SG10201706724QA - Method and apparatus for adhering electronic components - Google Patents

Method and apparatus for adhering electronic components

Info

Publication number
SG10201706724QA
SG10201706724QA SG10201706724QA SG10201706724QA SG10201706724QA SG 10201706724Q A SG10201706724Q A SG 10201706724QA SG 10201706724Q A SG10201706724Q A SG 10201706724QA SG 10201706724Q A SG10201706724Q A SG 10201706724QA SG 10201706724Q A SG10201706724Q A SG 10201706724QA
Authority
SG
Singapore
Prior art keywords
electronic components
adhering
carrier tape
picking
fixture
Prior art date
Application number
SG10201706724QA
Other languages
English (en)
Inventor
Ou Chen-En
DONG Sheng-Hsin
Wu Chun-Hsin
Original Assignee
All Ring Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by All Ring Tech Co Ltd filed Critical All Ring Tech Co Ltd
Publication of SG10201706724QA publication Critical patent/SG10201706724QA/en

Links

SG10201706724QA 2017-03-14 2017-08-17 Method and apparatus for adhering electronic components SG10201706724QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106108422A TWI668158B (zh) 2017-03-14 2017-03-14 Component bonding method and device

Publications (1)

Publication Number Publication Date
SG10201706724QA true SG10201706724QA (en) 2018-10-30

Family

ID=63575772

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201706724QA SG10201706724QA (en) 2017-03-14 2017-08-17 Method and apparatus for adhering electronic components

Country Status (3)

Country Link
CN (1) CN108575085A (zh)
SG (1) SG10201706724QA (zh)
TW (1) TWI668158B (zh)

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CN109699169B (zh) * 2019-01-31 2020-12-22 深圳市益光实业有限公司 一种微波多通道t/r组件贴片技术
TWI716906B (zh) * 2019-06-19 2021-01-21 萬潤科技股份有限公司 散熱膠墊貼合方法及設備
TWI688018B (zh) * 2019-06-19 2020-03-11 萬潤科技股份有限公司 散熱膠墊貼合方法及裝置
CN111215351B (zh) * 2019-10-22 2021-09-17 芯思杰技术(深圳)股份有限公司 一种器件拨件包装控制方法
CN112917145B (zh) * 2021-01-22 2023-06-09 领联汽车零部件制造（上海）有限公司 一种汽车车轮abs传感器芯片装配机

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JP2005051055A (ja) * 2003-07-29 2005-02-24 Tokyo Electron Ltd 貼合せ方法および貼合せ装置
CN202160380U (zh) * 2011-06-25 2012-03-07 钜仑科技股份有限公司 电子材料自动化处理装置
CN202181108U (zh) * 2011-07-30 2012-04-04 歌尔声学股份有限公司 料盘形式物料输送装置
CN202271629U (zh) * 2011-09-18 2012-06-13 瑞世达科技(厦门)有限公司 覆膜机
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Also Published As

Publication number Publication date
TWI668158B (zh) 2019-08-11
CN108575085A (zh) 2018-09-25
TW201832993A (zh) 2018-09-16

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