SG109475A1 - Prepreg and process for manufacturing same - Google Patents

Prepreg and process for manufacturing same

Info

Publication number
SG109475A1
SG109475A1 SG200106782A SG200106782A SG109475A1 SG 109475 A1 SG109475 A1 SG 109475A1 SG 200106782 A SG200106782 A SG 200106782A SG 200106782 A SG200106782 A SG 200106782A SG 109475 A1 SG109475 A1 SG 109475A1
Authority
SG
Singapore
Prior art keywords
prepreg
manufacturing same
manufacturing
same
Prior art date
Application number
SG200106782A
Other languages
English (en)
Inventor
Yamaji Takashi
Komatsu Mamoru
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG109475A1 publication Critical patent/SG109475A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/245—Differential crosslinking of one polymer with one crosslinking type, e.g. surface crosslinking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
    • B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
    • B29B15/10—Coating or impregnating independently of the moulding or shaping step
    • B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
    • B29B15/122—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
    • B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
    • B29B15/10—Coating or impregnating independently of the moulding or shaping step
    • B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
    • B29B15/122—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex
    • B29B15/125—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex by dipping
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31623—Next to polyamide or polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG200106782A 2001-03-13 2001-11-02 Prepreg and process for manufacturing same SG109475A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001070122A JP3499836B2 (ja) 2001-03-13 2001-03-13 プリプレグ及びその製造方法

Publications (1)

Publication Number Publication Date
SG109475A1 true SG109475A1 (en) 2005-03-30

Family

ID=18928047

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106782A SG109475A1 (en) 2001-03-13 2001-11-02 Prepreg and process for manufacturing same

Country Status (8)

Country Link
US (1) US6569513B2 (de)
EP (1) EP1241207B1 (de)
JP (1) JP3499836B2 (de)
KR (1) KR20020073246A (de)
CN (1) CN1200808C (de)
DE (1) DE60110543T2 (de)
SG (1) SG109475A1 (de)
TW (1) TW503171B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685791B2 (ja) * 2003-08-08 2005-08-24 日東電工株式会社 鋼板用貼着シート
US7289656B2 (en) * 2003-12-02 2007-10-30 The Boeing Company Systems and methods for determining inconsistency characteristics of a composite structure
US8934702B2 (en) * 2003-12-02 2015-01-13 The Boeing Company System and method for determining cumulative tow gap width
US20050189067A1 (en) * 2004-02-27 2005-09-01 Michael Wimmer Process for the production of electrical steel sheet cores
TWI428241B (zh) * 2005-10-26 2014-03-01 Sumitomo Chemical Co 經浸漬樹脂之底板及其製造方法
JP2008244189A (ja) * 2007-03-28 2008-10-09 Sumitomo Bakelite Co Ltd 回路基板および半導体装置
TWI478810B (zh) * 2008-03-25 2015-04-01 Ajinomoto Kk An insulating resin sheet, and a multilayer printed circuit board using the same
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
CN101494949A (zh) * 2009-03-04 2009-07-29 腾辉电子（苏州）有限公司 高频覆铜箔基板,其半固化片及降低覆铜箔基板信号损失的方法
TWI384925B (zh) * 2009-03-17 2013-02-01 Advanced Semiconductor Eng 內埋式線路基板之結構及其製造方法
JP5584692B2 (ja) * 2009-09-15 2014-09-03 旭化成イーマテリアルズ株式会社 プリプレグ
CN102770474B (zh) * 2010-02-24 2016-06-22 日立化成工业株式会社 清漆、预浸料片、含有树脂的膜、被覆金属箔的层叠板、印制电路布线板
KR101842863B1 (ko) * 2010-04-05 2018-03-28 니토 보세키 가부시기가이샤 실리카 미립자 보유 유리 섬유 직물의 제조 방법
KR101040230B1 (ko) * 2010-11-01 2011-06-09 주식회사 애강그린텍 배관용 연결기구
JP5917223B2 (ja) 2012-03-23 2016-05-11 村田機械株式会社 繊維束処理装置
WO2015004830A1 (ja) * 2013-07-08 2015-01-15 ソニー株式会社 硬化条件の決定方法、回路デバイスの製造方法及び回路デバイス
JP6357788B2 (ja) * 2014-02-10 2018-07-18 日立化成株式会社 プリプレグ、金属張り積層板及び印刷配線板
CN107155267B (zh) * 2017-06-29 2019-08-27 广州兴森快捷电路科技有限公司 电路板填胶方法、设备、系统及计算机存储介质
CN113402738B (zh) * 2021-06-17 2022-10-18 广东翔思新材料有限公司 高频电路板玻纤基板的生产制作工艺
CN113500797B (zh) * 2021-07-06 2022-02-22 南通曙光机电工程有限公司 一种不锈钢压力容器缠绕碳纤维的制备方法
CN114536905B (zh) * 2022-02-21 2023-08-08 江苏耀鸿电子有限公司 一种环氧玻璃布基覆铜板及其制备方法

