SG11201404039UA - Thermally oxidized heterogeneous composite substrate and method for manufacturing same - Google Patents

Thermally oxidized heterogeneous composite substrate and method for manufacturing same

Info

Publication number
SG11201404039UA
SG11201404039UA SG11201404039UA SG11201404039UA SG11201404039UA SG 11201404039U A SG11201404039U A SG 11201404039UA SG 11201404039U A SG11201404039U A SG 11201404039UA SG 11201404039U A SG11201404039U A SG 11201404039UA SG 11201404039U A SG11201404039U A SG 11201404039UA
Authority
SG
Singapore
Prior art keywords
composite substrate
manufacturing same
thermally oxidized
heterogeneous composite
oxidized heterogeneous
Prior art date
Application number
SG11201404039UA
Other languages
English (en)
Inventor
Shoji Akiyama
Yuji Tobisaka
Kazutoshi Nagata
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of SG11201404039UA publication Critical patent/SG11201404039UA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642Isolation within the component, i.e. internal isolation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Thin Film Transistor (AREA)
SG11201404039UA 2012-01-12 2013-01-11 Thermally oxidized heterogeneous composite substrate and method for manufacturing same SG11201404039UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012003856 2012-01-12
PCT/JP2013/050387 WO2013105634A1 (ja) 2012-01-12 2013-01-11 熱酸化異種複合基板及びその製造方法

Publications (1)

Publication Number Publication Date
SG11201404039UA true SG11201404039UA (en) 2014-10-30

Family

ID=48781576

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404039UA SG11201404039UA (en) 2012-01-12 2013-01-11 Thermally oxidized heterogeneous composite substrate and method for manufacturing same

Country Status (8)

Country Link
US (1) US10103021B2 (zh)
EP (1) EP2804202B1 (zh)
JP (2) JPWO2013105634A1 (zh)
KR (1) KR102055933B1 (zh)
CN (1) CN104040686B (zh)
SG (1) SG11201404039UA (zh)
TW (1) TWI576474B (zh)
WO (1) WO2013105634A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105190835B (zh) * 2013-05-01 2018-11-09 信越化学工业株式会社 混合基板的制造方法和混合基板
JP6121356B2 (ja) * 2014-03-31 2017-04-26 信越化学工業株式会社 酸化膜付き異種soi基板の製造方法
JP6121357B2 (ja) * 2014-03-31 2017-04-26 信越化学工業株式会社 酸化膜付き異種soi基板の欠陥検出方法
JP7262421B2 (ja) * 2020-05-08 2023-04-21 信越化学工業株式会社 圧電体複合基板およびその製造方法

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JPS59159563A (ja) * 1983-03-02 1984-09-10 Toshiba Corp 半導体装置の製造方法
US5395788A (en) * 1991-03-15 1995-03-07 Shin Etsu Handotai Co., Ltd. Method of producing semiconductor substrate
US6312968B1 (en) * 1993-06-30 2001-11-06 The United States Of America As Represented By The Secretary Of The Navy Method for fabricating an electrically addressable silicon-on-sapphire light valve
JPH1140682A (ja) 1997-07-18 1999-02-12 Sony Corp 不揮発性半導体記憶装置及びその製造方法
JPH11145438A (ja) * 1997-11-13 1999-05-28 Shin Etsu Handotai Co Ltd Soiウエーハの製造方法ならびにこの方法で製造されるsoiウエーハ
FR2777115B1 (fr) * 1998-04-07 2001-07-13 Commissariat Energie Atomique Procede de traitement de substrats semi-conducteurs et structures obtenues par ce procede
JPH11330438A (ja) 1998-05-08 1999-11-30 Shin Etsu Handotai Co Ltd Soiウエーハの製造方法ならびにこの方法で製造されるsoiウエーハ
US6417078B1 (en) 2000-05-03 2002-07-09 Ibis Technology Corporation Implantation process using sub-stoichiometric, oxygen doses at different energies
US6797604B2 (en) 2000-05-08 2004-09-28 International Business Machines Corporation Method for manufacturing device substrate with metal back-gate and structure formed thereby
JP4304879B2 (ja) 2001-04-06 2009-07-29 信越半導体株式会社 水素イオンまたは希ガスイオンの注入量の決定方法
US6649535B1 (en) 2002-02-12 2003-11-18 Taiwan Semiconductor Manufacturing Company Method for ultra-thin gate oxide growth
US7176528B2 (en) * 2003-02-18 2007-02-13 Corning Incorporated Glass-based SOI structures
FR2855909B1 (fr) * 2003-06-06 2005-08-26 Soitec Silicon On Insulator Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat
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KR100972213B1 (ko) * 2005-12-27 2010-07-26 신에쓰 가가꾸 고교 가부시끼가이샤 Soi 웨이퍼의 제조 방법 및 soi 웨이퍼
WO2008121262A2 (en) 2007-03-30 2008-10-09 Corning Incorporated Glass-ceramic-based semiconductor-on-insulator structures and method for making the same
JP2008263087A (ja) 2007-04-12 2008-10-30 Shin Etsu Chem Co Ltd Soi基板の製造方法
JP5289805B2 (ja) 2007-05-10 2013-09-11 株式会社半導体エネルギー研究所 半導体装置製造用基板の作製方法
CN101383379A (zh) * 2007-09-05 2009-03-11 中国科学院微电子研究所 多介质复合隧穿层的纳米晶浮栅存储器及其制作方法
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Also Published As

Publication number Publication date
EP2804202B1 (en) 2021-02-24
JP2017098577A (ja) 2017-06-01
US10103021B2 (en) 2018-10-16
WO2013105634A1 (ja) 2013-07-18
TW201341604A (zh) 2013-10-16
KR102055933B1 (ko) 2019-12-13
EP2804202A4 (en) 2015-09-16
JP6288323B2 (ja) 2018-03-07
US20140322546A1 (en) 2014-10-30
JPWO2013105634A1 (ja) 2015-05-11
CN104040686B (zh) 2017-05-24
TWI576474B (zh) 2017-04-01
KR20140112036A (ko) 2014-09-22
CN104040686A (zh) 2014-09-10
EP2804202A1 (en) 2014-11-19

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