SG10201710459SA - Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device - Google Patents

Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device

Info

Publication number
SG10201710459SA
SG10201710459SA SG10201710459SA SG10201710459SA SG10201710459SA SG 10201710459S A SG10201710459S A SG 10201710459SA SG 10201710459S A SG10201710459S A SG 10201710459SA SG 10201710459S A SG10201710459S A SG 10201710459SA SG 10201710459S A SG10201710459S A SG 10201710459SA
Authority
SG
Singapore
Prior art keywords
substrate attachment
detachment device
detachment
substrate
posture
Prior art date
Application number
SG10201710459SA
Other languages
English (en)
Inventor
Yokoyama Toshio
Mukaiyama Yoshitaka
Tsushima Takuya
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201710459SA publication Critical patent/SG10201710459SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemically Coating (AREA)
SG10201710459SA 2016-12-22 2017-12-15 Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device SG10201710459SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016249631A JP6727117B2 (ja) 2016-12-22 2016-12-22 基板着脱装置、めっき装置、基板着脱装置の制御装置、基板着脱装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体

Publications (1)

Publication Number Publication Date
SG10201710459SA true SG10201710459SA (en) 2018-07-30

Family

ID=62625105

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201710459SA SG10201710459SA (en) 2016-12-22 2017-12-15 Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device

Country Status (6)

Country Link
US (1) US10665495B2 (ja)
JP (1) JP6727117B2 (ja)
KR (1) KR102388112B1 (ja)
CN (1) CN108221019B (ja)
SG (1) SG10201710459SA (ja)
TW (1) TWI726180B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11384447B2 (en) * 2016-09-08 2022-07-12 Ebara Corporation Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrate
US11299817B2 (en) * 2017-06-28 2022-04-12 Ebara Corporation Holder for holding substrate and system for plating
JP7100556B2 (ja) * 2018-10-05 2022-07-13 株式会社荏原製作所 基板ホルダに基板を保持させるためおよび／又は基板ホルダによる基板の保持を解除するための装置、および同装置を有するめっき装置
JP7058209B2 (ja) * 2018-11-21 2022-04-21 株式会社荏原製作所 基板ホルダに基板を保持させる方法
TWI708652B (zh) * 2019-08-15 2020-11-01 群翊工業股份有限公司 撐靠機構及夾緊裝置
CN211479988U (zh) * 2019-10-14 2020-09-11 Pyxis Cf私人有限公司 湿法处理设备
JP7242516B2 (ja) 2019-12-13 2023-03-20 株式会社荏原製作所 基板ホルダ
JP7244408B2 (ja) * 2019-12-13 2023-03-22 株式会社荏原製作所 基板ホルダ
CN114446749B (zh) * 2020-11-02 2023-10-24 长鑫存储技术有限公司 刻蚀机的气体分布板的拆装装置和刻蚀机
JP7016998B1 (ja) * 2021-11-09 2022-02-07 株式会社荏原製作所 めっき装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI50717C (fi) * 1973-05-17 1976-06-10 Outokumpu Oy Menetelmä ja laite elektrolyyttisesti saostetun metallilevyn, varsinki n kupari-, nikkeli- tai sinkkilevyn irrottamiseksi katodilta
JPH03247798A (ja) * 1990-02-23 1991-11-05 Asahi Eng Co Ltd 鍍金装置における鍍金枠のワーク着脱装置
JPH0473928A (ja) * 1990-07-13 1992-03-09 Fujitsu Ltd 縦型露光転写装置
JPH06341000A (ja) * 1993-06-02 1994-12-13 Fujisash Co アルミニウム押出形材の竪吊り・横吊り兼用処理設備
JP4179707B2 (ja) 1999-06-15 2008-11-12 荏原ユージライト株式会社 プリント基板保持用治具及びめっき装置
JP4789362B2 (ja) 2001-07-25 2011-10-12 富士機械製造株式会社 基板保持装置
JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
TWI601199B (zh) * 2002-11-15 2017-10-01 荏原製作所股份有限公司 基板處理裝置及基板處理方法
JP3981885B2 (ja) * 2003-05-20 2007-09-26 株式会社ダイフク 搬送装置
CN100583409C (zh) * 2005-10-14 2010-01-20 上村工业株式会社 基板卸载装置以及基板卸载方法
CN101971319B (zh) * 2008-03-13 2013-03-06 株式会社尼康 基板保持架、基板保持单元、基板搬送装置和基板贴合装置
JP2009270167A (ja) 2008-05-08 2009-11-19 Ebara Corp めっき装置及びめっき方法
JP5750327B2 (ja) * 2010-10-21 2015-07-22 株式会社荏原製作所 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
JP5643239B2 (ja) 2012-01-30 2014-12-17 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6077886B2 (ja) * 2013-03-04 2017-02-08 株式会社荏原製作所 めっき装置
JP6382096B2 (ja) 2014-12-18 2018-08-29 株式会社荏原製作所 めっき方法、めっき装置、および基板ホルダ
CN105980611B (zh) 2014-02-06 2019-04-09 株式会社荏原制作所 基板保持器、镀覆装置、及镀覆方法
JP6218682B2 (ja) 2014-06-18 2017-10-25 株式会社荏原製作所 基板ホルダを備えためっき装置、およびめっき方法
JP6335777B2 (ja) 2014-12-26 2018-05-30 株式会社荏原製作所 基板ホルダ、基板ホルダで基板を保持する方法、及びめっき装置
JP6408936B2 (ja) 2015-03-05 2018-10-17 株式会社荏原製作所 めっき装置

Also Published As

Publication number Publication date
TWI726180B (zh) 2021-05-01
KR20180073438A (ko) 2018-07-02
US20180182659A1 (en) 2018-06-28
JP6727117B2 (ja) 2020-07-22
JP2018104735A (ja) 2018-07-05
US10665495B2 (en) 2020-05-26
CN108221019A (zh) 2018-06-29
KR102388112B1 (ko) 2022-04-19
TW201840913A (zh) 2018-11-16
CN108221019B (zh) 2021-04-06

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