SG11201404017YA - Silver-coated copper alloy powder and method for manufacturing same - Google Patents

Silver-coated copper alloy powder and method for manufacturing same

Info

Publication number
SG11201404017YA
SG11201404017YA SG11201404017YA SG11201404017YA SG11201404017YA SG 11201404017Y A SG11201404017Y A SG 11201404017YA SG 11201404017Y A SG11201404017Y A SG 11201404017YA SG 11201404017Y A SG11201404017Y A SG 11201404017YA SG 11201404017Y A SG11201404017Y A SG 11201404017YA
Authority
SG
Singapore
Prior art keywords
silver
copper alloy
alloy powder
coated copper
manufacturing same
Prior art date
Application number
SG11201404017YA
Other languages
English (en)
Inventor
Kenichi Inoue
Kozo Ogi
Atsushi Ebara
Yuto Hiyama
Takahiro Yamada
Toshihiko Ueyama
Original Assignee
Dowa Electronics Materials Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co filed Critical Dowa Electronics Materials Co
Publication of SG11201404017YA publication Critical patent/SG11201404017YA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17Metallic particles coated with metal
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/0425Copper-based alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/02Making metallic powder or suspensions thereof using physical processes
    • B22F9/06Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SG11201404017YA 2012-01-17 2013-01-15 Silver-coated copper alloy powder and method for manufacturing same SG11201404017YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012006886 2012-01-17
JP2012120360 2012-05-28
PCT/JP2013/051019 WO2013108916A1 (ja) 2012-01-17 2013-01-15 銀被覆銅合金粉末およびその製造方法

Publications (1)

Publication Number Publication Date
SG11201404017YA true SG11201404017YA (en) 2014-09-26

Family

ID=48799337

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201404017YA SG11201404017YA (en) 2012-01-17 2013-01-15 Silver-coated copper alloy powder and method for manufacturing same

Country Status (8)

