SG10201705680XA - Hold checking method and unhold checking method for wafer - Google Patents
Hold checking method and unhold checking method for waferInfo
- Publication number
- SG10201705680XA SG10201705680XA SG10201705680XA SG10201705680XA SG10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA SG 10201705680X A SG10201705680X A SG 10201705680XA
- Authority
- SG
- Singapore
- Prior art keywords
- checking method
- unhold
- wafer
- hold
- checking
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016142216A JP6697346B2 (ja) | 2016-07-20 | 2016-07-20 | 吸着確認方法、離脱確認方法、及び減圧処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201705680XA true SG10201705680XA (en) | 2018-02-27 |
Family
ID=60990106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201705680XA SG10201705680XA (en) | 2016-07-20 | 2017-07-11 | Hold checking method and unhold checking method for wafer |
Country Status (6)
Country | Link |
---|---|
US (1) | US10910246B2 (ko) |
JP (1) | JP6697346B2 (ko) |
KR (1) | KR102174879B1 (ko) |
CN (1) | CN107644830B (ko) |
SG (1) | SG10201705680XA (ko) |
TW (1) | TWI727055B (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6905382B2 (ja) * | 2017-04-14 | 2021-07-21 | 株式会社ディスコ | ウェーハの搬入出方法 |
US10825645B2 (en) * | 2017-08-17 | 2020-11-03 | Varian Semiconductor Equipment Associates, Inc. | System and method for reduced workpiece adhesion due to electrostatic charge during removal from a processing station |
KR102516885B1 (ko) * | 2018-05-10 | 2023-03-30 | 삼성전자주식회사 | 증착 장비 및 이를 이용한 반도체 장치 제조 방법 |
CN112136202B (zh) * | 2018-06-08 | 2024-04-12 | 应用材料公司 | 用于在等离子体增强化学气相沉积腔室中抑制寄生等离子体的设备 |
JP7052584B2 (ja) * | 2018-06-15 | 2022-04-12 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JP6913060B2 (ja) * | 2018-07-24 | 2021-08-04 | 株式会社日立ハイテク | プラズマ処理装置及びプラズマ処理方法 |
JP2020038907A (ja) * | 2018-09-04 | 2020-03-12 | 株式会社ディスコ | プラズマ処理装置 |
JP7188992B2 (ja) * | 2018-11-27 | 2022-12-13 | 株式会社ディスコ | プラズマエッチング装置 |
JP2022534804A (ja) * | 2019-06-07 | 2022-08-03 | アプライド マテリアルズ インコーポレイテッド | シームレス電線用導管 |
US20220356027A1 (en) * | 2021-05-04 | 2022-11-10 | Applied Materials, Inc. | Roller for transporting a flexible substrate, vacuum processing apparatus, and methods therefor |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06291174A (ja) * | 1993-04-06 | 1994-10-18 | Fuji Electric Co Ltd | 静電チャック及び静電チャックへの半導体ウエハの吸着,保持方法 |
JP2879887B2 (ja) * | 1995-08-24 | 1999-04-05 | 東京エレクトロン株式会社 | プラズマ処理方法 |
US6238160B1 (en) * | 1998-12-02 | 2001-05-29 | Taiwan Semiconductor Manufacturing Company, Ltd' | Method for transporting and electrostatically chucking a semiconductor wafer or the like |
JP3633854B2 (ja) | 2000-06-12 | 2005-03-30 | 株式会社ディスコ | 半導体ウェハの加工装置 |
JP4227865B2 (ja) * | 2003-08-12 | 2009-02-18 | 株式会社ディスコ | プラズマエッチング方法及びプラズマエッチング装置 |
JP2006202939A (ja) * | 2005-01-20 | 2006-08-03 | Mitsubishi Heavy Ind Ltd | 吸着方法、脱離方法、プラズマ処理方法、静電チャック及びプラズマ処理装置 |
US7535688B2 (en) * | 2005-03-25 | 2009-05-19 | Tokyo Electron Limited | Method for electrically discharging substrate, substrate processing apparatus and program |
JP4699061B2 (ja) | 2005-03-25 | 2011-06-08 | 東京エレクトロン株式会社 | 被処理基板の除電方法,基板処理装置,プログラム |
JP2008028021A (ja) * | 2006-07-19 | 2008-02-07 | Disco Abrasive Syst Ltd | プラズマエッチング装置およびプラズマエッチング方法 |
US7750645B2 (en) | 2007-08-15 | 2010-07-06 | Applied Materials, Inc. | Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation |
KR101127165B1 (ko) * | 2010-04-23 | 2012-03-20 | 청진테크 주식회사 | 정전 척 시스템의 누설전류 모니터링 장치 |
JP5592833B2 (ja) * | 2011-05-20 | 2014-09-17 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置および静電チャック装置 |
JP6649689B2 (ja) * | 2015-03-16 | 2020-02-19 | 株式会社ディスコ | 減圧処理装置及びウエーハの保持方法 |
-
2016
- 2016-07-20 JP JP2016142216A patent/JP6697346B2/ja active Active
-
2017
- 2017-06-09 TW TW106119312A patent/TWI727055B/zh active
- 2017-06-30 KR KR1020170083144A patent/KR102174879B1/ko active IP Right Grant
- 2017-07-11 SG SG10201705680XA patent/SG10201705680XA/en unknown
- 2017-07-13 US US15/648,663 patent/US10910246B2/en active Active
- 2017-07-18 CN CN201710584227.9A patent/CN107644830B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US10910246B2 (en) | 2021-02-02 |
TWI727055B (zh) | 2021-05-11 |
CN107644830A (zh) | 2018-01-30 |
US20180025928A1 (en) | 2018-01-25 |
KR20180010133A (ko) | 2018-01-30 |
CN107644830B (zh) | 2022-12-20 |
KR102174879B1 (ko) | 2020-11-05 |
TW201812966A (zh) | 2018-04-01 |
JP6697346B2 (ja) | 2020-05-20 |
JP2018014383A (ja) | 2018-01-25 |
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