SG10201607590TA - Laser-assisted atomic layer deposition of 2d metal chalcogenide films - Google Patents
Laser-assisted atomic layer deposition of 2d metal chalcogenide filmsInfo
- Publication number
- SG10201607590TA SG10201607590TA SG10201607590TA SG10201607590TA SG10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA
- Authority
- SG
- Singapore
- Prior art keywords
- laser
- atomic layer
- layer deposition
- metal chalcogenide
- assisted atomic
- Prior art date
Links
- 238000000231 atomic layer deposition Methods 0.000 title 1
- 150000004770 chalcogenides Chemical class 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C23C16/45536—Use of plasma, radiation or electromagnetic fields
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JP7409322B2 (ja) | 2018-12-25 | 2024-01-09 | 株式会社レゾナック | 付着物除去方法及び成膜方法 |
US11377736B2 (en) | 2019-03-08 | 2022-07-05 | Seagate Technology Llc | Atomic layer deposition systems, methods, and devices |
KR20210009160A (ko) | 2019-07-16 | 2021-01-26 | 삼성전자주식회사 | 전이금속 칼코겐 화합물 박막의 형성방법 |
US20210062331A1 (en) * | 2019-08-26 | 2021-03-04 | Entegris, Inc. | Group vi metal deposition process |
CN110607516B (zh) * | 2019-10-24 | 2021-06-29 | 云南师范大学 | 一种单层或双层二硫化钨薄膜的制备方法 |
CN110863189A (zh) * | 2019-11-11 | 2020-03-06 | 中国科学院上海技术物理研究所 | 一种脉冲式注入反应物生长单层碲化物掺杂结构的方法 |
EP4080549A4 (en) | 2019-12-17 | 2023-07-26 | Resonac Corporation | PASSIVATION FILM MANUFACTURING PROCESS |
KR102444272B1 (ko) * | 2020-05-18 | 2022-09-16 | 서울대학교산학협력단 | 원자층 증착 공정을 이용한 칼코게나이드계 박막의 형성 방법, 이를 이용한 스위칭 소자의 형성 방법 및 메모리 소자의 제조 방법 |
KR102444266B1 (ko) * | 2020-05-18 | 2022-09-16 | 서울대학교산학협력단 | 원자층 증착 공정을 이용한 칼코게나이드계 박막의 형성 방법, 이를 적용한 상변화 물질층의 형성 방법 및 상변화 메모리 소자의 제조 방법 |
CN111943270B (zh) * | 2020-08-21 | 2023-04-25 | 南京工程学院 | 一种用于制造二硫化钼量子点阵列的设备与工艺方法 |
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CN114318288A (zh) * | 2020-10-09 | 2022-04-12 | 昆山微电子技术研究院 | 一种高质量二硫化钼薄膜的原子层沉积制备方法 |
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US20150118487A1 (en) * | 2013-10-25 | 2015-04-30 | Colin A. Wolden | Plasma-assisted nanofabrication of two-dimensional metal chalcogenide layers |
KR102144999B1 (ko) * | 2013-11-05 | 2020-08-14 | 삼성전자주식회사 | 이차원 물질과 그 형성방법 및 이차원 물질을 포함하는 소자 |
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- 2016-09-09 JP JP2016176531A patent/JP6392282B2/ja not_active Expired - Fee Related
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2018
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JP2017061743A (ja) | 2017-03-30 |
KR20170032867A (ko) | 2017-03-23 |
JP6392282B2 (ja) | 2018-09-19 |
US20170073812A1 (en) | 2017-03-16 |
US20180216232A1 (en) | 2018-08-02 |
CN106521452A (zh) | 2017-03-22 |
US10676826B2 (en) | 2020-06-09 |
TWI624558B (zh) | 2018-05-21 |
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