Country Link
US (1) US10062473B2 (ja)
EP (1) EP2796228B1 (ja)
JP (4) JP2014005531A (ja)
KR (1) KR102011166B1 (ja)
CN (1) CN104066535B (ja)
SG (1) SG11201404017YA (ja)
TW (1) TWI541365B (ja)
WO (1) WO2013108916A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160358688A1 (en) * 2014-02-12 2016-12-08 Toray Industries, Inc. Conductive paste, method of producing pattern, method of producing conductive paste, and sensor
JP6567921B2 (ja) * 2014-08-29 2019-08-28 Dowaエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
KR20170031215A (ko) * 2014-09-12 2017-03-20 스미토모 긴조쿠 고잔 가부시키가이샤 은코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트
US20160143145A1 (en) * 2014-11-13 2016-05-19 E I Du Pont De Nemours And Company Electrical device
JP6679312B2 (ja) * 2015-01-13 2020-04-15 Dowaエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
JP6001231B1 (ja) * 2015-02-27 2016-10-05 タツタ電線株式会社 導電性ペースト及びこれを用いた多層基板
CN106257978B (zh) * 2015-04-22 2019-09-24 日立金属株式会社 金属颗粒以及它的制造方法、包覆金属颗粒、金属粉体
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP5907302B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
JP6856350B2 (ja) * 2015-10-30 2021-04-07 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
JP6811080B2 (ja) * 2016-02-03 2021-01-13 Dowaエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
CN105921737B (zh) * 2016-04-28 2018-01-19 中南大学 一种铜银复合粉的制备方法和导电胶
JP6900278B2 (ja) * 2016-08-31 2021-07-07 Dowaエレクトロニクス株式会社 銀被覆合金粉末、導電性ペースト、電子部品及び電気装置
DE102017118386A1 (de) 2017-08-11 2019-02-14 Grohe Ag Kupferlegierung, Verwendung einer Kupferlegierung, Sanitärarmatur und Verfahren zur Herstellung einer Sanitärarmatur
CN111804931A (zh) * 2019-04-11 2020-10-23 香港大学 原位分解辅助的粉末冶金方法制备抗菌不锈钢
KR20220020265A (ko) 2019-06-12 2022-02-18 교토 에렉스 가부시키가이샤 도전성 페이스트 조성물
SG11202112809QA (en) * 2019-06-27 2021-12-30 Dowa Electronics Materials Co Ltd Silver powder and method for producing same
KR102202459B1 (ko) * 2019-11-14 2021-01-13 삼성전기주식회사 전극형성용 도전성 금속 분말, 그 제조방법 및 이를 포함하는 전자부품 외부전극용 도전성 페이스트
CN114783770B (zh) * 2022-06-20 2022-12-13 西安宏星电子浆料科技股份有限公司 一种多层陶瓷电容器外部电极浆料及其制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119602A (ja) * 1987-11-02 1989-05-11 Mitsui Mining & Smelting Co Ltd 銀被覆銅粉の製造法
JPH0378906A (ja) * 1989-08-23 1991-04-04 Furukawa Electric Co Ltd:The 導電性ペースト
US5951918A (en) * 1995-02-08 1999-09-14 Hitachi Chemical Company, Ltd. Composite electroconductive powder, electroconductive paste, process for producing electroconductive paste, electric circuit and process for producing electric circuit
JPH08311304A (ja) * 1995-05-16 1996-11-26 Mitsui Kinzoku Toryo Kagaku Kk 銅導電性組成物
JPH10152630A (ja) 1996-08-21 1998-06-09 Hitachi Chem Co Ltd 導電ペースト及び複合導電粉
JP2000169970A (ja) * 1998-12-07 2000-06-20 Yoshinobu Abe 不活性雰囲気めっき方法
JP2001236827A (ja) * 2000-02-23 2001-08-31 Hitachi Chem Co Ltd 導電ペースト
JP2002226973A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 銀めっき銅粉の製造方法
JP2002332501A (ja) * 2001-05-11 2002-11-22 Mitsui Mining & Smelting Co Ltd 銀コート銅粉の製造方法、その製造方法で得られた銀コート銅粉、その銀コート銅粉を用いた導電性ペースト、及びその導電性ペーストを用いたプリント配線板
JP2003068139A (ja) * 2001-08-23 2003-03-07 Hitachi Chem Co Ltd 導電ペースト
JP4223754B2 (ja) * 2002-07-19 2009-02-12 三井金属鉱業株式会社 銀コート銅粉及びその製造方法
CN1176873C (zh) * 2003-03-20 2004-11-24 浙江大学 连续式粉体化学镀方法及其装置
US7504199B2 (en) * 2003-12-16 2009-03-17 Samsung Electronics Co., Ltd. Method of forming metal pattern having low resistivity
JP4660701B2 (ja) * 2004-12-03 2011-03-30 Dowaエレクトロニクス株式会社 銀被覆銅粉およびその製造方法並びに導電ペースト
JP4613362B2 (ja) * 2005-01-31 2011-01-19 Dowaエレクトロニクス株式会社 導電ペースト用金属粉および導電ペースト
JP5166704B2 (ja) * 2006-05-12 2013-03-21 東炭化工株式会社 金属カーボン複合通電摺動材料
JP2010077501A (ja) * 2008-09-26 2010-04-08 Kyocera Corp ニッケル−銅合金粉末およびその製法、導体ペースト、ならびに電子部品
JP5176824B2 (ja) 2008-09-26 2013-04-03 住友金属鉱山株式会社 銀被覆銅微粒子とその分散液及びその製造方法
JP5394084B2 (ja) 2009-01-28 2014-01-22 Jx日鉱日石金属株式会社 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法
JP5402350B2 (ja) * 2009-07-24 2014-01-29 藤倉化成株式会社 導電性ペーストの製造方法および導電性ペースト
JP5583572B2 (ja) * 2010-12-28 2014-09-03 株式会社日本触媒 導電性微粒子
JP5576319B2 (ja) * 2011-03-01 2014-08-20 三井金属鉱業株式会社 銅粒子
JP6194166B2 (ja) * 2012-11-01 2017-09-06 Dowaエレクトロニクス株式会社 銀被覆銅合金粉末の製造方法
TWI722136B (zh) * 2016-03-29 2021-03-21 拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法

