HK1221980A1 - 銅合金線材及其製造方法 - Google Patents

銅合金線材及其製造方法

Info

Publication number
HK1221980A1
HK1221980A1 HK16110232.9A HK16110232A HK1221980A1 HK 1221980 A1 HK1221980 A1 HK 1221980A1 HK 16110232 A HK16110232 A HK 16110232A HK 1221980 A1 HK1221980 A1 HK 1221980A1
Authority
HK
Hong Kong
Prior art keywords
copper alloy
alloy wire
wire material
producing same
producing
Prior art date
Application number
HK16110232.9A
Other languages
English (en)
Inventor
高澤司
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of HK1221980A1 publication Critical patent/HK1221980A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
HK16110232.9A 2013-09-06 2016-08-29 銅合金線材及其製造方法 HK1221980A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013185542 2013-09-06
PCT/JP2014/073589 WO2015034071A1 (ja) 2013-09-06 2014-09-05 銅合金線材及びその製造方法

Publications (1)

Publication Number Publication Date
HK1221980A1 true HK1221980A1 (zh) 2017-06-16

Family

ID=52628532

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16110232.9A HK1221980A1 (zh) 2013-09-06 2016-08-29 銅合金線材及其製造方法

Country Status (6)

Country Link
EP (1) EP3042972B1 (zh)
JP (2) JP6639908B2 (zh)
KR (1) KR101851473B1 (zh)
CN (1) CN105518165B (zh)
HK (1) HK1221980A1 (zh)
WO (1) WO2015034071A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106164306B (zh) * 2014-03-31 2020-03-17 古河电气工业株式会社 铜合金线材及其制造方法
WO2016203659A1 (ja) 2015-06-15 2016-12-22 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP5893230B1 (ja) 2015-07-23 2016-03-23 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
CN106591610B (zh) * 2015-10-16 2018-05-01 中南大学 一种放电等离子烧结制备高强高导铜合金的方法
SG10201509913XA (en) * 2015-12-02 2017-07-28 Heraeus Materials Singapore Pte Ltd Silver alloyed copper wire
ITUA20163211A1 (it) * 2016-05-06 2017-11-06 De Angeli Prod S R L Conduttore elettrico per avvolgimenti elettrici, specialmente per cavo trasposto continuo
JP6284691B1 (ja) * 2016-05-16 2018-02-28 古河電気工業株式会社 銅系合金線材
CN106676319B (zh) * 2016-11-29 2018-07-27 河南科技大学 一种高强高导铜镁合金接触线及其制备方法
CN106555073B (zh) * 2016-11-29 2018-07-27 河南科技大学 一种高强高导稀土铜镁合金接触线及其制备方法
JP6362809B1 (ja) * 2016-12-02 2018-07-25 古河電気工業株式会社 銅合金線材
WO2019138971A1 (ja) * 2018-01-10 2019-07-18 古河電気工業株式会社 絶縁電線
CN111032892B (zh) * 2018-03-20 2021-12-14 古河电气工业株式会社 铜合金线材和铜合金线材的制造方法
JP6913265B1 (ja) * 2019-11-22 2021-08-04 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ａｇ合金ボンディングワイヤ
DE102021106875B4 (de) * 2021-03-19 2023-09-28 Mundorf Eb Gmbh Kupfer-Silber-Gold-Legierung
US12000030B2 (en) * 2021-05-07 2024-06-04 Apple Inc. Copper alloy film with high strength and high conductivity
CN114645153B (zh) * 2022-03-17 2023-01-24 东北大学 一种高强高导铜银合金丝及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02243733A (ja) * 1989-03-15 1990-09-27 Fujikura Ltd 銅合金線材
JPH04176849A (ja) * 1990-11-10 1992-06-24 Tatsuta Electric Wire & Cable Co Ltd 高力高導電性銅合金細線
JP2001148205A (ja) * 1999-11-19 2001-05-29 Hitachi Cable Ltd 超極細銅合金線材及びその製造方法
JP3941304B2 (ja) 1999-11-19 2007-07-04 日立電線株式会社 超極細銅合金線材及びその製造方法並びにこれを用いた電線
CN100362596C (zh) * 2005-12-20 2008-01-16 郑茂盛 高速铁路用铜合金接触线及其制备方法
JP4617375B2 (ja) * 2007-12-03 2011-01-26 新日鉄マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP5195019B2 (ja) * 2008-05-21 2013-05-08 住友電気工業株式会社 Ｃｕ−Ａｇ合金線、巻線、及びコイル
WO2011068126A1 (ja) * 2009-12-02 2011-06-09 古河電気工業株式会社 銅合金板材およびその製造方法
KR101419149B1 (ko) * 2009-12-02 2014-07-11 후루카와 덴키 고교 가부시키가이샤 구리합금판재
US9382603B2 (en) * 2010-03-17 2016-07-05 Nippon Steel & Sumitomo Metal Corporation Metal tape material and interconnector for solar module current collection
EP2610359A4 (en) * 2010-08-27 2017-08-02 Furukawa Electric Co., Ltd. Copper alloy sheet and method for producing same
WO2012029717A1 (ja) * 2010-08-31 2012-03-08 古河電気工業株式会社 銅合金板材およびその製造方法
JP5571616B2 (ja) * 2011-05-17 2014-08-13 Ｊｘ日鉱日石金属株式会社 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池
JP5307305B1 (ja) * 2011-08-29 2013-10-02 古河電気工業株式会社 銅合金材料およびその製造方法
JP5998758B2 (ja) * 2012-08-31 2016-09-28 三菱マテリアル株式会社 荒引銅線及び巻線、並びに、荒引銅線の製造方法
CN102851527B (zh) * 2012-09-07 2014-05-07 江西理工大学 一种铜银镁合金接触线及其制备方法
CN106164306B (zh) * 2014-03-31 2020-03-17 古河电气工业株式会社 铜合金线材及其制造方法

Also Published As

Publication number Publication date
KR101851473B1 (ko) 2018-04-23
JP6943940B2 (ja) 2021-10-06
EP3042972A1 (en) 2016-07-13
EP3042972B1 (en) 2019-01-02
CN105518165A (zh) 2016-04-20
CN105518165B (zh) 2017-08-18
KR20160052548A (ko) 2016-05-12
JPWO2015034071A1 (ja) 2017-03-02
WO2015034071A1 (ja) 2015-03-12
JP2020073722A (ja) 2020-05-14
EP3042972A4 (en) 2017-06-21
JP6639908B2 (ja) 2020-02-05

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