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Publication number Priority date Publication date Assignee Title
US4024305A (en) * 1975-06-04 1977-05-17 International Business Machines Corporation Method for producing a resin rich epoxy prepreg and laminate
US4670080A (en) * 1984-04-10 1987-06-02 President Engineering Corp. Process and apparatus for producing metal-laminated base material for printed circuit boards
US5470647A (en) * 1992-05-15 1995-11-28 Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft Prepregs comprising a fibrous base with a first coating of C-stage thermosetting resin and an outer second coating of B-stage thermosetting resin and a method of making the same
US5871819A (en) * 1996-09-10 1999-02-16 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
US5928970A (en) * 1996-09-10 1999-07-27 International Business Machines Corp. Dustfree prepreg and method for making an article based thereon
EP1073320A2 (de) * 1999-07-29 2001-01-31 Mitsubishi Gas Chemical Company, Inc. Glasgewebe-Basismaterial/Wärmehärtendes Harz kupferkaschiertes Laminat mit hoher Elastizität

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DE2650408C3 (de) * 1976-11-03 1980-06-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung von Klebefolien (Prepreg), die ein mit Epoxydharz imprägniertes Glasfasergewebe enthalten
JPS54142576A (en) 1978-04-27 1979-11-06 Matsushita Electric Works Ltd Method of producing multilayer printed circuit board material
JPS5792777A (en) * 1980-11-29 1982-06-09 Sekisui Chemical Co Ltd Method of producing panel heater
US5217796A (en) * 1985-02-19 1993-06-08 Nitto Boseki Co., Ltd. Woven material of inorganic fiber and process for making the same
JPS6319245A (ja) * 1986-07-11 1988-01-27 東芝ケミカル株式会社 銅張積層板
JPS63168438A (ja) * 1986-12-30 1988-07-12 Yokohama Rubber Co Ltd:The プリプレグ
JPH01127335A (ja) * 1987-11-13 1989-05-19 Sumitomo Bakelite Co Ltd 熱硬化性樹脂積層板の製造方法
JPH0818853B2 (ja) * 1989-11-15 1996-02-28 日東紡績株式会社 ガラスクロスの製造方法
US5382333A (en) * 1990-07-30 1995-01-17 Mitsubishi Gas Chemical Company, Inc. Process for producing copper clad laminate
JPH04119836A (ja) * 1990-09-12 1992-04-21 Hitachi Chem Co Ltd 金属箔張積層板とその製造方法
JP3307440B2 (ja) * 1992-12-01 2002-07-24 三菱瓦斯化学株式会社 プリプレグの製造法
JPH06270147A (ja) * 1993-03-24 1994-09-27 Matsushita Electric Works Ltd 樹脂含浸方法
JP3151402B2 (ja) * 1996-03-15 2001-04-03 松下電工株式会社 金属箔張り積層板製造用プリプレグ
JPH09296334A (ja) * 1996-05-08 1997-11-18 Nitto Boseki Co Ltd プリント配線基板用ガラス繊維織物及びそれを用いたプリント配線基板
JPH10303569A (ja) * 1997-04-23 1998-11-13 Multi:Kk 多層銅張り積層板及びこれを用いた高密度多層プリント配線板及びこれらの製造方法
JP2000286362A (ja) * 1999-03-30 2000-10-13 Mitsubishi Gas Chem Co Inc 極薄ｂｇａタイプ半導体プラスチックパッケージ用プリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024305A (en) * 1975-06-04 1977-05-17 International Business Machines Corporation Method for producing a resin rich epoxy prepreg and laminate
US4670080A (en) * 1984-04-10 1987-06-02 President Engineering Corp. Process and apparatus for producing metal-laminated base material for printed circuit boards
US5470647A (en) * 1992-05-15 1995-11-28 Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft Prepregs comprising a fibrous base with a first coating of C-stage thermosetting resin and an outer second coating of B-stage thermosetting resin and a method of making the same
US5871819A (en) * 1996-09-10 1999-02-16 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
US5928970A (en) * 1996-09-10 1999-07-27 International Business Machines Corp. Dustfree prepreg and method for making an article based thereon
EP1073320A2 (de) * 1999-07-29 2001-01-31 Mitsubishi Gas Chemical Company, Inc. Glasgewebe-Basismaterial/Wärmehärtendes Harz kupferkaschiertes Laminat mit hoher Elastizität

Also Published As

Publication number Publication date
US20020168504A1 (en) 2002-11-14
KR20020073246A (ko) 2002-09-23
DE60110543T2 (de) 2006-01-19
JP2002265646A (ja) 2002-09-18
TW503171B (en) 2002-09-21
US6569513B2 (en) 2003-05-27
JP3499836B2 (ja) 2004-02-23
DE60110543D1 (de) 2005-06-09
CN1374190A (zh) 2002-10-16
CN1200808C (zh) 2005-05-11
EP1241207A1 (de) 2002-09-18
EP1241207B1 (de) 2005-05-04

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