Also Published As

Publication number Publication date
EP2796228B1 (en) 2020-10-28
CN104066535A (zh) 2014-09-24
EP2796228A1 (en) 2014-10-29
TW201333226A (zh) 2013-08-16
JP2016020544A (ja) 2016-02-04
US10062473B2 (en) 2018-08-28
TWI541365B (zh) 2016-07-11
JP2014005531A (ja) 2014-01-16
JP2016145422A (ja) 2016-08-12
CN104066535B (zh) 2016-11-09
US20140346413A1 (en) 2014-11-27
EP2796228A4 (en) 2015-10-14
JP2017150086A (ja) 2017-08-31
KR102011166B1 (ko) 2019-08-14
WO2013108916A1 (ja) 2013-07-25
KR20140123526A (ko) 2014-10-22
JP5934829B2 (ja) 2016-06-15
JP6154507B2 (ja) 2017-06-28

Similar Documents

Publication Publication Date Title
SG11201404017YA (en) Silver-coated copper alloy powder and method for manufacturing same
EP2923781A4 (en) COPPER POWDER AND PROCESS FOR PRODUCING THE SAME
EP2915890A4 (en) COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME
HK1219927A1 (zh) 金屬銅分散液、其製備方法及其用途
EP2891554A4 (en) METALLIC STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
EP2839906A4 (en) PROCESS FOR PRODUCING METALLIC POWDER
EP2752498A4 (en) COPPER ALLOY MATERIAL AND METHOD OF MANUFACTURING THEREOF
HK1221980A1 (zh) 銅合金線材及其製造方法
EP3034202A4 (en) METAL POWDER PASTE AND METHOD FOR THE PRODUCTION THEREOF
SG10201606633QA (en) Spherical silver powder and method for producing same
EP2711111A4 (en) PROCESS FOR PRODUCING METALLIC POWDER AND DEVICE FOR PRODUCING METALLIC POWDER
EP2597169A4 (en) ALUMINUM ALLOY AND MANUFACTURING METHOD THEREFOR
SG11201401464UA (en) Copper alloy and copper alloy forming material
EP2728024A4 (en) SILVER-COPPER WHITE ALLOY AND METHOD FOR MANUFACTURING THE SILVER-COPPER WHITE ALLOY
EP2703348A4 (en) METAL OXIDE POWDER AND MANUFACTURING METHOD THEREFOR
EP2899223A4 (en) METAL NANOPARTICLE COMPLEX AND METHOD FOR PRODUCING THE SAME
EP2851910A4 (en) MAGNETIC PART, METALLIC POWDER USED THEREIN AND MANUFACTURING METHOD THEREFOR
GB201502723D0 (en) Solder alloy
EP2653574A4 (en) COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME
HK1205054A1 (zh) 極薄小薄片狀銀粉及其製造方法
EP2834037A4 (en) LOTFORFORM AND SOLDER ALLOY ASSEMBLY METHOD
EP2761042A4 (en) LEAD-FREE AUTOMATIC COPPER ALLOY AND METHOD FOR THE PRODUCTION THEREOF
EP2677050A4 (en) Cu-Zr-BASED COPPER ALLOY PLATE AND METHOD FOR MANUFACTURING THE SAME
EP2772560A4 (en) COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD FOR PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICES, ROLLED COPPER ALLOY MATERIAL FOR ELECTRONIC DEVICES AND COMPONENT FOR ELECTRONIC DEVICES
EP2692878A4 (en) COUPLER ALLOY ON CU-SI-CO BASE FOR ELECTRONIC MATERIALS AND MANUFACTURING METHOD THEREFOR