SG10201605065QA - Opto-electronic modules, in particular flash modules, and method for manufacturing the same - Google Patents
Opto-electronic modules, in particular flash modules, and method for manufacturing the sameInfo
- Publication number
- SG10201605065QA SG10201605065QA SG10201605065QA SG10201605065QA SG10201605065QA SG 10201605065Q A SG10201605065Q A SG 10201605065QA SG 10201605065Q A SG10201605065Q A SG 10201605065QA SG 10201605065Q A SG10201605065Q A SG 10201605065QA SG 10201605065Q A SG10201605065Q A SG 10201605065QA
- Authority
- SG
- Singapore
- Prior art keywords
- modules
- opto
- manufacturing
- same
- particular flash
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Stroboscope Apparatuses (AREA)
- Exposure Control For Cameras (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161579293P | 2011-12-22 | 2011-12-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201605065QA true SG10201605065QA (en) | 2016-08-30 |
Family
ID=47563330
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201605065QA SG10201605065QA (en) | 2011-12-22 | 2012-12-18 | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
SG11201403240UA SG11201403240UA (en) | 2011-12-22 | 2012-12-18 | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201403240UA SG11201403240UA (en) | 2011-12-22 | 2012-12-18 | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US10431571B2 (zh) |
EP (1) | EP2795674B1 (zh) |
JP (1) | JP6338533B2 (zh) |
KR (1) | KR102177372B1 (zh) |
CN (1) | CN104106135B (zh) |
SG (2) | SG10201605065QA (zh) |
TW (1) | TWI590415B (zh) |
WO (1) | WO2013091829A1 (zh) |
Families Citing this family (41)
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TWI481496B (zh) * | 2007-12-19 | 2015-04-21 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
DE102011113483B4 (de) * | 2011-09-13 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement |
KR101888447B1 (ko) * | 2012-05-22 | 2018-08-16 | 엘지디스플레이 주식회사 | 유기 전계 발광 표시 패널의 제조 방법 |
US9608181B2 (en) * | 2012-12-20 | 2017-03-28 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules with masking feature for reducing the visibility of interior components |
CN104123179A (zh) * | 2013-04-29 | 2014-10-29 | 敦南科技股份有限公司 | 中断控制方法及其电子系统 |
TWI527166B (zh) * | 2013-07-25 | 2016-03-21 | The package structure of the optical module | |
US9496247B2 (en) * | 2013-08-26 | 2016-11-15 | Optiz, Inc. | Integrated camera module and method of making same |
KR102138510B1 (ko) * | 2013-08-27 | 2020-07-28 | 엘지전자 주식회사 | 근접 터치 기능을 구비한 전자 장치 및 그 제어 방법 |
WO2015030673A1 (en) * | 2013-09-02 | 2015-03-05 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element |
WO2015088442A1 (en) | 2013-12-10 | 2015-06-18 | Heptagon Micro Optics Pte. Ltd. | Wafer-level optical modules and methods for manufacturing the same |
EP2955759B1 (en) | 2014-06-11 | 2018-09-05 | ams AG | Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method |
US9711552B2 (en) * | 2014-08-19 | 2017-07-18 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
KR102309671B1 (ko) * | 2015-01-30 | 2021-10-07 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 및 조명 장치 |
US9606308B2 (en) | 2015-02-27 | 2017-03-28 | International Business Machines Corporation | Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow |
CN104916627B (zh) * | 2015-05-29 | 2019-05-03 | 鸿利智汇集团股份有限公司 | 一种手机拍照闪光灯 |
CN106200212A (zh) * | 2015-05-29 | 2016-12-07 | 高准精密工业股份有限公司 | 闪光灯装置 |
US20170047362A1 (en) * | 2015-08-13 | 2017-02-16 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic module with customizable spacers |
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US20200066957A1 (en) * | 2016-01-20 | 2020-02-27 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having fluid permeable channels and methods for manufacturing the same |
KR102473668B1 (ko) | 2016-03-02 | 2022-12-01 | 삼성전자주식회사 | 발광 소자 실장 기판 및 이를 이용한 발광 패키지 |
JP2017175004A (ja) | 2016-03-24 | 2017-09-28 | ソニー株式会社 | チップサイズパッケージ、製造方法、電子機器、および内視鏡 |
CN109155258B (zh) * | 2016-04-08 | 2022-04-26 | 赫普塔冈微光有限公司 | 具有孔径的薄光电模块及其制造 |
US10461066B2 (en) * | 2016-06-29 | 2019-10-29 | Maxim Integrated Products, Inc. | Structure and method for hybrid optical package with glass top cover |
US10551596B2 (en) | 2016-06-29 | 2020-02-04 | Ams Sensors Singapore Pte. Ltd. | Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same |
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EP2795674B1 (en) | 2021-12-15 |
WO2013091829A1 (en) | 2013-06-27 |
KR102177372B1 (ko) | 2020-11-12 |
EP2795674A1 (en) | 2014-10-29 |
CN104106135B (zh) | 2018-02-23 |
US10431571B2 (en) | 2019-10-01 |
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