-21
JP5873882B2 (ja) 2016-03-01

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