SG108267A1 - Composition for circuit board manufacture - Google Patents

Composition for circuit board manufacture

Info

Publication number
SG108267A1
SG108267A1 SG200104652A SG200104652A SG108267A1 SG 108267 A1 SG108267 A1 SG 108267A1 SG 200104652 A SG200104652 A SG 200104652A SG 200104652 A SG200104652 A SG 200104652A SG 108267 A1 SG108267 A1 SG 108267A1
Authority
SG
Singapore
Prior art keywords
composition
circuit board
board manufacture
treating
disclosed
Prior art date
Application number
SG200104652A
Other languages
English (en)
Inventor
Kondo Masaki
R Montano Joseph
Original Assignee
Shipley Co Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24536733&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG108267(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shipley Co Llc filed Critical Shipley Co Llc
Publication of SG108267A1 publication Critical patent/SG108267A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)
SG200104652A 2000-08-04 2001-08-02 Composition for circuit board manufacture SG108267A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/632,736 US6521139B1 (en) 2000-08-04 2000-08-04 Composition for circuit board manufacture

Publications (1)

Publication Number Publication Date
SG108267A1 true SG108267A1 (en) 2005-01-28

Family

ID=24536733

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200104652A SG108267A1 (en) 2000-08-04 2001-08-02 Composition for circuit board manufacture

Country Status (9)

Country Link
US (1) US6521139B1 (de)
EP (1) EP1179973B2 (de)
JP (1) JP4836365B2 (de)
KR (1) KR20020011879A (de)
AT (1) ATE250844T1 (de)
DE (1) DE60100834T3 (de)
ES (1) ES2207594T3 (de)
SG (1) SG108267A1 (de)
TW (1) TW573060B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351353B1 (en) * 2000-01-07 2008-04-01 Electrochemicals, Inc. Method for roughening copper surfaces for bonding to substrates
US6554948B1 (en) * 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
JP2004068068A (ja) * 2002-08-05 2004-03-04 Nippon Parkerizing Co Ltd 複合材、その製造方法
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
GB0318017D0 (en) * 2003-08-01 2003-09-03 Shipley Co Llc Methods for recovering metals
EP2135736B1 (de) 2007-04-06 2013-02-27 Taisei Plas Co., Ltd. Kupferlegierungsverbund und herstellungsverfahren dafür
KR101632450B1 (ko) † 2008-03-21 2016-06-21 엔쏜 인코포레이티드 다작용기성 화합물을 이용한 적층체에 대한 금속의 접착 촉진
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
US9338896B2 (en) * 2012-07-25 2016-05-10 Enthone, Inc. Adhesion promotion in printed circuit boards
KR20140100085A (ko) * 2013-02-05 2014-08-14 삼성에스디아이 주식회사 배터리팩
JP2018184624A (ja) * 2017-04-24 2018-11-22 三洋化成工業株式会社 銅又は銅合金用エッチング液
US10677542B2 (en) * 2017-10-23 2020-06-09 Trustees Of Boston University Enhanced thermal transport across interfaces
US11268809B2 (en) 2018-11-07 2022-03-08 International Business Machines Corporation Detecting and correcting deficiencies in surface conditions for bonding applications

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428987A (en) * 1982-04-28 1984-01-31 Shell Oil Company Process for improving copper-epoxy adhesion
US5900256A (en) * 1996-09-18 1999-05-04 Cottrell, Ltd. Hydrogen peroxide disinfecting and sterilizing compositions
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
WO2001049805A1 (en) * 2000-01-07 2001-07-12 Electrochemicals Inc. Method for roughening copper surfaces for bonding to substrates

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2932599A (en) 1955-05-09 1960-04-12 Sanders Associates Inc Method of preparation of thermoplastic resin coated printed circuit
JPS5327694B2 (de) 1972-02-05 1978-08-10
JPS5332341B2 (de) * 1973-03-27 1978-09-07
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
US4409037A (en) 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
GB2133783B (en) 1983-01-15 1985-09-04 Marconi Co Ltd Oxidising compositions
US4512818A (en) 1983-05-23 1985-04-23 Shipley Company Inc. Solution for formation of black oxide
JPS61176192A (ja) 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US5106454A (en) 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
JP3141145B2 (ja) * 1992-12-18 2001-03-05 大塚化学株式会社 防錆剤
US5802714A (en) * 1994-07-19 1998-09-08 Hitachi, Ltd. Method of finishing a printed wiring board with a soft etching solution and a preserving treatment or a solder-leveling treatment
GB9425090D0 (en) 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
JP3546248B2 (ja) * 1995-04-11 2004-07-21 株式会社片山化学工業研究所 ベンゾトリアゾール系化合物含有水性製剤の製造方法及びその水性製剤
JPH09293954A (ja) * 1996-04-25 1997-11-11 Mec Kk 銅または銅合金表面の処理剤
JPH10265979A (ja) * 1997-03-27 1998-10-06 Nitto Chem Ind Co Ltd 銅材用防食剤組成物
US6146701A (en) 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
JPH1129883A (ja) 1997-07-08 1999-02-02 Mec Kk 銅および銅合金のマイクロエッチング剤
US6261466B1 (en) * 1997-12-11 2001-07-17 Shipley Company, L.L.C. Composition for circuit board manufacture
US6054061A (en) 1997-12-11 2000-04-25 Shipley Company, L.L.C. Composition for circuit board manufacture
JP2000064067A (ja) * 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
EP1158843B1 (de) † 2000-05-22 2006-09-13 Macdermid Incorporated Verfahren zur Verbesserung der Adhäsion von Polymermaterialien an Metalloberflächen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428987A (en) * 1982-04-28 1984-01-31 Shell Oil Company Process for improving copper-epoxy adhesion
US5900256A (en) * 1996-09-18 1999-05-04 Cottrell, Ltd. Hydrogen peroxide disinfecting and sterilizing compositions
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
WO2001049805A1 (en) * 2000-01-07 2001-07-12 Electrochemicals Inc. Method for roughening copper surfaces for bonding to substrates

Also Published As

Publication number Publication date
JP4836365B2 (ja) 2011-12-14
EP1179973B1 (de) 2003-09-24
DE60100834D1 (de) 2003-10-30
EP1179973A2 (de) 2002-02-13
ATE250844T1 (de) 2003-10-15
EP1179973B2 (de) 2008-11-05
US6521139B1 (en) 2003-02-18
KR20020011879A (ko) 2002-02-09
DE60100834T3 (de) 2009-07-09
TW573060B (en) 2004-01-21
EP1179973A3 (de) 2002-05-22
DE60100834T2 (de) 2005-02-10
JP2002115077A (ja) 2002-04-19
ES2207594T3 (es) 2004-06-01

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