SG10201507918SA - Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus - Google Patents

Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus

Info

Publication number
SG10201507918SA
SG10201507918SA SG10201507918SA SG10201507918SA SG10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA
Authority
SG
Singapore
Prior art keywords
heat treatment
substrate heat
treatment
storage medium
substrate
Prior art date
Application number
SG10201507918SA
Other languages
English (en)
Inventor
Higashi Koudai
Misaka Shinichiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201507918SA publication Critical patent/SG10201507918SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10201507918SA 2014-09-25 2015-09-23 Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus SG10201507918SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014195693 2014-09-25
JP2015098385A JP6382151B2 (ja) 2014-09-25 2015-05-13 基板熱処理装置、基板熱処理方法、記録媒体及び熱処理状態検知装置

Publications (1)

Publication Number Publication Date
SG10201507918SA true SG10201507918SA (en) 2016-04-28

Family

ID=55804324

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201507918SA SG10201507918SA (en) 2014-09-25 2015-09-23 Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus

Country Status (4)

Country Link
JP (1) JP6382151B2 (ko)
KR (1) KR102409752B1 (ko)
SG (1) SG10201507918SA (ko)
TW (1) TWI610387B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6683579B2 (ja) * 2016-09-26 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US10446423B2 (en) * 2016-11-19 2019-10-15 Applied Materials, Inc. Next generation warpage measurement system
KR102467605B1 (ko) 2017-06-28 2022-11-16 도쿄엘렉트론가부시키가이샤 열처리 장치, 열처리 장치의 관리 방법 및 기억 매체
JP7003759B2 (ja) * 2017-06-28 2022-01-21 東京エレクトロン株式会社 熱処理装置、熱処理装置の管理方法及び記憶媒体
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
JP6994424B2 (ja) * 2018-04-17 2022-01-14 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
JP7003260B2 (ja) * 2018-06-22 2022-01-20 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
JP2020035834A (ja) * 2018-08-28 2020-03-05 キオクシア株式会社 加熱処理装置および加熱処理方法
CN114518690A (zh) * 2020-11-19 2022-05-20 中国科学院微电子研究所 晶圆工作台、光刻机及晶圆工作台温度调节方法
CN114520172A (zh) * 2022-02-16 2022-05-20 北京北方华创微电子装备有限公司 晶圆放置状态检测方法、半导体工艺腔室和设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245142A (ja) * 1988-03-28 1989-09-29 Hitachi Ltd 予防保全装置
US5001423A (en) * 1990-01-24 1991-03-19 International Business Machines Corporation Dry interface thermal chuck temperature control system for semiconductor wafer testing
JP3581303B2 (ja) * 2000-07-31 2004-10-27 東京エレクトロン株式会社 判別方法及び処理装置
JP4059694B2 (ja) * 2002-03-27 2008-03-12 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US7427329B2 (en) * 2002-05-08 2008-09-23 Asm International N.V. Temperature control for single substrate semiconductor processing reactor
JP3781014B2 (ja) * 2003-03-31 2006-05-31 株式会社Ｓｕｍｃｏ シリコンウェーハ熱処理治具およびシリコンウェーハ熱処理方法
JP4259279B2 (ja) * 2003-10-28 2009-04-30 パナソニック株式会社 電子部品装着方法
JP2006120721A (ja) * 2004-10-19 2006-05-11 Toshiba Corp 基板処理装置
JP4444090B2 (ja) 2004-12-13 2010-03-31 東京エレクトロン株式会社 熱処理板の温度設定方法，熱処理板の温度設定装置，プログラム及びプログラムを記録したコンピュータ読み取り可能な記録媒体
JP4755498B2 (ja) * 2006-01-06 2011-08-24 東京エレクトロン株式会社 加熱装置及び加熱方法
JP4699283B2 (ja) * 2006-05-23 2011-06-08 東京エレクトロン株式会社 熱処理板の温度制御方法、プログラム及び熱処理板の温度制御装置
JP2008053454A (ja) * 2006-08-24 2008-03-06 Dainippon Printing Co Ltd ベーク装置およびベーク方法
US20090034582A1 (en) * 2007-08-02 2009-02-05 Tokyo Electron Limited Tbs Broadcast Center Apparatus for hot plate substrate monitoring and control
JP2009123816A (ja) * 2007-11-13 2009-06-04 Sokudo:Kk 熱処理装置および熱処理方法
JP5538050B2 (ja) * 2009-05-15 2014-07-02 シャープ株式会社 局所加熱装置、及び局所加熱する位置の調整方法
JP5299442B2 (ja) * 2011-01-18 2013-09-25 東京エレクトロン株式会社 基板加熱装置、基板加熱方法及び記憶媒体
FR2978870B1 (fr) * 2011-08-01 2016-11-18 Commissariat Energie Atomique Dispositif de localisation de points chauds avec des fluxmetres thermiques

Also Published As

Publication number Publication date
TWI610387B (zh) 2018-01-01
TW201626487A (zh) 2016-07-16
JP6382151B2 (ja) 2018-08-29
JP2016066779A (ja) 2016-04-28
KR102409752B1 (ko) 2022-06-17
KR20160036654A (ko) 2016-04-04

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