SG10201607590TA - Laser-assisted atomic layer deposition of 2d metal chalcogenide films - Google Patents
Laser-assisted atomic layer deposition of 2d metal chalcogenide filmsInfo
- Publication number
- SG10201607590TA SG10201607590TA SG10201607590TA SG10201607590TA SG10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA SG 10201607590T A SG10201607590T A SG 10201607590TA
- Authority
- SG
- Singapore
- Prior art keywords
- laser
- atomic layer
- layer deposition
- metal chalcogenide
- assisted atomic
- Prior art date
Links
- 238000000231 atomic layer deposition Methods 0.000 title 1
- 150000004770 chalcogenides Chemical class 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C23C16/45536—Use of plasma, radiation or electromagnetic fields
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CN108376738A (en) * | 2018-02-27 | 2018-08-07 | 上海电力学院 | A method of realizing semiconductor alloy phase transformation using nano-metal particle assisted microwave synthesis |
TWI751406B (en) | 2018-03-06 | 2022-01-01 | 美商應用材料股份有限公司 | Methods of forming metal chalcogenide pillars |
US10861706B2 (en) * | 2018-10-26 | 2020-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etch selectivity improved by laser beam |
US11756828B2 (en) * | 2018-11-20 | 2023-09-12 | Applied Materials, Inc. | Cluster processing system for forming a transition metal material |
EP3666783A1 (en) * | 2018-12-12 | 2020-06-17 | Umicore Ag & Co. Kg | Method for the preparation of bis(tert-butylimido)bis(dialkylamido)wolfram compounds, bis(tert-butylimido)bis(dialkylamido)wolfram compounds, use of a bis(tert-butylimido)bis(dialkylamido)wolfram compound and substrate |
US11377736B2 (en) | 2019-03-08 | 2022-07-05 | Seagate Technology Llc | Atomic layer deposition systems, methods, and devices |
KR20210009160A (en) * | 2019-07-16 | 2021-01-26 | 삼성전자주식회사 | Method for forming thin film of transition metal dichalcogenide |
US20210062331A1 (en) * | 2019-08-26 | 2021-03-04 | Entegris, Inc. | Group vi metal deposition process |
CN110607516B (en) * | 2019-10-24 | 2021-06-29 | 云南师范大学 | Preparation method of single-layer or double-layer tungsten disulfide film |
CN110863189A (en) * | 2019-11-11 | 2020-03-06 | 中国科学院上海技术物理研究所 | Method for growing single-layer telluride doped structure by pulse type injection of reactant |
US20220246447A1 (en) * | 2019-12-17 | 2022-08-04 | Showa Denko K.K. | Method of manufacturing passivation film |
KR102444272B1 (en) * | 2020-05-18 | 2022-09-16 | 서울대학교산학협력단 | Method of forming chalcogenide-based thin film using atomic layer deposition process, method of forming switching device using the same and method of manufacturing memory device |
KR102444266B1 (en) * | 2020-05-18 | 2022-09-16 | 서울대학교산학협력단 | Method of forming chalcogenide-based thin film using atomic layer deposition process, method of forming phase change material layer using the same and method of fabricating phase change memory device |
CN111943270B (en) * | 2020-08-21 | 2023-04-25 | 南京工程学院 | Equipment and process method for manufacturing molybdenum disulfide quantum dot array |
CN111978962B (en) * | 2020-08-21 | 2022-12-13 | 南京工程学院 | Green manufacturing method and device for selenide quantum dots |
CN114318288A (en) * | 2020-10-09 | 2022-04-12 | 昆山微电子技术研究院 | Atomic layer deposition preparation method of high-quality molybdenum disulfide film |
CN112501583B (en) * | 2020-11-26 | 2023-01-24 | 北京大学深圳研究生院 | Preparation method of transition metal diselenide film |
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JPWO2003043070A1 (en) * | 2001-11-12 | 2005-03-10 | ソニー株式会社 | Laser annealing apparatus and thin film transistor manufacturing method |
JP4312006B2 (en) * | 2003-08-25 | 2009-08-12 | 株式会社Adeka | Rare earth metal complex, raw material for thin film formation, and method for producing thin film |
JP2008502805A (en) * | 2004-06-15 | 2008-01-31 | アヴィザ テクノロジー インコーポレイテッド | System and method for forming a multi-component dielectric film |
KR101515544B1 (en) * | 2008-04-18 | 2015-04-30 | 주식회사 원익아이피에스 | Method of forming chalcogenide thin film |
JP4372211B2 (en) * | 2008-12-08 | 2009-11-25 | 純一 半那 | Manufacturing method of semiconductor substrate |
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JP5624083B2 (en) * | 2011-06-09 | 2014-11-12 | エア プロダクツ アンド ケミカルズ インコーポレイテッドAir Productsand Chemicalsincorporated | Binary and ternary metal chalcogenide materials and methods for making and using the same |
TW201408810A (en) * | 2012-07-12 | 2014-03-01 | Applied Materials Inc | Methods for depositing oxygen deficient metal films |
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KR101500944B1 (en) * | 2013-03-22 | 2015-03-10 | 경희대학교 산학협력단 | Method for growing 2d layer of chacogenide compound, method for preparing cmos type structure, layer of chacogenide compound, electronic device including layer of chacogenide compound and cmos type structure |
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US20150118487A1 (en) * | 2013-10-25 | 2015-04-30 | Colin A. Wolden | Plasma-assisted nanofabrication of two-dimensional metal chalcogenide layers |
KR102144999B1 (en) * | 2013-11-05 | 2020-08-14 | 삼성전자주식회사 | Two-dimensional material, method of forming the same and device including two-dimensional material |
US9711396B2 (en) * | 2015-06-16 | 2017-07-18 | Asm Ip Holding B.V. | Method for forming metal chalcogenide thin films on a semiconductor device |
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TWI624558B (en) | 2018-05-21 |
US20170073812A1 (en) | 2017-03-16 |
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JP2017061743A (en) | 2017-03-30 |
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