SG10201504089SA - Wafer processing method - Google Patents
Wafer processing methodInfo
- Publication number
- SG10201504089SA SG10201504089SA SG10201504089SA SG10201504089SA SG10201504089SA SG 10201504089S A SG10201504089S A SG 10201504089SA SG 10201504089S A SG10201504089S A SG 10201504089SA SG 10201504089S A SG10201504089S A SG 10201504089SA SG 10201504089S A SG10201504089S A SG 10201504089SA
- Authority
- SG
- Singapore
- Prior art keywords
- processing method
- wafer processing
- wafer
- processing
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02076—Cleaning after the substrates have been singulated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014119409A JP2015233077A (ja) | 2014-06-10 | 2014-06-10 | ウエーハの加工方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201504089SA true SG10201504089SA (en) | 2016-01-28 |
Family
ID=54770175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201504089SA SG10201504089SA (en) | 2014-06-10 | 2015-05-25 | Wafer processing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150357242A1 (ja) |
JP (1) | JP2015233077A (ja) |
KR (1) | KR20150141875A (ja) |
CN (1) | CN105206571B (ja) |
SG (1) | SG10201504089SA (ja) |
TW (1) | TW201601210A (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9514925B1 (en) * | 2015-09-10 | 2016-12-06 | Amazon Technologies, Inc. | Protective coating for silicon substrate |
JP6731793B2 (ja) * | 2016-06-08 | 2020-07-29 | 株式会社ディスコ | ウェーハ加工システム |
JP6707292B2 (ja) * | 2016-10-14 | 2020-06-10 | 株式会社ディスコ | 積層チップの製造方法 |
US10363629B2 (en) * | 2017-06-01 | 2019-07-30 | Applied Materials, Inc. | Mitigation of particle contamination for wafer dicing processes |
JP7015668B2 (ja) * | 2017-10-11 | 2022-02-03 | 株式会社ディスコ | 板状物の分割装置 |
JP7175560B2 (ja) * | 2018-09-06 | 2022-11-21 | 株式会社ディスコ | ウェーハの加工方法 |
JP7154698B2 (ja) * | 2018-09-06 | 2022-10-18 | 株式会社ディスコ | ウェーハの加工方法 |
JP7282453B2 (ja) * | 2019-02-15 | 2023-05-29 | 株式会社ディスコ | ウェーハの加工方法 |
CN111063648A (zh) * | 2019-11-29 | 2020-04-24 | 力成科技(苏州)有限公司 | 一种晶圆胶膜无粘连分离工艺 |
KR102441184B1 (ko) * | 2020-07-15 | 2022-09-07 | 주식회사 기가레인 | 필름 교환이 용이한 전사 장치 및 필름 교환 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003007648A (ja) | 2001-06-18 | 2003-01-10 | Disco Abrasive Syst Ltd | 半導体ウェーハの分割システム |
JP2003188129A (ja) * | 2001-12-19 | 2003-07-04 | Okamoto Machine Tool Works Ltd | デバイスウエハのデバイス面保護構造 |
JP4296052B2 (ja) * | 2003-07-30 | 2009-07-15 | シャープ株式会社 | 半導体装置の製造方法 |
JP2008235650A (ja) * | 2007-03-22 | 2008-10-02 | Disco Abrasive Syst Ltd | デバイスの製造方法 |
KR20100032361A (ko) * | 2007-06-22 | 2010-03-25 | 덴끼 가가꾸 고교 가부시키가이샤 | 반도체 웨이퍼 연삭방법과 그에 이용하는 수지 조성물 및 보호 시트 |
JP2009224659A (ja) * | 2008-03-18 | 2009-10-01 | Disco Abrasive Syst Ltd | ワークの分割方法 |
JP2009231629A (ja) * | 2008-03-24 | 2009-10-08 | Sekisui Chem Co Ltd | 半導体ウエハの加工方法 |
JP2011129606A (ja) * | 2009-12-16 | 2011-06-30 | Furukawa Electric Co Ltd:The | 半導体ウエハの加工方法 |
JP2013008831A (ja) * | 2011-06-24 | 2013-01-10 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
US20130032519A1 (en) * | 2011-08-02 | 2013-02-07 | Bogdan Murawski | Biological sewage treatment device |
JP6047353B2 (ja) * | 2012-09-20 | 2016-12-21 | 株式会社ディスコ | 加工方法 |
-
2014
- 2014-06-10 JP JP2014119409A patent/JP2015233077A/ja active Pending
-
2015
- 2015-04-28 TW TW104113543A patent/TW201601210A/zh unknown
- 2015-05-25 SG SG10201504089SA patent/SG10201504089SA/en unknown
- 2015-05-27 KR KR1020150073758A patent/KR20150141875A/ko not_active Application Discontinuation
- 2015-06-01 CN CN201510292830.0A patent/CN105206571B/zh active Active
- 2015-06-10 US US14/735,888 patent/US20150357242A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20150141875A (ko) | 2015-12-21 |
CN105206571B (zh) | 2019-05-31 |
JP2015233077A (ja) | 2015-12-24 |
TW201601210A (zh) | 2016-01-01 |
CN105206571A (zh) | 2015-12-30 |
US20150357242A1 (en) | 2015-12-10 |
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