SG10201507918SA - Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus - Google Patents

Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus

Info

Publication number
SG10201507918SA
SG10201507918SA SG10201507918SA SG10201507918SA SG10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA SG 10201507918S A SG10201507918S A SG 10201507918SA
Authority
SG
Singapore
Prior art keywords
heat treatment
substrate heat
treatment
storage medium
substrate
Prior art date
Application number
SG10201507918SA
Inventor
Higashi Koudai
Misaka Shinichiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201507918SA publication Critical patent/SG10201507918SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG10201507918SA 2014-09-25 2015-09-23 Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus SG10201507918SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014195693 2014-09-25
JP2015098385A JP6382151B2 (en) 2014-09-25 2015-05-13 Substrate heat treatment apparatus, substrate heat treatment method, recording medium, and heat treatment state detection apparatus

Publications (1)

Publication Number Publication Date
SG10201507918SA true SG10201507918SA (en) 2016-04-28

Family

ID=55804324

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201507918SA SG10201507918SA (en) 2014-09-25 2015-09-23 Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus

Country Status (4)

Country Link
JP (1) JP6382151B2 (en)
KR (1) KR102409752B1 (en)
SG (1) SG10201507918SA (en)
TW (1) TWI610387B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6683579B2 (en) * 2016-09-26 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
US10446423B2 (en) * 2016-11-19 2019-10-15 Applied Materials, Inc. Next generation warpage measurement system
JP7003759B2 (en) * 2017-06-28 2022-01-21 東京エレクトロン株式会社 Heat treatment equipment, management method of heat treatment equipment and storage medium
KR102467605B1 (en) 2017-06-28 2022-11-16 도쿄엘렉트론가부시키가이샤 Heat treatment apparatus, method of managing heat treatment apparatus, and storage medium
JP6964005B2 (en) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 Heat treatment equipment, hot plate cooling method and computer-readable recording medium
JP6994424B2 (en) * 2018-04-17 2022-01-14 東京エレクトロン株式会社 Substrate processing equipment, substrate processing method, and storage medium
JP7003260B2 (en) * 2018-06-22 2022-01-20 東京エレクトロン株式会社 Substrate processing equipment, substrate processing method, and storage medium
JP2020035834A (en) * 2018-08-28 2020-03-05 キオクシア株式会社 Heat treatment apparatus and heat treatment method
CN114518690A (en) * 2020-11-19 2022-05-20 中国科学院微电子研究所 Wafer workbench, photoetching machine and wafer workbench temperature adjusting method
CN114520172A (en) * 2022-02-16 2022-05-20 北京北方华创微电子装备有限公司 Wafer placement state detection method, semiconductor process chamber and equipment

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245142A (en) * 1988-03-28 1989-09-29 Hitachi Ltd Preventive maintenance device
US5001423A (en) * 1990-01-24 1991-03-19 International Business Machines Corporation Dry interface thermal chuck temperature control system for semiconductor wafer testing
JP3581303B2 (en) * 2000-07-31 2004-10-27 東京エレクトロン株式会社 Discrimination method and processing device
JP4059694B2 (en) * 2002-03-27 2008-03-12 株式会社日立国際電気 Substrate processing apparatus and semiconductor device manufacturing method
US7427329B2 (en) * 2002-05-08 2008-09-23 Asm International N.V. Temperature control for single substrate semiconductor processing reactor
JP3781014B2 (en) * 2003-03-31 2006-05-31 株式会社Ｓｕｍｃｏ Silicon wafer heat treatment jig and silicon wafer heat treatment method
JP4259279B2 (en) * 2003-10-28 2009-04-30 パナソニック株式会社 Electronic component mounting method
JP2006120721A (en) * 2004-10-19 2006-05-11 Toshiba Corp Board processor
JP4444090B2 (en) 2004-12-13 2010-03-31 東京エレクトロン株式会社 Heat treatment plate temperature setting method, heat treatment plate temperature setting device, program, and computer-readable recording medium recording the program
JP4755498B2 (en) * 2006-01-06 2011-08-24 東京エレクトロン株式会社 Heating apparatus and heating method
JP4699283B2 (en) * 2006-05-23 2011-06-08 東京エレクトロン株式会社 Heat treatment plate temperature control method, program, and heat treatment plate temperature control device
JP2008053454A (en) * 2006-08-24 2008-03-06 Dainippon Printing Co Ltd Baking apparatus and baking method
US20090034582A1 (en) * 2007-08-02 2009-02-05 Tokyo Electron Limited Tbs Broadcast Center Apparatus for hot plate substrate monitoring and control
JP2009123816A (en) * 2007-11-13 2009-06-04 Sokudo:Kk Heat treatment apparatus, and heat treatment method
JP5538050B2 (en) * 2009-05-15 2014-07-02 シャープ株式会社 Local heating device and method for adjusting position for local heating
JP5299442B2 (en) * 2011-01-18 2013-09-25 東京エレクトロン株式会社 Substrate heating apparatus, substrate heating method, and storage medium
FR2978870B1 (en) * 2011-08-01 2016-11-18 Commissariat Energie Atomique HOT POINT LOCATION DEVICE WITH THERMAL FLUXMETERS

Also Published As

Publication number Publication date
KR102409752B1 (en) 2022-06-17
JP2016066779A (en) 2016-04-28
JP6382151B2 (en) 2018-08-29
TWI610387B (en) 2018-01-01
TW201626487A (en) 2016-07-16
KR20160036654A (en) 2016-04-04

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